A spacecraft consists of a number of electronic packages to meet the desired functional requirements and in this, an electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. The modelling and analysis of printed circuit boards are carried out for accurate prediction of response due to vibration loads using finite element method. A prediction about the vibration response of space bounded satellite’s printed circuit board including the effect of component stiffness are coded using MatLab programming and the effect of contribution of component stiffness to the dynamic characteristics of PCB assembly is investigated. The analysis results are validated through vibration tests of PCB.