Interface characterization of Cu-Cu and Cu-Ag-Cu low temperature solid state bonds.

by: Dalbey, Robert Z.; Challenger, Kenneth D.

Publication date: 1987

Topics: Mechanical engineering, Interface Characterization, Auger Spectroscopy, Solid State Bonding, Diffusion Bonding, Scanning Electron Microscopy

Collection: navalpostgraduateschoollibrary; fedlink

Language: English

In this study, Auger Electron Spectroscopy (AES),
Scanning Electron Microscopy (SEM) and Energy Dispersive
X-ray (EDX) analysis have been used to characterize the
interface regions of copper to silver and copper to copper
bond samples in an effort to identify those parameters which
most affect the bond characteristics. Longitudinal and
transverse cross sections of the bond joint are examined.
Auger electron sputter depth profiling was used to examine
the interface properties and composition across the bond
interface. Depth profiles indicate carbon and oxygen
diffuse away from the interface during bonding facilitating
adhesion. Tensile tests on bonded samples indicate that
bond pressure has a more significant effect on bond strength
than temperature. A temperature threshold for bonding is
observed which is related to the ability of the bond
materials to scavenge their oxides. The difference in bond
strength/toughness for Cu-Cu bonds versus Cu-Ag-Cu bonds may
qualitatively indicate the magnitude of the chemical energy
term associated with joining these two dissimilar metals.