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Honeywell 



H316 
CIRCUIT MODULES AND PARTS 
INSTRUCTION MANUAL 



Doc. No. 70130072166AV 



Order No. M-494 



Honeywell 



SERIES 16 



H316 
CIRCUIT MODULES AND PARTS 
INSTRUCTION MANUAL 

Doc. No. 70130072166AV Order No. M-494 



November 1974 



COPYRIGHT © 1969, 1970, HONE YV^ELL INC. 

COPYRIGHT © 1971, 1972, 1973, 1974, HONEYWELL INFORMATION SYSTEMS INC. 



The information contained herein is the exclusive property 
of Honeywell Information Systems Inc., except as otherwise 
indicated, and shall not be disclosed or reproduced, in 
whole or in part, without explicit written authorization from 
the company. The distribution of this material outside the 
company may occur only as authorized. 



REVISION HISTORY 



New 






Number and New 




Revis ion 






Revision Level of 


Pages Affected 


Level of 


Change No. 


Effective Date 


Affected Drawings 


by Revision 


Manual 










E 


7690 


Jan. 1970 




vi, ix, 2-20, 
2-22, 2-23, 
2-45, 2-47, 
2-57, 2-58, 
3-20, 3-21 


C 


7759 


Feb. 1970 




1-67 


D 


8006 


Mar. 197 




1-67 


E 


8128 


June 197 




1-21, 1-23, 
1-25, 1-27, 
1-29, 1-31, 
1-33, 1-35, 
1-37 


F 


8356 


June 1970 


70022835E 
70022836E 
70022841C 


iv, vi, ix 

2-31 

2-33 

2-45 

2-47, 2-61, 

2-62 


G 


8451 


July 1970 




2-2 


H 


8684 


Sept. 1970 




Title page (de- 
leted), vii, viii, 
X, xi, xii (add- 
ed); 4-4, 4-8, 
4-9, 4-13, 
4-23, 4-24, 
4-27 - 4-31, 
4-32 (deleted); 
5-1 - 5-31 (add- 
ed) 



Publications Department, Field Engineering Division, Newton, MA 02161 



Printed in the United States of America 
All rights reserved 



REVISION HISTORY (Cont) 



New 






Number and New 




Revision 
Level of 


Change No. 


Effective Date 


Revision Level of 
Affected Drawings 


Pages Affected 
by Revision 


Manual 










J 


8704 


Nov. 1970 


A70022955D 
P70022955E 
B70022955E 

P70022970B 
A70022970B 


2-58 

2-58 

2-59, 2-60 

vi, X, xi, xii, 

2-47, 2-57 - 

2-59; 2-60 

(added) 

2-61 

2-62 


K 


9313 


Mar. 1971 




1-49. 1-50, 
1-51, 1-53 


L 


9375 


Apr. 1971 




2-49, 2-64 


M 


942 3A 


May 1971 


C70022843D 
C70022835F 
C70022836F 
C70022837B 
C70022838C 
C70022839E 
C70022840B 
C70022841C 
P70022841C 


2-1, 2-4, 2-5, 

2-10, 2-13 - 

2-28, 4-19, 

5-9 

2-29 

2-31 

2-33 

2-35 

2-37 

2-39 

2-41 

2-45 

2-47 


N 


9529A 


June 1971 




3-19, 3-21 


P 


9650 


July 1971 


C70022839E 


2-39 


Q 


9689 


July 1971 




1-1, 1-19, 
1-97 _ 1-103, 
3-1 - 3-44 


R 


9919 


Nov. 1971 


C70023327C 
C70023697C 


1-49 
1-50 
1-51, 1-53 


S 


10140 


Jan. 1972 




2-60 


T 


10189 


Feb. 1972 




vi thru X ; 
xi, xii added; 
4-1 thru 4-31; 
4-33 thru 4-77 
added; 5-1 thru 
5-30; 5-31 thru 
5-49 added 


U 


10218 


Mar. 1972 




2-52 


V 


10260 


Apr, 1972 


C70022838D 
70022841D 


V, 2-49, 2-o3 

thru 2-66; 2-67 

thru 2-73 added 

2-37 

2-45, 2-47 


w 


10229 


Apr. 1972 


7002341 2H 


3-9, 3-10 


Y 


20049 


June 19 72 


70023329E 
70023990B 


1-61 
1-62 
1-63 



REVISION HISTORY (Cont) 



New 

Revision 

Level of 

Manual 



/. 

AA 

AB 
AC 
AD 
AE 



AF 
AG 



AH 



AJ 



AK 

AL 

AM 
AN 



Change No. 



Z0593 
Z0707 

20085 
20328 
30090 
30110 



30136 

31471 



30795 



30216 

31273 

30996 

3 213 2 
30222 



Effective Date 



Sept. 1972 
Oct. 1972 

Dec. 1972 
Jan. 1973 
March 197 3 
April 1973 

May 1973 
Aug. 1973 



Sept. 1973 



Sept. 1973 

Oct. 1973 
Nov. 1973 

Jan. 1974 
Feb. 1974 



Number and New 
Revision Level of 
Affected Drawings 



Pages Affected 
by Revision 



A70032670C 

C70025464C 
C70025966B 



1-49, 1-51, 1-53, 1-61, 
1-67, 3-35 

4-1, 4-48, 4-65, 4-68, 
4-71, 4-72, 4-79 (added) 

4-13 

1-33 

4-68, 4-79 

1-19, 1-73 thru 1-76, 
1-77, 1-79, 2-5 2-27, 
2-43 (deleted), 3-31 thru 
3-33 

3-36, 3-38, 3-39. 
3-44 

1-97 thru 1-99 (added) 
1-101 thru 1-103 (added) 

CSM-150 Core Memory 
Module, 3-1 thru 3-62 
(added) 

Chapters IV and V 
(deleted)* 



C70032889B 


3-49 


C70032890C 


3-31 


C70032891B 


3-33 


C70032892B 


3-35 


C70032893B 


3-37 


C70032894B 


3-39 


C70032895B 


3-41 


C70032896B 


3-45 


C70032897B 


3-43 


C70032899B 


3-47 


C70050524B 


3-56 


70023412N 


4-3 thru 4-10 


(Sheets 1 thru 8) 




70023412N 


4-11 (added) 


(Sheet 9) 




C70032890C 


3-31 


D70033040B 


3-59 


C70032895C 


3-41 


C70032896C 


3-45 




Addendum added 


D70031961G 


Included in Rev. 


D70031976D 





AM 



;=Information contained in Chapters IV and V now appears in Document Number 70130072759, 
Order Number M-1532. 



REVISION HISTORY (Cont. ) 



New 

Revision 

Level of 

Manual 



Change No. 



Effective Date 



Number and New 
Revision Level of 
Affected Drawings 



Pages Affected 
by Revision 



AP 

AR 
AS 
AT 

AU 
AV 



40230 

40524 
40658 
40785 
40860 
41059 



July 1 974 

July 1 974 
Aug. 1974 
Sept. 1974 
Sept. 1974 
Sept. 1974 



D70030064Z 

D70023412P 
D70033040C 

P70050523C 



3-63 through 3-66 

added 

4-3 through 4-11 

3-59 

A-5, A-7 

3-53 

1-41 

3-57. 3-58 



CONTENTS 

Page 
CHAPTER I. PLUG-IN CIRCUIT MODULES 

SECTION 1. 

INTEGRATED CIRCUIT CHARACTERISTICS 1-1 

Specifications , 

Input Switching Thresholds j^j 

Output Logic Levels , _ , 

Temperature Range , , 

Power Supply Requirements it 

Fan-In Expansion Using Nodes 2_2 

Loading , ., 

Basic NAND Circuit 

Type F-01 NAND Gate 

Type F-03 Power Amplifier 

Type F-04 Flip-Flop 

Pulse Dodging J J 

DC Operation , / 

Control Inputs Used to Steer Clock Pulses i_-j 

Control Inputs Used as a Second Clock 1_9 

Control Inputs Used Directly to Set or Reset 1.9 

Input Loading , , , 

Output Drive Capability I-]] 

Circuit Delay , , , 

Clock and Control Input Timing Requirements i-H 

DC Input Timing Requirements j _ ;^ ^ 

Control Inputs , , , 
Maximum Allowable Clock Skew 



1-2 
1-3 
1-3 

1-4 



1-13 



Type F-Og Power Amplifier ^",0 

Type F- 19 Functional Logic Gate l'j4 

1-15 
1-16 



Type 930/961 NAND Gates 

Type 946/949 NAND Gates 

Type 936/937 Hex Inverter 

Type 932 Power Amplifier l-ll 

Type 944 Power Amplifier , w 

Type 962/963 Trip NAND Gates 

Type 03 2 Quad NAND Gates 



1-17 
1-17 



SECTION 2. 
MODULE DESCRIPTIONS I-19 



1-21 
1-27 
1-33 
1-39 



Columns 1-4 Module, Model CC-364A - 
Columns A-D Module, Model CC-365A 
Columns 9-12 Module, Model CC-366A 
Address Bus Module, Model CC-367 

Shift Register Module, Model CC-368 1I43 

Lamp Driver Module, Model CC-369B ;^ "49 

M Register Module, Model CC-370 1 cc 

Clock Module, Model CC-371 [ _ll 

Regulator Counter Module, Model CC-372 i.57 

Memory Timing Module, Model CC-373 I.73 

ASR Interface Module, Model CC-3 74 l"g2 

High Speed A-U No. 1 Module, Model CC-375 I'gg 

High Speed A-U No. 2 Module, Model CC-401 1 93 



Vll 



CONTENTS (Cont) 



Page 



Extended Address Module, Models CC-510A and CC-869 
Memory Parity Board, Models CC-558 and CC-6Z1 
Cable PAC, Model CC-672 
Cable PAC, Model CC-681 



1-97 
1-101 
1-105 
1-109 



CHAPTER II. CSM-160 CORE MEMORY MODULE 



SECTION 1. 
DESCRIPTION 



Z-i 



System Layout 
Logic Signal List 
Specifications 

Capacity 

Storage Mode 

Cycle Time 

Input Levels 

Output Levels 

Memory Cycle Timing 



i-l 
2-1 
2-3 
2-3 

2-4 
2-4 
2-4 
2-4 

2-4 



SECTION 2. 
PRINCIPLES OF OPERATION 



2-7 



Principles of Magnetic Core Memories 

Magnetic Core Storage 

Information Sensing 

Addressing 

Writing 
Core Stack Configuration 
Addressing and Selection 

Addressing-Random Access 

Decoding and Selection 
Timing and Control 
Operating Modes 

Read-Regenerate Mode 

Clear -Write Mode 
Interface Timiing 
Memory Retention 
Interference from Magnetic Field 



2-7 

2-7 

2-10 

2-11 

2-12 

2-12 

2-12 

2-12 

2-13 

2-13 

2-13 

2-13 

2-16 

2-16 

2-16 

2-17 



SECTION 3. 
MAINTENANCE 



2-19 



Tools and Test Equipment 

Recommiended Spare Parts 

PAC Handling and Repair Procedures 

Inserting and Removing System PACs 

PAC Troubleshooting 

Component Checking 

Com.ponent Replacement 
Maintenance Inspection 



2-19 
2-19 
2-19 
2-19 
2-19 
2-19 
2-19 
2-20 



Vlll 



CONTENTS (Cont) 



Page 



Preventive Maintenance Procedure 2-ZO 

Memory Drive and Inhibit Voltage Calibration 2-21 

Strobe Timing Calibration 2-21 

Corrective Maintenance Procedures 2-21 

Magnetic Core Stack Maintenance 2-22 

Sense Windings 2-22 

Drive Windings 2-24 

Inhibit Windings 2-24 



SECTION 4. 
LOGIC BLOCK DIAGRAMS 2-27 



SECTION 5. 

MEMORY PAC DESCRIPTIONS 2-47 

Inhibit (x-PAC, Models CM-305/CM-488 2-49 

Selector |j.-PAC, Models CM-306/CM-640 2-53 

Sense Amplifier |ji-PAC, Models CM-363A/CM-489A/CM-734/CM-735 2-57 

Sense Amplifier ^i-PAC, Models CM-363B/CM-489B/CM-734/CM-735 2-61 

Resistor [x-PAC, Model CM-384A 2-65 

NAND Type 1 PAC, Model DI-335 2-67 

Extender PAC, Model XP-330 2-71 



CHAPTER m. CSM-150 CORE MEMORY MODULE 



SECTION 1. 
INTRODUCTION 3-1 



General Description 3_1 

Physical Description 3-1 

Electrical Design 3-1 

Specifications 3_2 

General 3-2 

Physical 3_2 

Environinent 3_2 

Power 3-2 

Interface 3_3 

Data Retention 3_3 

Parity 3_4 



SECTION 2. 

OPERATING PROCEDURES 3,5 

Operating Modes 3.5 

Adjustments and Limitations 3_5 

Adjustments 3.5 

Limitations 3.5 

Signals 3_6 

Address Interface Signals 3-6 

Data Interface Signals 3_£, 

Timing and Control Interface Signals 3-6 



IX 



CONTENTS (Cont) 

Page 

SECTION 3. 
FUNCTIONAL THEORY OF OPERATION 3-8 



Basic Operation 3-8 

Functional Elements 3-8 

Storage Array 3-8 

Selection Interface Circuits 3-9 

Write or Regenerate Interface Circuits 3-9 

Read Interface Circuits 3-9 

Timing and Control Circuits 3-9 

Parity Logic 3-10 



SECTION 4. 
DETAILED THEORY OF OPERATION 3-11 



Storage Element 3-11 

Storage Array and Addressing 3-12 

Selection Circuits 3-13 

Data Loop 3-14 

Read Data Path 3-14 

Write Data Path 3-15 

Timing and Control 3-15 

Address and Current Timing 3-16 

Data Loop Timing 3-16 

Parity Logic 3-16 

Timing Diagrams 3-18 



SECTION 5. 
INSTALLATION 3-19 



Tools and Test Equipment 3-19 

Space and Environment 3-19 

Interface Considerations 3-19 

Installation Procedures 3-19 

Unpacking, Repacking and Reshipping 3-19 

Mechanical Procedures 3-20 

Electrical Checkout Procedure 3-20 



SECTION 6. 
MAINTENANCE 3-21 



Equipment Configuration 3-21 

Mechanical Assemblies 3-21 

Module Location 3-21 

Operator Maintenance 3-21 

Standard Maintenance 3-21 

Tools and Test Equipment 3-21 

Preventive Maintenance 3-22 

Adjustment 3-22 

Removal and Replacement 3-23 



CONTENTS (Cont) 



SECTION 7. 
TROUBLESHOOTING 



Page 



3-24 



General Procedures 

Specific Procedures 

Module Inter changeability- 
Core Memory Test Program 
Control Panel Debugging 
Waveform Checks 

Core Plane Troubleshooting 

Sense - Inhibit Windings 
Drive Windings 
Troubleshooting Table 
Cable Information 



3-24 
3-24 
3-24 
3-24 
3-24 
3-25 
3-25 
3-25 
3-26 
3-26 
3-27 



SECTION 8. 
REFERENCE DATA 



3-28 



SECTION 9. 
LOGIC BLOCK DIAGRAMS 



3-30 



SECTION 10. 
MEMORY PAC DESCRIPTIONS 



3-51 



Integrated Circuit Descriptions 
Recommended Spare Parts 
Address Board, Model CM-866 
Data Board, Model CM-867 
CSM-150 Core Plane 



3-51 
3-51 
3-51 
3-55 
3-55 



CHAPTER IV. MAINFRAME ILLUSTRATED PARTS BREAKDOWN 



General 

Equipment Coding 

Methods of Use 

Parts Procurement Guide 



4-1 
4-1 
4-1 
4-2 



APPENDIX A. 
AULT POWER SUPPLIES 



A-1 



APPENDIX B. 
ACME POWER SUPPLIES 



B-1 



ADDENDUM 
TYPE 316/716 POWER DISTRIBUTION UNIT 



ILLUSTRATIONS 



Figure/LBD 



1-1-1 
1-1-2 
1-1-3 
1-1-4 

1-1-5 

1-1-6 

1-1-7 

1-1-8 

1-1-9 

1-1-10 

1-1-11 

1-1-12 

1-1-13 
1-1-14 

1-1-15 

1-1-16 

1-1-17 

1-1-18 

1-1-19 

1-1-20 

1-1-21 

1-2-1 

1-2-2 

1-2-3 

1-2-4 

1-2-5 

1-2-6 

1-2-7 

1-2-8 

1-2-9 

1-2-10 

1-2-11 

1-2-12 

1-2-13 

1-2-14 

1-2-15 

1-2-16 

1-2-17 

1-2-18 

1-2-19 

1-2-20 

1-2-21 

1-2-22 

1-2-23 

1-2-24 

1-2-25 
1-2-26 

1-2-27 
1-2-28 
1-2-29 
1-2-30 



Page 

Switching Thresholds 1-2 

F-01 Dual NAND Gate 1-3 

F-03 Power Amplifier 1-3 

Type F-04 Flip-Flop Logic Symbol and 1-4 

Equivalent Logic Circuit 

Double-Rank Flip-Flop Pulse Dodging, 1-5 

Timing Diagram 

DC Operation 1-6 

Control Inputs Used to Gate Clock Pulses 1-7 

Control Inputs Used as a Second Clock 1-9 

Control Inputs Used Directly to Set or Reset 1-10 

Flip-Flop Input Pulse Requirements 1-12 

DC Set and Reset Input Signal Requirements 1-12 
Timing Requirements for Control Inputs, Using 1-12 

Clock Triggering 

Allowable Clock Skew, Logic and Timing 1-13 

Type F-09 Power Amplifier Equivalent 1-14 

Logic Symbol 

F-19 Logic Symbol 1-14 

930/961 Dual NAND Gates 1-15 

946/949 Quad NAND Gates 1-15 

936/937 Hex Inverter 1-16 

932/944 Power Amplifiers 1-16 

962/963 Trip NAND Gates 1-17 

03 2 Quad NAND Gate 1-17 

Columns 1-4 Module Parts Location 1-22 

Columns 1-4 Module Schematic Diagrami 1-23 

Columns A-D Module Parts Location 1-28 

Columns A-D Module Schem.atic Diagram 1-29 

Columns 9-12 Module Parts Location 1-34 

Columns 9-12 Module Schematic Diagram 1-35 

Address Bus Module Parts Location 1-40 

Address Bus Module Schematic Diagram 1-41 

Shift Register Module Parts Location 1-44 

Shift Register Module Schematic Diagram 1-45 

Lamp Driver Module Parts Location 1-50 

Lamp Driver Module Schematic Diagram 1-51 

M Register Module Parts Location 1-56 

M Register Module Scheinatic Diagram 1-57 

Clock Module Parts Location 1-62 

Clock Module Schematic Diagrani 1-63 

Regulator Counter Module Parts Location 1-68 
Regulator Counter Module Schematic Diagram 1-69 

Memory Timing Module Parts Location 1-75 

Memory Timing Module Schematic Diagram 1-77 

ASR Interface Module Parts Location 1-83 

ASR Interface Module Schematic Diagram 1-85 

High Speed A-U No, 1 Module Parts Location 1-90 

High Speed A-U No. 1 Module Schematic 1-91 

Diagram 

High Speed A-U No. 2 Module Parts Location 1-94 

High Speed A-U No. 2 Module Schematic 1-95 

Diagram 

Extended Address Module, Model CC-510A 1-98 

Extended Address Module, Model CC-869 1-99 

Memory Parity Board, Model CC-558 1-102 

Memory Parity Board, Model CC-621 1-103 



xii 



ILLUSTRATIONS (Cont) 

Figure/LBD Page 

1-2-31 Cable PAC, Model CC-672, Schematic 1-106 

Diagram 

1-2-32 xModel CC-672 Parts Location 1-107 

1-2-33 Cabl-^ PAC, Model CC-681, Schematic 1-110 

Diagram 

1-2-34 Model CC-681 Parts Location 1-111 

2-1-1 Stack Coding Diagram l-L 

Z-l-Z Interface Timing Requirements for all Units 2-5 

2-2-1 Ferrite Core Hysteresis Loop 2-8 

2-2-2 Core Control Windings 2-9 

2-2-3 Coincident-Current Selection 2-10 

2-2-4 Address Decoding and Selection, Simplified 2-14 

Block Diagram 

2-2-5 Decoding and Selection Matrix, Simplified 2-15 

Schematic 

2-2-6 Regeneration Loop, Simplified Diagram 2-17 

80.00 CSM- 160 and H-3 16 Memory Timing Control 2-29 

80.01 CSM-160, ICM-160 and H-316 Memory X 2-31 

Selection Sinks and Switches 

80.02 CSM-160, ICM-160 and H-316 Memory Y 2-33 

Selection Sinks and Switches 

80.03 CSM-160, ICM-160 and H-316 Memory X and 2-35 

Y Selection Diode Matrix 

80.04 CSM-160, ICM-160 and H-316 Memory 2-37 

Sense Amplifiers 

80.05 CSM-160, ICM-160 and H-316 Memory 2-39 

Inhibit Drivers 

80.06 H-316 Memory 1 X 3 Connector Wiring 2-41 
80.08 H-316 Memory PAC Complement and 2-43 

Allocation 

1 Inhibit IJ.-PAC, Models CM-305/CM-488 2-50 

Parts Location 

2 Inhibit [i-PAC, Models CM-305/CM-488 2-51 

Schematic Diagram and Logic Symbol 

1 Selector n-PAC, Models CM-3 06/CM-640, 2-55 

Parts Location 

2 Selector |j,-PAC, Model CM-306, Schematic 2-56 

Diagram and Logic Symbol 

1 Sense Amplifier |i-PAC, Models CM-363A/ 2-58 

CM-489A, CM-734/CM-735, Parts Location 

2 Sense Amplifier |a- PAC, Models CM-363A/ 2-59 

CM-734, Schematic Diagram and 
Logic Symbol 

3 Sense Amplifier p_-PAC, Models CM-489A/ 2-60 

CM-735, Schematic Diagram and 
Logic Symbol 

1 Sense Amplifier \i-FAC, Models CM-363B/ 2-62 

489B/734/735, Parts Location 

2 Sense Amplifier (i-PAC, Models CM-363B/ 2-63 

734, Schematic Diagram and Logic Symbol 

3 Sense Amplifier (i-PAC, Models CM-489A/ 2-64 

735, Schematic Diagram and Logic Symbol 

1 Resistor iJ,-PAC, Model CM-384A, 2-65 

Parts Location 

2 Resistor (x-PAC, Model CM-384A, 2-66 

Schematic Diagram 



xin 



ILLUSTRATIONS (Cont) 



Fi; 


gure/ 


LBD 


D] 


:-335- 


■1 


D] 


[-335- 


•2 


DI-335- 


■ 3 


XP-330 


-1 


3- 


■4-1 




3- 


■ 4-2 




3- 


■ 4-3 




3- 


-4-4 




3- 


-4-5 




3- 


-4-6 




3- 


-4-7 





Pane 



NAND Type 1 PAC, Schematic Diagram and 2-68 

Logic Symbol 

NAND Type 1 PAC, Parts Location 2-69 

NAND Type 1 PAC, Gates Used in Parallel 2-70 

Extender PAC 2-71 

Ferrite Core B-H Characteristics 3-11 

Two-Bit, 4-Word, 3D, 3-Wire Core Array 3-12 

Two-by-Two Bipolar Diode Matrix 3-13 

Selection Sv/itches 3-14 

Read Data Circuits 3-14 

Inhibit Circuit 3-15 

Parity Generation and Register Logic 3-17 

8101 CSM- 150 Memory Timing and Control, 3-31 
CSM-866 Address Board, Slot 2 

8102 CSM-150 Memory Y-Selection, CM-866 3-33 
Address Board, Slot 2 

8103 CSM-150 Memory X-Selection, CM-866 3-35 
Address Board, Slot 2 

8104 CSM-150 Memory Data Bits 1 through 16, 3-37 
CM-867, Slots 5 and 6 

CSM-150 Memory Parity, CM-867, Slots 5 and 6 3-39 

CSM-150 Memory Interface Timing 3-41 

CSM-150 Memory Internal Timing Diagram 3-43 

CSM-150 Memory 1x3 Connector Wiring 3-45 

CSM-150 Memory PAC Complement/Allocation 3-47 

CSM-150 Memory Block Diagram 3-49 

Address Board, Model CM-866, Assembly 3-52 

Data Board, Model CM-867, Assembly 3-56 

Simplified Schematic Diagramof the CSM-150 3-59 

Core Plane 

Interface Connections of the CSM- 150 Core Plane 3-60 

Logic and Option Drawer Assembly 3-63 

H316 General Purpose Computer, Rack-Mounted 4-14 

Model, Type 316-01 
H316 General Purpose Computer, Rack-Mounted 4-16 

Model, Types 316-0100 and 316-0110 

H316 General Purpose Computer, Table Top 4-18 

Model, Type 316-01 

4-4 H316 General Purpose Computer, Table Top 4-20 

Model, Types 316-0100 and 316-0110 

4-5 Control Panel, Type 316-01 4-22 

4-6 Control Panel, Types 3 16-0 1 00 and 3 16-0 1 1 4-24 

4-7 Chassis Assembly, Type 316-01 4-26 

4-8 Chassis Assembly, Types 3l6-0100and3l6-0110 4-28 

4-9 Mainframe Logic and OptionDrawer Assembly, 4-30 

Type 316-01 

4-10 Mainframie Logic and Option Drawer Assembly, 4-32 

Types 316-0100 and 316-0110 

4-11 CSM-160 Core Memory Unit, Types 316-01, 4-34 

316-0100, and 316-0110 

4-12 CSM-150 Core Memory Unit, Types 316-01 4-36 

316-0100, and 316-0110 

4-13 Logic Module Layout 4-38 

4-14 Cable Block Diagram 4-40 

4-15 Cable Assembly, Power, Electrical, 4-41 

Type 316-01 

4-16 Cable Assembly, Power, Electrical, 4-42 

Types 316-0100 and 316-0110 









8105 








8110 








8111 








8112 








8113 








8114 


3- 


■10- 


-1 




3- 


-10- 


-2 




3- 


-10- 


-3 




3- 


-10- 


-4 




3- 


-10- 


-5 




4- 


-1 






4. 


-2 






4. 


-3 







XIV 



ILLUSTRATIONS (Cont) 

Figure/LBD Pa^e 

4-17 Cable Assembly, Power, Electrical 4-43 

Types 316-01, 316-0100 and 316-0110 

Panel Cable No. 1, Type 316-01 
4-19 Cable Assembly, Special Purpose, Control 4-45 

Panel Cable No. 1, Types 316-0100 and 

316-0110 
4-20 Cable Assembly, Special Purpose, Control 4-46 

Panel Cable No. 2, Type 316-01 
4-21 Cable Assembly, Special Purpose, Control 4-47 

Panel Cable No. 2, Types 316-0100 and 

316-0110 
4-22 Cable Assembly, Special Purpose, fi-PAC 4-48 

to tj.-PAC, for Types 316-01, 316-0100, 

and 316-0110 



TABLES 



2-1-1 Logic Signal List 2-3 

2-3-1 Tools and Test Equipment 2-20 

2-3-2 Operational Failures 2-23 

2-3-3 Partial Word Failures 2-23 

2-3-4 Address, Decoding, and Selection Failur es 2-23 

2-3-5 Sense Winding Check List 2-Z5 

2-3-6 Inhibit Winding Check List 2-26 

3-1-1 Current Requirements 3-3 

3-1-2 Operating Limits of Temperature -Compensated 3-3 

15 VDC Supply 

3-2-1 Operating Modes 3-5 

3-5-1 Installation Tools and Test Equipment 3-19 

3-6-1 Troubleshooting and Maintenance Tools 3-21 

and Test Equipment 

3-6-2 Memory Strobe Test Modes 3-23 

3-7-1 Troubleshooting Memory Failures 3-26 

3-iO-l Address Board, Model CM-866, Parts List 3-53 

3-10-2 Data Board, Model CM-867, Parts List 3-57 

4-1 Figure Number Cross Reference 4-13 



PREFACE 



This instruction manual provides complete descriptive and reference material for the 
circuit modules and parts used in the H316 General Purpose Computer manufactured by 
Honeywell Inc., Framingham, Massachusetts. Three types of H3 16 connputers are manu- 
factured: Types 316-01, 316-0100, and 316-0110. The differences among the three are, 
for the most part, mechanical and, unless specifically stated, the parts for the three are 
the same. Options are documented in separate manuals. 

This manual is divided into four chapters: Chapter I contains technical specifications, 
microcircuit characteristics, and individual assembly illustrations and parts listings for 
the logic modules. Chapters II and III provide instructions for proper operation and main- 
tenance of the CSM-160 and CSM-150 core memories, respectively, and associated PAC 
logic modules. A detailed illustrated parts breakdown is presented in Chapter IV as an aid 
to service personnel in identification and procurement of replaceable parts including 
assemblies and con:iponents . 



NOTICE 

All H316 power supply information, formerly pre- 
sented in this publication as Chapters IV and V, now 
appears as Appendices A and B in this document for 
this printing only. The power supply information 
will appear in Document Number 70130072759, 
Order Number M-1532, as of January 1974. 



XVI 



CHAPTER I 
PLUG- IN CIRCUIT MODULES 



This chapter contains specifications for integrated circuit plug-in devices used 
throughout the H316 General Purpose Computer, Section 1 contains the information 

v^ k«^«7*^t *.w **AvCg^ utCU (^^rCUXL CXldi a.v,i.crxo Lx^-o <ia a ut^lctt-CU WlLli LIIC lUglC niULLUJ-C aUDclS S elTjblieS . 

Section 2 contains detailed assembly and schematic drawings and parts listings for each 
logic circuit module type. 

SECTION 1 
INTEGRATED CIRCUIT CHARACTERISTICS 



This section contains general specifications and detailed technical data for the 
integrated circuits used on the H316 logic modules, 

SPECIFICATIONS 

All performance specifications are guaranteed based on worst-case tolerances. 
Actual performance will invariably exceed these specifications. The following specifica- 
tions apply to all circuit types . 

Input Switching Thresholds 

The following definitions apply to all electronic signals. A "passive" signal is 

defined as a signal that denotes voltage potential between +2. 5 volts and +V . An "active" 

cc 
signal is defined as a signal that denotes potential between volt and +0. 95 volts. Figure 1-1-1 

defines the switching thresholds of the circuits. An "active" input applied to a gate will 

guarantee a "passive" output. If a "passive" signal is simultaneously applied to all inputs 

of a NAND gate, the output is guaranteed to be "active." 

Output Logic Levels (for all circuit types) 

Active Levels; to 0. 5 volts 
Passive Levels: 3.5 to 6,3 volts 

Temperature Range 

Operating {case temperature): 0°C to +80°C 
Storage: -65''C to +150"'C 



1-1 



PASSIVE 




ACTIVE 





■ VCC 



+ 2.5v(mox) 
+l.5v(typ) 

+l.2v(fyp) 
+0.95v(min) 

0.0V 



WORST CASE 

SWITCHING 

AMBIGUITY 



Figure 1-1-1. Switching Thresholds 



Power Supply Requirements 

Nominal: 
Operating Range: 
Absolute Maximum Rating: 



+5. 5V to +6. OV 
+5. 1 to +6. 3V 
+8. OV 



Fan-In Expansion Using Nodes 

Many of the integrated circuits have expansion nodes available on gate inputs allowing 
input gating expansion by connecting discrete diodes. As many as twenty silicon diodes 
may be connected to one node without degrading dc performance. However, there is 
degradation in the turn -on delay as the stray capacitance on the node point is increased. 
This delay increase amounts to 1 . 5 nanoseconds per picofarad of added capacitance. 

Loading 

Loading and drive specifications are expressed in terms of current (milliamperes). 
Input load current is the amount of current that the driving source must sink when the 
source is active. A passive drive source is not required to sink or supply current except 
for minor amounts of leakage. 

Basic NAND Circuit 

All NAND gates are ground-emitter, inverter annplifiers. All inputs are diode- 
buffered, and the output is the voltage of a saturated transistor when it is in the active 

state. The following circuits have an internal resistor to V connected to the collector 
=> cc 



1-2 



of each output: 930, 961, 946, 949, 936, 937, 962, 963, and F- 19 (excluding circuit C). 
The F-04 flip-flops also have resistors to V . The following contain total pole circuits which 
provide a low drive impedance when the circuits go from the active to passive state: 
F-03, F-09, 932, F-19 (circuit C only). The following circuits have open collectors; 
F-01, 944, and 032. All outputs are protected so that accidental grounding of an output 
will not cause circuit damage. 

When all inputs to a NAND gate have passive signals applied, the output will be 
active. If any one input to a NAND gate is active, the output will be passive. 

TYPE F-01 NAND GATE (CCD 70 950 100 001) 

The F-01 dual NAND gate (Figure 1-1-2) has two 3-input gates, each with an input node 
and a separate kilohm load resistor which is connected to +V 



, 7 



INPUTS 



NODE 



10 



V 

y^ OUTPUT 



-LOAD 




Figure 1-1-2. F-01 Dual NAND Gate 



PINII-GROUND 
PIN 4--f-Vec 



Specifications 

Input Loading: 
Output Drive: 
Circuit Delay: 



2.0 mA 

23.0 mA 

30 ns (max) nneasured at 1.5V level with 75 pF 
stray capacitance 



TYPE F-03 POWER AMPLIFIER (CCD 70 950 100 003) 

The F-03 power amplifier niicrocircuit (Figure 1-1-3) has two 3-input inverter ampli'^ 
fiers with nodes for input gating expansion. The power amplifier circuit is logically 
equivalent to the F-01 gate but has twice the dc drive and three times the ac drive capability. 



INPUTS' 



NODE- 



1 


"X 


6 


^ 


z 


\^ 


7 




14 


r OUTPUT 


..a. 

NODE— ^ 




^ 


y 


3 












PIN II -GROUND 








PIN 4 — -(.VCC 



Figure 1-1-3. F-03 Power Amplifier 



1-3 



specifications 

Input Loading: 
Output Drive: 
Circuit Delay: 



4.0 mA 

50.0 mA 

30 ns (max) measured at 1.5V level with 250 pF 
stray capacitance 



TYPE F-04 FLIP-FLOP (CCD 70 950 100 004) 

The standard ^Jl-PAC integrated circuit flip-flop, type F-04, is a double-rank, J-K 
flip-flop with dc set and reset capability. Figure 1-1-4 shows the logic symbol and equivalent 
logic circuit. 





OC SET 




DC SET ■ 


SET 


CONTROL - 


SET 


CONTROL - 




CLOCK 


RESET 


CONTROL 


RESET 


CONTROL 




OC RESET - 




DC RESET - 




DC RESET - 


A. LOGIC SYMBOL 



-13-^| 






10 


2 




-7 -► 


12 


-»-¥ 




-s-». 





SET OUTPUT 



RESET OUTPUT 



NOTE ; PIN II IS CONNECTED 
TO GROUND AND PIN 4 IS 
CONNECTED TO +Vcc. 




SET OUTPUT 



RESET OUTPUT 



B. EQUIVALENT LOGIC CIRCUIT 



Figure 1-1-4. Type F-04 Flip-Flop Logic Symbol and 
Equivalent Logic Circuit 



1-4 



The clock gate portion of the flip-flop is composed of the clock and the set and reset 
control inputs. The control inputs are energized by passive signals. A positive pulse on 
the clock will cause the flip-flop to assume the state determined by the condition of the 
control inputs. With J-K circuitry, no combination of the control input signals can cause 
an ambiguous state. 

The set and reset control inputs may be used as f oUovi^s . 

a. To gate clock pulses 

b. As direct set and reset inputs 

c. As another clock input when a set and a reset control are tied together. 

For do operation, voltage levels are used on the dc inputs. Signals applied to the 
dc set and reset inputs take precedence over any ac gating. However, output spikes may 
occur when the reset clock gate is activated during a dc set, or vice-versa. Such ppikes 
can be eliminated by tying the dc set input to a reset control input and tying the dc reset 
input to a set control input. 

Pulse Dodging 

The flip-flop utilizes the double-rank technique of pulse dodging (Figure 1-1-5). When 
the clock input makes the positive transition, the state of the input flip-flop is fixed and 
data transfer fronn the input flip-flop to the input of the output flip-flop is inhibited. On 
the negative transition of the clock input, data from the input flip-flop is shifted to the 
output flip-flop and the inputs to the input flip-flop are inhibited. Thus the clock provides 
intrinsic pulse dodging by means of trailing edge triggering. This feature permits strobing 
of the flip-flop output with input triggering signals. 



r 



CLOCK O 1 — » 



INPUT FF 



NTE6RATED CIRCUIT FLIP-FLOP 



n 



OUTPUT FF 



-O SET OUTPUT 



-O RESET OUTPUT 



J 



CLOCK < '^^ 

■ ov- 



INPUT FF 



OUTPUT FF • 



ov- 

Vcc 

ov- 



Figure 1-1-5. Double -Rank Flip -Flop Pulse Dodging, 
Timing Diagram 



1-5 



DC Operation 

If either dc set goes to ground, the flip-flop will assume the set state; if any dc reset 
goes to ground, the flip-flop will assunne the reset state. If both a dc set and a dc reset go 
to ground at the same time, both the set and the reset outputs will be ambiguous. Figure 
1-1-6 contains diagrams and equations describing this mode of flip-flop operation. 



A,) 


LOGIC OIASRAM 
DC SET^ 












S|0 — 
=,° — 


















— SET Output 

— O RESET OUTPUT 




1 


' R| O 


-» 








DC RESET / 


RjO— 









B) Truth Table and Boolean Equations 

S^- AND result of the dc set inputs . S = S • S, 

Rj-^- AND result of the dc reset inputs 

F - state of the flip-flop (set output) 
F' - previous state of the flip-flop 



^D - ^1 ■ ^2 ■ ^3 



Sd 


^D 


F 


ov 


OV 


(Condition not allowed, 
be ambiguous .) 


Output will 


ov 


V 
cc 


Set 




V 
cc 


OV 


Reset 




V 
cc 


V 
cc 


F' (no change) 

F = R^ (Sj3 + F') 





C) TIMING DIAGRAM 



DC SET 






DC RESET< <== 



SET y"Vcc 
OUTPUT\ov 



RESEt/Vcc I 

OUTPUT^^ov L 



"L^ 



Figure 1-1-6. DC Operation 



1-6 



Control Inputs Used to Steer Clock Pulses 

If Vcc is applied to both the set controls (Sq) and the reset controls (Rq), the flip-flop 
will be complemented by the application of a clock pulse. If only Sp or Rp is at Vcc, the 
state of the flip-flop will be a set or reset, respectively, after the clock is energized. If 
both S^ and R are at ground, the flip-flop will remain in its previous state. One restriction 
is that when a control input is used to gate the clock, the control input cannot make a negative 
transition while the clock is a ONE. Figure 1-1-7 contains diagrams and equations describing 
this mode of flip-flop operation. 



A) LOGIC DIAGRAM 




SET OUTPUT 



RESET 
CONTROL 



ALL DC SET AND RESET 
INPUTS MUST BE LOGIC ONES. 



B) Truth Table and Boolean Equations 

S„ - AND result of the set control inputs, 

R^ - AND result of the reset control inputs, R 

F' - previous state of the flip-flop 

F - state of the flip-flop after the clock pulse 



S^=sj 



'"l • ^^2 



s 


R 


F" 


F 




ov 
ov 


OV 
OV 


OV 
Vcc 


OV 
Vcc 


NO CHANGE 


ov 
ov 


Vcc 
Vcc 


OV 
Vcc 


OV 
OV 


RESET 


Vcc 
Vcc 


OV 



OV 
Vcc 


Vcc 
Vcc 


SET 


Vcc 
Vcc 


Vcc 
Vcc 


OV 
Vcc 


Vfcc 
OV 


COMPLEMENT 



S^F' +R^F' 



557 



Figure 1-1-7. Control Inputs Used to Gate Clock Pulses (Sheet 1 of 2) 



1-7 



(C) TIMING DIAGRAMS 

(I) COMPLEMENTING 



SET CONTROL \ qV 



RESET CONTROL 



CLOCK 



/■Vcc- 

Vov 



/■Vcc r 
vov — ' 



SET OUTPUT {^o"- 



(2) SET 



SET CONTROL 



/Vcc 

vov- 

/Vcc 



CLOCK \0V' 

/Vcc 

SET OUTPUT \0V. 



RESET CONTROL \0V. 



(3) RESET 



SET CONTROL 



CC 

ov- 



RESET CONTROL 



CLOCK 



CC 
OV- 



\ 

\ 

/Vcc 
»UT \ 



Vcc 
V 

:c 
OV 



SET OUTPL 

(4) NO CHANGE 



SET CONTROL 
RESET CONTROL 
CLOCK 

SET OUTPUT 
99S 



/Vcc 

Vov. 

\ 



CC 

OV- 



/Vcc r 
X OV — ' 

/Vc 
\ 0\ 



'cc- 
)V 



CONDITION 



-/ J- 



-f h- 



s~\ ri 



r-u J 



CONDITION 2 



Figure 1-1-7. Control Inputs Used to Gate Clock Pulses (Sheet 2 of 2) 



1-8 



Control Inputs Used as a Second Clock 

A set and a reset control can be tied together and used as another clock input. In 
this case, the resultant clock is the ANDed result of both clocks. Figure 1-1-8 contains dia- 
grams describing this mode of flip-flop operation. 



A. LOGIC DIAGRAM 



CLOCK O- 



SECOND CLOCK O- 



< 



SET OUTPUT 



ALL DC SET AND RESET 
INPUTS MUST BE AT V^^ 

THE UNUSED SET AND RESET 
CONTROL INPUTS ARE AT V-. 
IN THIS EXAMPLE. 



B. TIMING DIAGRAM 



CLOCK < 

Lov 




SECOND CLOCK < '''' 

Lov 1 1 1 1 1 1 1 

RESULTANT f "= 
CLOCK \nv 

rv 


-T__J^^ 


SET J '■'- 
OUTPUT ^ nv 





Figure 1-1-8. Control Inputs Used As a Second Clock 

Control Inputs Used Directly to Set or Reset 

The set and the reset control inputs can also be used separately to change the state 
of the flip-flop. When the clock is at Vcc. the first control input that goes from Vcc to 
ground acts as the clock input. After a set control changes from Vcc to ground, the flip- 
flop will be in the set state. After a reset control changes from Vcc to ground, the flip- 
flop will be in the reset state. Figure 1-1-9 contains diagrams and equations describing 
this mode of flip-flop operation. 



1-9 



A. LOGIC DIAGRAM 



SET CONTROL 



RESET CONTROL 



{ 
{ 




SET OUTPUT 



ALL DC SET AND RESET 
INPUTS, AND THE CLOCK 
MUST BE AT V^g- 



B) Boolean Equations 

S Q- AND result of the set control inputs 
Rp- AND result of the reset control inputs 
F - state of the flip-flop 
primes ( ' ) - previous state of a signal 



F=S'c-Sc 
F = R-c-Rc 



(setting operation) 
(resetting operation) 



C. TIMING DIAGRAM 



SET CONTROL 



RESET CONTROL 



SET OUTPUT 



fVcc- 

lov 

{ 



'cc 
OV 



5«0 



/Vcc 



1_ 



Figure 1-1-9. Control Inputs Used Directly to Set or Reset 



1-10 



Input Loading 

DC inputs: 1.33 mA 

Clock input: 2.0 mA 

Control inputs: 2,0 mA 

Output Drive Capability 

8 unit loads (both outputs) 

(Capable of also driving 75 pF total capacitance with delays as specified. ) 

Circuit Delay 

The following circuit delays are specified from the +1.5V level of the input signal 
to the +1.5V level of the output signal. 



Clock input (negative transition) 
to latest output 

DC set input to set output or 
DC reset input to reset output 

DC set input to reset output or 
DC reset input to set output 



45 ns (typ) 
60 ns (miax) 

65 ns (typ) 
80 ns (max) 

45 ns (typ) 
60 ns (max) 



Clock and Control Input Timing Requirements 

To trigger the flip-flop at the clock or control inputs, pulses must meet the require- 
ments shown in Figure 1-1-10. 

DC Input Timing Requirements 

To activate a dc input, signals must meet the requirements of Figure 1-1-11. 

Control Inputs 

Figure l-i-12 shows the timing requirements of the set and reset control inputs when 
they are being used to steer the triggering clock input to set the flip-flop. The reset con- 
trol input must be completely switched to ground before the clock starts positive. No control 
input should go from Vcc to ground while the clock is positive. The set control input nnust be 
switched to Vcc at least 40 ns before the clock starts towards ground. The clock must be a 
positive pulse of 40 ns minimum duration. The flip-flop changes state on the trailing edge 
of the positive clock pulse. Reset timing is the same, except that the time relations and 
logic levels of the set and reset input must be interchanged. 



1-11 



T, (POSITIVE TIME) = 40 NS (MIN) 
Tj (NEGATIVE TIME) > 60 NS (MIN) 

+V = +3.0 VOLTS (MIN) 

''' RISE AND "I" FALL REQUIREMENT - ANY /i-PAC OUTPUT SIGNAL WILL 
s«i» RELIABLY TRIGGER THE FLIP-FLOP. 

Figure 1-1-10, Flip-Flop Input Pulse Requirements 
I 




T| (TIME AT VOLT) = 80 NS (MIN ) 
V = ?.0 VOLTS (MIN ) 



Figure 1-1-11, DC Set and Reset Input Signal Requirements 



SET CONTROL * i '^'^ 
OV- 



RESET CONTROL" 



CLOCK 



SET OUTPUT 



ov 



(_0V- 






cc 

ov • 



1.5V 



/ 



Vsv 



I 



I 

I l^-Tj -H 

I I 

I I 

I, 



Tp 



1 



INTERCHANGE SET AND 
RESET CONTROL TIMING 
TO RESET THE FLIP-FLOP 



(T|)= (MIN) 
(Tg)^ 40 NS (MIN) 
(Tp)= 40 NS (MIN) 
(V)= 3.0 VOLTS (MIN) 



Figure 1-1-12. Timing Requirements for Control Inputs j 
Using Clock Triggering 



1-12 



Maximum Allowable Clock Skew 



In cases where a register is being driven by clock (shift) signals from different 
sources, the output of one stage may arrive at the next stage before late clock signal. If the 
delay between the early and late clock signals is more than 30 ns, erroneous data transfer 
may occur. To guarantee proper operation the allowable clock skew must be as shown in 
Figure 1-1-13. Note that the triggering signal to flip-flop B is S^ rather than Cg. This 
situation is not detrimental to the operation of the shift register. Either S . or C may 
trigger flip-flop B, depending on which occurs first. 



B 



FF, 



SKEW < 30 NS 



T , > 40 NS 



FF. 



3 


1 


G 



Ca^ 



5a 



cc 
OV 



_/ \ +I.5V 



CC 

OV 
^cc 



ov- 



Cb' 



cc 
OV 



i 



v-^ 



1.5V 



41.5V 



-I 



-- +I.5V 



"■"skew -^ 



Figure 1-1-13. Allowable Clock Skew, Logic and Timing 

TYPE F-09 POWER AMPLIFIER (CCD 70 950 100 009) 

The type F-09 high speed power amplifier microcircuit has two 4-input inverter 
amplifiers with nodes for input gating expansion. (See Figure 1-1-14. ) The power amplifier 
circuit is logically equivalent to the F-01 gate but has about twice the output drive capability. 
It has a short circuit protection network such that accidental grounding of the output will 
not damage the circuit. 



Specifications 

Input Loading: 
Output Drive: 
Circuit Delay; 



4. mA 

50 mA 

15 ns with 70 pF of stray capacitance 



1-13 



INPUTS' 14 



NODE 





PIN I I — GROUND 
PIN 4 hVcc 



Figure 1-1-14. Type F-09 Power Amplifier Equivalent Logic Symbol 

TYPE F-19 FUNCTIONAL LOGIC GATE (CCD 70 950 100 019) 

The F-19 (Figure 1-1-15) has five NAND gates interconnected as a functional gating 
circuit. The outputs of A and B are connected together and can be used to perform the logic 
OR operation. This output is connected as an input to the power amplifier inverter (gate C). 
Gates B, D and E have input nodes (pins 2, 6 and 7) to facilitate input gate expansion by 
connecting discrete diodes to them. 




PIN 10 IS GROUND 
PIN 4 IS + Vcc 



Figure 1-1-15. F-19 Logic Symbol 



Specifications 

Input Load: 
Output Drive: 

Circuit Delay: 



2.0 mA 

Circuit A-B, D-E - 23.5 mA 

Circuit C - 40.0 mA 

20 ns per gate with 70 pF stray capacitance 



1-14 



TYPE 930/961 NAND GATES (CCD 70 950 105 001/009) 

The 930 and 961 (Figure 1-1-16) dual 4-input NAND circuits are logically similar to the 
F-01 gate. The 930 has a 6 kilohm resistor connected between the output collector and +V 
while the 961 has a 2 kilohm resistor. Otherwise, the two are identical. 



cc 



INPUTS 



NODE 





PIN 7— GROUND 
PIN 14- -HVcc 



Figure 1-1-16. 930/961 Dual NAND Gates 



Specifications 

Input Loading: 
Output Drive: 
Circuit Delay: 



1.6 mA 
12.8 mA 
930-75 ns averaged over two stages 
961-50 ns averaged over two stages 



TYPE 946/949 NAND GATES (CCD 70 950 105 002/010) 

The 946 and 949 (Figure 1-1-17) quad 2-input NAND circuits are similar to each other 

in all respects except for the value of the resistor which connects between the output collector 

and +V . The 946 has a 6 kilohm resistor while the 949 has a 2 kilohm. The AND-OR- 
cc 

INVERT operation can be performed with the 6 kilohm version by connecting the output of two 
gates together. This can be done without substantial reduction in output drive capability. 



INPUT- 



INPUT- 



~v 



OUTPUT 



I / *» 




J- 


\' 




12 




10 


r 


PIN 7- 


J3. 








-6 


^OUND 






PIN 14 


— 


■+-VCC 




Figure 1-1-17. 946/949 Quad NAND Gates 



Specifications 

Input Loading: 
Output Drive: 
Circuit Delay: 



1. 6 mA 
12.8 mA 
946-75 ns averaged over two stages 
961-50 ns averaged over two stages 



1-15 



TYPE 936/937 HEX INVERTER (CCD 70 950 105 004/011) 

The 936 and 937 (Figure 1-1-18) contain six inverter circuits. The 936 has a 6-kilohm 
resistor while the 937 has a 2 kilohm. 



INPUT - 





Figure 1-1-18. 936/937 Hex Inverter 



PIN 7 — GROUND 
PIN 14 HVcc 



Specifications 

Input Load: 1.6 mA 

Output Drive: 12.8 mA 

Circuit Delay: 936-75 ns averaged over two stages 
937-50 ns averaged over two stages 

TYPE 932 POWER AMPLIFIER (CCD 70 950 105 005) 

The type 932 power amplifier has two 4-input inverter amplifiers with nodes for input 
gating expansion (see Figure 1-1-19). The circuit is logically equivalent to the 930 gate but 
has twice the output drive capability. The 932 output cannot be connected to other outputs to 
perform the AND-OR-INVERT logic function. 



INPUTS' 



NODE 





PIN 7— GROUND 
PIN 14 hVcc 



Specifications 

Input Load: 
Output Drive: 
Circuit Delay: 



Figure 1-1-19. 932/944 Power Amplifiers 



1 . 6 mA 
36.0 mA 

80 ns averaged over two stages driving 500 pF of 
stray capacitance 



TYPE 944 POWER AMPLIFIER (CCD 70 950 105 008) 

The 944 (Figure 1-1-19) dual 4-input power amplifier differs from the 932 only in that 
it has an open collector for OR operations. The turn-on delay is 40 nanoseconds when driv- 
ing 120 picofarads of stray capacitance. The turn-off delay is dependent on the amount of 
external current that is supplied to charge the stray capacitance. The input loading and 
output drive specifications are similar to the 932. 



1-16 



TYPE 962/963 TRIP NAND GATES (CCD 70 950 105 006/012) 



The 962 and 963 (Figure 1-1-20) triple 3-input NAND gates are similar to each other in 



all respects except for the value of resistance between the collectors and +V 
has a 6 kilohm resistor while the 963 has a 2 kilohm resistor. 



cc 



The 962 



INPUTS 






PIN 7— GROUND 
PIN 14 l-Vcc 



Figure 1-1-20. 962/963 Trip NAND Gates 



Specifications 

Input Load: 
Output Drive: 
Circuit Delay: 



1.6 mA 
12.8 mA 
962-75 ns averaged delay over two stages 
963-50 ns averaged delay over two stages 



TYPE 032 QUAD NAND GATE (CCD 70 950 100 032) 



The 032 quad 2-input NAND gate (Figure 1-1-21) is logically similar to the 930 but 

it does not have a resistor between the collector and +V • This feature allows many of 

cc ' 

these gates to be collector ORed without degrading the dc drive capability. 



INPUT 



INPUT 



12 



13 



Joi^ 



UTPUT 






Figure 1-1-21. 032 Quad NAND Gate 



PIN II — GROUND 
PIN 4 l-Vcc 



Specifications 

Input Load: 
Output Drive: 
Circuit Delay: 



1.6 mA 
20.0 mA 
45 ns averaged over two stages 



1-17 



SECTION 2 
MODULE DESCRIPTIONS 



This section contains detailed assembly and schematic diagrams, and parts listings 
for the following logic circuit modules. 



JGC-364A 

CC-366A 
-.CC-366A 
'XC-367 

CC-368 
, CC-369B 
, CC-370 

CC-371 

CC-372 

CC-373/CC-899 
'/CC-374 
^eC-375 

CC-401 

CC-510A/CC-869 

CC-558/CC-621 

CC-672 

CC-681 



Columns 1 -4 Module 

Columns A-D Module 

Columns 9-12 Module 

Address Bus Module 

Shift Register Module 

Lamp Driver Module 

M Register Module 

Clock Module 

Regulator Counter Module 

Memory Timing Module 

ASR Interface Module 

High Speed A-U No. 1 Module 

High Speed A-U No. 2 Module 

Extended Address Module 

Memory Parity Board 

Cable PAC 

Cable PAC 



1-19 



COLUMNS 1-4 MODULE, MODEL CC-364A 



CC-364A 



Electrical Parts List 



Ref. 
Desig. 



C1-C8 



CR.1-CR14, 

CR16-CR18, 

CR23-CR25 

CR19-CR22 

M1-M4, M6 
M9, M25, 
M28-M30, 
M32-M35, M38 

M5 



M7, M8, Mil 

M16, M17, 

M19, M31, 

M36, M39. 

M41, M43, 

M45, M48, 

M50, M51 

MIO, MI3 
M37, M40 

M12, M24, 
M27, M46 

M14, M15, 
M18, M20-M22. 
M42, M44,M52 

M23, M26 



M47, M49 



Rl, R3, R5, 
R7 

R2, R4, R6, 
R8 

R9-R13 



Description 



CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 |iF ±20%, 50 Vdc 

DIODE: Replacement type 1N914 



DIODE: Replacement type 882 

MICROCIRCUIT: 

946, quad N AND gate integrated circuit 



MICROCIRCUIT: 

962, triple NAND gate integrated circuit 

MICROCIRCUIT: 

Power amplifier integrated circuit 



MICROCIRCUIT: 

963, triple NAND gate integrated circuit 

MICROCIRCUIT: 

F-01, Dual NAND gate integrated circuit 

MICROCIRCUIT: 

032, quad NAND gate integrated circuit 

MICROCIRCUIT: 

936, hex inverter integrated circuit 

MICROCIRCUIT: 

930, dual NAND gate integrated circuit 

RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
510 ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
IK ±5%, 1/4W 



Part No. 



70 930 313 016 



/u vi^ U»J uuz 

70 943 024 002 
70 950 105 002 

70 950 105 006 
70 950 105 008 



70 950 105 012 
70 950 100 001 

70 950 100 032 

70 950 105 004 
70 950 105 001 
70 932 007 056 
70 932 007 042 
70 932 007 049 



1-21 







O 
O 

a- 
> 



COMPONENT V lEW 



Figure 1-2-1. Columns 1-4 Module Parts Location 



CC-364A 



CC-3M SHEET 1 



GD- 



Ml «46 

I 

B2 



(Sj£>- 



(sID- 



(BM)- 



(!«>- 



fi^o)- 



(847)- 



(Mi)- 



M2 946 
2 

B8 



M2 946 

3 

BS 



"-2 ' 



MS 946 

4 

C8 



M3 946 

5 

C8 



152-2- 
78-5 



M3 946 

6 

C8 



41-8 

80-10 10 



M3 946 

7 



Ml 946 

8 

82 



M4 946 
9 



MS 962 

II 











40-9 13 



M2 946 

15 

88 



M2 946 

16 

88 



(C3l>i 



MS 944 

17 

AB 



(HEr' 



(B46)i 



(aD- 



(aH)^ 

(A2I>- 



M4 946 

21 

B7 



Mil 944 

22 



dig) ?'-" I' 



dUb 








-(JzD 



20' 
2 


M22 03? 
32 

F6 






— 99-2 



lOO-l- 
34-2- 




UI9 944 

34 




MI9 944 

35 

SI 




GD^ 



MI4 032\ 



OD^ 



dD- 



c^y- 



(534)1 



(Hrp- 



(A42)i 



(A40y 



ISHJ 



MI4 032\ 

37 V>5— . C*iz>fr^ 

E8 y (Ag2>" " 



M42 032 

42 

F8 



MIS 032 

43 

ET 



109-1 — - MI8 032\ 

44 p-' 

19-8 — - E7 / 




- (A4l) (B27> 



113-9 H M22 032\ 

>1 



(A44) - 



48 

F6 




M22 032 
F6 




-dD 




- Ccie) 



LBD - SCHEMATIC 


REF GATE NO. CONVERSION 


L.BO 


SCH 


1-99 


1-99 


A0-A9 


100-109 


B0-B9 


110-119 


C0-C9 


120-129 


D0-D9 


130-139 


E0-E9 


140-149 


F0-F9 


160-159 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 


190-199 




M 


GRID 




GATES 


NO. 


CORD 


TYPE 


12 3 4 5 8 


1 


62 


946 


1 


g 


74 


81 






2 


68 


946 


2 


3 


16 


16 






3 


C8 


946 


4 


5 


6 


7 






4 


B7 


946 


9 


10 


20 


21 






5 


F2 


962 


11 


154 


150 








6 


C7 


946 


12 


13 


23 








7 


CI 


944 


30 


66 










B 


A8 


944 


17 


27 










9 


H8 


946 


18 


40 


55 


67 






10 


G8 


963 


19 


61 


54 








11 


A7 


944 


22 


33 










12 


04 


FBI 


130 


131 










13 


G7 


963 


24 


57 


60 








14 


E8 


032 


26 


36 


37 


38 






15 


E5 


032 


98 


108 


109 


110 






16 


C2 


944 


28 


29 










17 


HI 


944 


147 


148 










IB 


E7 


032 


31 


43 


44 


46 






19 


81 


944 


34 


35 










20 


F4 


032 


104 


118 


120 


121 






21 


F6 


032 


99 


111 


113 


114 






22 


F6 


032 


32 


46 


48 


49 






23 


El 


936 


50 


56 


65 


71 


137 


143 


24 


D8 


F01 


52 


53 










25 


H4 


946 


96 


119 


133 


145 






26 


01 


936 


62 


68 


122 


128 


134 


140 


27 


07 


FOl 


58 


59 










28 


H7 


946 


61 


73 


47 








29 


02 


946 


63 


69 


136 


141 






30 


03 


946 


84 


70 


136 


142 






31 


G2 


944 


14 


72 










32 


B6 


946 


75 


76 


88 


89 






33 


C5 


946 


77 


78 


79 


80 






34 


84 


946 


82 


83 


93 


94 






35 


C4 


946 


B4 


85 


86 


87 






36 


A6 


944 


90 


ino 










37 


G6 


963 


92 


123 


126 








38 


H5 


946 


91 


112 


127 


139 






39 


A4 


944 


95 


105 










40 


G4 


963 


97 


129 


132 








41 


H2 


944 


13S 


144 










42 


F8 


032 


26 


39 


41 


42 






43 


Al 


944 


101 


102 










44 


E4 


032 


103 


115 


116 


117 






46 


E5 


944 


106 


107 










46 


05 


FOl 


124 


125 










47 


E2 


930 


146 


155 










48 


Fl 


944 


149 


152 










49 


G1 


930 


151 


153 










50 


83 


944 


166 


167 










61 


03 


944 


168 


159 










52 


H6 


032 


160 













TYPE 


VCC 


GRD 


930-963 


14 


7 


SN-7401 




11 


SUHL-F23 




10 


F01-F03 




11 


F09 




11 



LEGEND 




TYPE OF MICTOCIRCUIT 

MICROCIRCOIT 
REFERENCE GATE NO. 
■ ASSEMBLY DRAWING GRID 
COORDINATES 



Figure 1-Z-Z. Columns 1-4 Module Schematic 
Diagram (Sheet 1 of 2) 



1-23 



CC-364A 




TVPEOFMICROCIRCUrT 
MICROCIRCUIT 
REFERENCE GATE NO 
ASSEMBLY DRAWING GRID 
COORDINATES 



Figure 1-2-2. Columns 1-4 Module Schematic 
Diagram (Sheet 2 of 2) 



1-25 



CC-365A 



COLUMNS A-D MODULE, MODEL CC-365A 



Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


C1-C8 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 |iF ±20%, 50 Vdc 


70 930 313 016 


CRl, CR2, 
CR13. CR14 


DIODE: Replacement type 882 


70 943 024 002 


CR3-CR12, 
CR15-CR38 


DIODE: Replacement type 1N914 


70 943 083 002 


Ml, M6. M7, 
M20. M21. 
M30, M31, 
M41 


MICROCIRCUIT: 

032, quad NAND gate integrated circuit 


70 950 100 032 


M2, M5, M9, 
M12, M15. 
M16, M19, 
M23, M26, 
M29, M33, 
M36, M39, 
M43, M49 


MICROCIRCUIT: 

946, quad NAND gate integrated circuit 


70 950 105 002 


M3, M4, M13, 
M14, M17, 
Ml 8, M27, 
M28, M37, 
M38, M45, 
M46 


MICROCIRCUIT: 

944, power amplifier integrated circuit 


70 950 105 008 


MS, M22, M42, 
M32 

M35. M48 


MICROCIRCUIT: 

963, triple NAND gate integrated circuit 

MICROCIRCUIT: 

962, triple NAND gate integrated circuit 


70 950 105 012 
70 950 105 006 


MIO. M25 


MICROCIRCUIT: 

936, hex inverter integrated circuit 


70 950 105 004 


Mil, M24, 
M34, M44 


MICROCIRCUIT: 

F-01, dual NAND gate integrated circuit 


70 950 100 001 


M40, M47, 
M50 


MICROCIRCUIT: 

930, dual NAND gate integrated circuit 


70 950 105 001 


Rl, R2, R7 
R8 


RESISTOR, FIXED, COMPOSITION: 
510 ohm ±5%, 1/4W 


70 932 007 042 


R3-R6 


RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 


70 932 007 056 



1-27 



03 



A 



C 



D 



H 



o 
o 

> 



2- 

3- 



5- 

6- 
7- 







t 



t-f ■ 



Hi', 









R6 









1>L ■ ^ 






fi5 



...it , 

i.t- • -~ -: 9 e J I 

4 




.M 






tf= 



125 






=£W^ 



M"t— 



1^4 
35t 



?7 X -^pT 



^= jr. 



31 



27^5 32^ 



I- I 






28 



—I M^ f^ 



t 

20 
{ 

2-2 



•~"24 -—' '^^ 



26 

4 



;3fe 



R7 



1,3 



R2 



t 

HI 

i 



4 M 



?«i^fp^**--"''i ^^ 



COMPONENT MEW 

Figure 1-2-3. Columns A- D Module Parts Location 



CC-365A 




CC 365 ShM 1 



M 


GRID 




GATES 


NO. 


CORD 


TYPE 


12 3 4 5 6 7 


1 


A6 


032 


1 


8 


71 


78 








? 


A6 


946 


2 


3 


15 


16 








.1 


C5 


944 


17 


26 












4 


85 


944 


27 


28 












5 


D5 


946 


4 


5 


6 


7 








6 


G1 


032 


33 


34 


35 


40 








7 


G5 


032 


25 


36 


38 


39 








P 


F5 


963 


18 


48 


51 










9 


E5 


946 


19 


37 


62 


64 




1 


10 

n 


D2 
A1 


936 

fOI 


47 
49 


53 

60 


59 


62 


65 


68 




!2 


C2 


946 


60 


61 


66 


67 








13 


Fl 


944 


133 


139 












14 


Dl 


944 


63 


69 












15 


El 


946 


130 


131 


136 


13/ 








16 


A8 


946 


9 


10 


20 


21 








17 


ce 


944 


22 


30 












16 


BS 


944 


31 


32 












19 


ae 


946 


11 


12 


13 


14 








20 


F2 


032 


41 


42 


103 


104 








?1 


G8 


032 


29 


43 


45 


46 








22 


F8 


963 


24 


54 


67 










2!! 


E8 


946 


23 


44 


58 


m 








24 


81 


FOI 


55 


56 












7S 


E2 


936 


117 


123 


129 


132 


135 


138 




26 


A7 


946 


72 


73 


86 


86 








77 


CJ 


944 


«; 


96 












28 


b; 


944 


97 


98 












29 


07 


946 


74 


75 


76 


77 








in 


G2 


032 


105 


110 


111 


112 








.11 


G7 


963 


96 


106 


108 


109 








32 


F7 


962 


89 


118 


121 










33 


E7 


946 


88 


107 


122 


134 








34 


CI 


FOI 


119 


120 












35 


A2 


%2 


154 


157 


159 










36 


A4 


946 


/9 


80 


90 


91 








37 


C4 


944 


92 


100 












38 


84 


944 


101 


102 












39 


04 


94S 


81 


82 


83 


84 








40 


HI 


930 


150 


158 












41 


G4 


032 


99 


113 


115 


116 








42 


F4 


963 


94 


124 


127 










43 


E4 


94S 


93 


114 


128 


140 








44 


B2 


FOI 


125 


126 












45 


H2 


944 


143 


156 












46 


113 


944 


142 


144 












47 


H4 


930 


141 


146 












48 


H8 


962 


145 


147 


153 










49 


H7 


946 


14H 


152 


155 










50 


H5 


930 


149 


151 













TYPE 


VCC 


GRD 


930 963 


14 


7 


SN-740I 




11 


SLIHL-F23 




10 


F01-F03 




11 


F09 




11 



LEGEND 




TYPEOFMICROCIRCUIT 

MICROCIRCUIT 
REFERENCE GATE NO 
ASSEMBLY DRAWING GRID 
COORDINATES 



LSD -SCHEMATIC 


REF. GATENO. CONVERSION 


UBD 


SCH 


1-99 


1-99 


A0-A9 


100-109 


B0-B9 


110-119 


C0-C9 


120-129 


00-09 


130-139 


E0-E9 


140-149 


F0-F9 


150-159 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 


190-199 



Figure 1-2-4. Columns A-D Module Schematic 
Diagram (Sheet 1 of 2) 



1-29 



TYPE Of MICROCIRCUIT 

MICROCIROJIT 
REFERENCE GATE NO, 
ASSEMBLY DRAWING GRID 
COORDINATES 




CC-365A 



Figure 1-2-4. Columns A-D Module Schematic 
Diagram (Sheet 2 of 2) 



1-31 



CC-366A 



COLUMNS 9-12 MODULE, MODEL CC-366A 



Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


C1-C8 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0.33 ixF ±20%, 50 Vdc 


70 930 313 016 


CRl, CR4. 
CR8, CRIO 


DIODE: Replacement type 882 


70 943 024 002 


CR2, CR3, 
CR5-7, CR9, 
CR11-CR31 


DIODE: Replacement type 1N914 


70 943 083 002 


Ml, M2, M5, 
M9, M12, M15 
M16, M19, 
M23, M26, 
M29, M33, 
M36, M39, 
M43, M49 


MICROCIRCUIT: 

946, quad NAND gate integrated circuit 


70 950 105 002 


M6. M7, M30, 
M41 


MICROCIRCUIT: 

032, quad NAND gate integrated circuit 


70 950 100 032 


M3, M4, M13, 
M14, M17, 
M18, M27, 
M28, M35. 
M37, M38, 
M45 


MICROCIRCUIT: 

944, power amplifier integrated circuit 


70 950 105 008 


M8, M22, M31, 
M32, M42 


MICROCIRCUIT: 

963, triple NAND gate integrated circuit 


70 950 105 012 


M48 


MICROCIRCUIT 

962, triple NAND gate integrated circuit 


70 950 105 006 


MIO, M25 


MICROCIRCUIT: 

936, hex inverter integrated circuit 


70 950 105 004 


Mil, M24, 
M34, M44 


MICROCIRCUIT: 

F-01, dual NAND gate integrated circuit 


70 950 100 001 


M46, M47, 
M40 


MICROCIRCUIT: 

930, dual NAND gate integrated circuit 


70 950 105 001 


Rl, R3, R5, 
R7 


RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 


70 932 007 056 


R2, R4, R6, 
R8 


RESISTOR, FIXED COMPOSITION: 
510 ohms ±5%, l/4W 


70 932 007 042 



1-33 



A 



B 



C 



D 



H 



n 
n 






> 




COMP VIEW 



Figure 1-2-5. Columns 9-12 Module Parts Location 






(C3l> 



(C30> 



any 



(EE>^^ 



(|5T>ȣ:1_^ 



, 81-10 

(en) —- 1- 




CC-366A 



NO 


GRID 
CORD 


TYPE 


GATES 


1 


2 


3 


4 


5 


6 


1 


A3 


946 


1 


8 


75 


82 






2 


A5 


946 


2 


3 


15 


16 






3 


C5 


944 


17 


27 










4 


85 


944 


28 


29 










5 


DS 


946 


4 


5 


6 


7 






a 


H5 


032 


26 


35 


36 


37 






7 


G5 


032 


26 


38 


411 


41 






B 


F5 


963 


19 


50 


53 








9 


E5 


946 


18 


39 


54 


67 






10 


D2 


936 


49 


56 


61 


64 i 68 


71 


n 


82 


FOl 


51 


52 










12 


C2 


946 


62 


63 


69 


70 






13 


51 


032 


66 


73 


140 


147 






14 


D1 


944 


65 


72 










15 


CI 


946 


136 


137 


143 


144 






IB 


A7 


946 


9 


10 


20 


21 






17 


C7 


944 


22 


32 










1U 


87 


944 


33 


34 










19 


D7 


946 


11 


12 


13 


14 






20 


H7 


032 


30 


42 


43 


44 






21 


G7 


032 


31 


46 


47 


48 






22 


F7 


963 


24 


S« 


59 








23 


E7 


946 


23 


46 


60 


74 






24 


81 


F01 


57 


68 










25 


E2 


936 


123 


129 


135 


138 


142 


145 


26 


A4 


946 


76 


77 


39 


90 






27 


C4 


944 


91 


101 










2U 


84 


944 


102 


103 










29 


04 


946 


78 


79 


30 


81 






30 


H4 


032 


99 


109 


110 


111 






31 


04 


032 


10O 


112 


114 


115 






32 


F4 


963 


93 


124 


127 








33 


E4 


946 


92 


113 


128 


141 






34 


A2 


FOt 


125 


126 










35 


F2 


944 


139 


146 










3(j 


A8 


946 


83 


84 


94 


95 






37 


08 


344 


96 


106 










38 


88 


944 


107 


108 










39 


08 


946 


85 


86 


87 


B8 






40 


HS 


032 


104 


116 


117 


lis 






41 


G8 


032 


105 


119 


121 


122 






42 


F8 


963 


98 


130 


133 








43 


E8 


946 


97 


120 


134 


148 






44 


A1 


FOl 


131 


137 










45 


H2 


944 


163 


154 










46 


HI 


930 


151 


152 










47 


G1 


930 


150 












48 


F1 


962 


149 


156 


158 








49 


G2 


946 


166 


167 











TYPE 


VCC 


GRD 


930-963 


14 


7 


SN-7401 


4 


11 


SUHL-F23 


4 


10 


F01-F03 


4 


11 


F09 


4 


11 



LEGEND 




TYPEOFMICROCIRCUIT 

MICROCIRCUIT 
-REFERENCE GATE NO. 
- ASSEMBLY DRAWING GRIO 

COORDINATES 



-QD 



-(cjT) 



-QD 



- (Bia) GND 



-<CJ3) 



L8D SCHEMATIC 


REF GATE NO CONVERSION 


L8D 


SCH 


1-99 


1-99 


A0-A9 


100-109 


BO-89 


110-119 


C0-C9 


120-129 


0009 


130-139 


EO E9 


140-149 


F0-F9 


150-159 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 


190-199 



Figure 1-2-6. Columns 9-12 Module Schematic 
Diagram (Sheet 1 of 2) 



1-35 



CC-366A 



Ml «46 

75 




7-10 »- 



H26 946 

76 
«4 




M26 946 

77 

A4 




M29 946 

78 

D4 



M29 946 
79 

D4 



M29 946 

80 

D4 



M29 946 

81 

D4 



Ml 946 

82 

A3 



M36 946 
83 



H36 946 

84 

AS 



M39 946 
85 

D8 



M39 946 
86 

DS 










M39 94 

87 

D8 




88 

08 




(sE>^ 



(«36> 



(ixy- 



151-2- 
I3I-CRI6-I- 



QI> 



C639> 



I 

(a3|> 




M4B 962 
149 

Fl 



12 102-4 9 



M49 »4iN 



M47 930 
150 



33-4- 

6 33-CR6-I 



M48 962 

156 

Fl 



M46 930 

151 



<1CR14 

4cRI3 

CRI6 



M4e 930 
152 




13 
IZ 
10 


M45 944 
153 

H2 ^^ 


— w— 




M45 944 
154 

H2 



M49 946 

157 

FI 



M4B 962 

158 

Fl 



-(HE) 



CRIB 
CRI9 



CR20 
50-6— 14— • 



- CazD 
— (aTo) 



CR24 
18-3— 14- 

CR25 
23-3—14- 



CR27 
97-3—14- 



-GD 



CRza 

65-6-H4- 

CR29 
^2-8 14 ♦ 
CR30 
139-6 14 (I 



-(«0) 



LEGEND 




TYPE OF MICflOCIRCUIT 

MICROCIflCUIT 
REFERENCE GATE NO 
ASSEMBLY DRAWING GRID 
COORDINATES 



Figure 1-2-6. Columns 9-12 Module Schematic 
Diagram (Sheet 2 of 2) 



1-37 



CC-367 



ADDRESS BUS MODULE, MODEL CC-367 



Electrical Parts List 



Ref. 






Desig. 


Description 


Part No. 


C1-C5 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 |j.F ±20%, 50 Vdc 


70 930 313 016 


CR1-CR8 


DIODE: Replacement type 1N914 


70 943 083 002 


Ml, M2, M4, 


MICROCIRCUIT : 


70 950 100 032 


M20 


032, quad NAND gate integrated circuit 




M3, M16. 


MICROCIRCUIT: 


70 950 105 010 


M17 


949, quad NAND gate integrated circuit 




M5, M8 


MICROCIRCUIT: 

937, fast hex inverter integrated circuit 


70 950 105 Oil 


M6, M7, M18, 


MICROCIRCUIT: 


70 950 105 009 


M19 


961, dual NAND gate integrated circuit 




M9. M11-M14, 


MICROCIRCUIT: 


70 950 105 008 


M21-M28 


944, power amplifier integrated circuit 




MIO, M15 


MICROCIRCUIT: 

963, triple NAND gate integrated circuit 


70 950 105 012 


R1-R9 


RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 


70 932 007 056 


R10-R24 


RESISTOR, FIXED, COMPOSITION: 
IK ±5%, 1/4W 


70 932 007 049 



1-39 



o 



n 
n 



-J 



'>\>, WMf «!¥*• ^ 







^ +^ ^ 'i vfc 



8k > I 






<s »-. <S 






5 <^ 






COMPONENT VIEW 



Figure 1-2-7, Address Bus Module Parts Location 



CC-367 



CC-367SheeT 1 



M 


GRID 








GATES 


NO. 


CORD 


TYPE 


1 


2 


3 4 6 6 


1 


E4 


032 


1 


7 


3 


4 






2 


A6 


032 


8 


9 


10 


11 






3 


G4 


949 


16 


17 


18 


20 






4 


C7 


032 


7? 


23 


29 


30 






5 


G7 


937 


12 


13 


15 


17 


69 




6 
7 


G5 
G8 


961 
961 


5 
7 


26 
24 










8 


ES 


937 


75 


27 


34 


36 


37 


4? 


9 


i;6 


944 


31 


32 










to 


05 


963 


33 


41 










11 


B4 


944 


35 


40 










!2 


A4 


944 


38 


39 










13 


E7 


944 


43 


44 










14 


ES 


944 


45 


70 










15 


A7 


963 


21 


51 


52 




- — 


- 


16 


B5 


949 


6 


60 


62 


17 


B7 


949 


46 


4? 


48 


53 






18 


D8 


%1 


2P 


54 










19 


BS 


961 


55 


56 










20 


D7 


032 


14 


49 


63 








21 


H5 


944 


57 


64 










22 


H7 


944 


58 


66 










73 


H4 


944 


59 


63 










74 


F6 


944 


60 


67 










25 


f/ 


944 


61 


68 










76 


D4 


944 


71 


7? 










27 


C4 


944 


73 


74 










28 


E2 


944 


7b 














LBO - SCHEMATIC 


REF.GATENO- CONVERSION 


LSD 


SCH 


1-99 


1-99 


A0-A9 


100-109 


B0-B9 


110-119 


C0-C9 


120-129 


D0-D9 


130-139 


E0-E9 


140- -.49 


F0-F9 


150-159 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 


190-199 



MICROCIROJIT 
REFERENCE CATt NO. 
ASSCMBLY DRAWING GRIO 
COORDINATES 



Figure 1-2-8. Address Bus Module 
Schematic Diagram 



1-41 



SHIFT REGISTER MODULE, MODEL CC-368 



CC-368 



Electrical Parts List 



Ref. 
Desig. 



Description 



C1-C8 



CRl, CR3- 
CR14 

Ml, M5, M7, 
M8, Mil, M14, 
M15, MIS, M20 
M22, M25. M28, 
M29. M33, 
M35, M37, 
M41, M42 

M2, M9, M16, 
M23, M31, M38 

M3, M6, MIO, 
Mi3, M17, 
M19, M24, 
M26, M32, 
M34, M39, 
M40 

M4, M12, M21, 
M27, M30, 
M36 

M43 



M44 

M45-M50 
M51-M54 
Rl, R2 
R3-R10 



CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0,033 (J.F ±20%, 50 Vdc 

DIODE: Replacement type 1N914 



MICRO CIRCUIT: 

946, quad NAND gate integrated circuit 



MICRO CIRCUIT: 

936, hex inverter integrated circuit 

MICRO CIRCUIT: 

962, triple NAND gate integrated circuit 



MICROCIRCUIT: 

032, quad NAND gate integrated circuit 



MICROCIRCUIT: 

932, power amplifier integrated circuit 

MICROCIRCUIT: 

930, dual NAND gate integrated circuit 

MICROCIRCUIT: 

F-04, flip-flop integrated circuit 

MICROCIRCUIT: 

944, power amplifier integrated circuit 

RESISTOR, FIXED, COMPOSITION: 

2K ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
IK ±5%, 1/4W 



Part No. 



70 930 313 016 
70 943 083 002 
70 950 i05 002 



70 950 105 004 
70 950 105 006 



70 950 100 032 

70 950 105 005 
70 950 105 001 
70 950 100 004 
70 950 105 008 
70 932 007 056 
70 932 007 049 



1-43 



i4^ 



A 



B 



C 



D 



H 



n 
o 
I 

o 

OO 






*^Ct }--' 



*%' «• „ y JS, iTa'C^ fm»^,«f 



M 


P 


■•^TTiV 


Jl = 


49 


— 


— 


m —■:■::- 


■■■i — 


/...I~n''^ 






i:S::;«lftS-:-:v:-^S*' 


¥>>:-:¥:^:i;;:>aimiiaa 






!M 




'.'.',"" 


:;jil 




27 






30 






Ir— *■ 


' 1 


b 













COMPONENT VIEW 



Figure 1-2-9. Shift Register Module Parts Location 



CC-36f 




M 


GRID 




GATES 


M 


GRID 




GATFS 1 








12 3 4 5 6 


NO 


CORD 


TYPE 


1 




i 


4 


6 1 1 


1 


A1 


946 


1 2 3 16 


27 


f=2 


032 


131 


150 


28 


56 


1 






A5 


936 


4 18 32 46 60 74 


28 


F7 


946 


137 


138 


139 


146 








A1 


962 


5 17 33 


29 


G8 


946 


11 


12 


13 


24 








B3 


032 


19 47 75 103 


30 


G2 


032 


27 


55 


83 


111 






5 


A7 


946 


29 30 31 44 


31 


G4 


936 


14 


26 


42 


SI 


10 


82 




B5 


962 


45 61 73 


32 


G6 


962 


IS 


25 


43 










B8 


946 


57 68 59 72 


33 


G7 


946 


39 


40 


41 


57 








B7 


946 


86 86 87 100 


34 


H6 


962 


53 


71 


81 








9 


C4 


936 


88 102 116 125 136 144 


35 


H8 


946 


67 


68 


69 


RO 








B4 


962 


89 101 117 


36 


H2 


032 


84 


11? 


174 


175 








C8 


946 


113 114 116 123 


37 


H7 


946 


96 


96 


97 


108 








C2 


032 


23 51 126 146 


38 


H3 


936 


98 


110 


176 


157 






13 


C5 


962 


124 143 136 


39 


H4 


962 


99 


109 


161 










C7 


946 


132 133 134 142 


40 


HI 


962 


173 


163 


165 










D8 


946 


6 7 B 20 


41 


A1 


946 


167 


168 


69 


170 








D4 


936 


9 22 37 50 66 78 


42 


82 


946 


171 


172 


56 


178 








D6 


962 


10 21 38 


43 


D2 


932 


155 


154 










IS 


D7 


946 


34 36 36 48 


44 


A2 


930 


153 


177 












E5 


962 


49 77 66 


45 


B1 


F04 


157 












20 


ts 


946 


63 64 65 76 


46 


CI 


F04 


158 












21 


E2 


032 


79 107 130 149 


47 


Dl 


F04 


159 














E7 


946 


90 91 92 104 


48 


El 


F04 


160 












23 


F4 


936 


93 106 121 129 140 148 


49 


Fl 


F04 


161 












24 


E4 


962 


94 105 122 


50 


G1 


F04 


162 












25 


F8 


946 


118 119 120 127 


51 


Ee 


944 


179 180 










26 


F5 


962 


128 141 147 


52 


F6 


944 


181 


187 


















63 


G6 


944 


183 184 


















54 


H6 


944 


185 186 











M54 944> 

185 



MM 940 
186 



LBD- SCHEMATIC 1 


REF-GATENO. CONVERSION | 


L80 


SCH 


1-99 


1-99 


A0-A9 


100-109 


80-89 


110-119 


C0-C9 


120-129 


D0-D9 


130-139 


E0-E9 


140-149 


F0-F9 


150-169 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 


190-199 




LEGEND 



TYPEOPMICROCIRCUIT 
MICROCIRCUIT 
REFERENCE QATE NO. 
ASSEMBLY DRAWING GRID 
COORDINATES 



-(HD 



-(sE) 




Figure 1-2-10. Shift Register Module 
Schematic Diagram (Sheet 1 of 2) 



1-45 



CC-36{ 



155 -G 

175-6 • 



M39 962 
151 



MSe 936\ 



158-7 
CRI4-I 



^ 



157, 



-dn) 



159-7 
CRI5-I 



158 . 



CR6- I 
160-12 
159- 12 
158-12 

157- 12 



-COD 



cswy - 



!--: 



I 73-11 - 
177 -I - 



159, 



M44 930 

153 

A2 



-CUD 



M43 932^ 
154 



CRI 
— +«- 



M43 932 
155 

D2 



M42 946 
156 

82 



|CH3 
— 1«— 



176-8 
177-2 



160, 



-CMD 



II n~: 



M40 962 

163 




M38 936 
164 



173-9 
177-4 



161 



M40 962 

165 




M 38 936 
166 




175-5 
177-5 ■ 



162. 



(mT) - 



CaTV 



M40 962 
173 




1°. 


M36 032 


9 


174 
H2 



M36 032 

175 

H2 




M38 936 

176 

H3 



CHS 
I 
160-10 M 



CR7 
CRIO-I M 



. CR8 

CRN -1 M •: 



I CR9 
CRI2 -I W 



::ri |:r2 



162-7 



-CUD 



,CRM 

158-10 — m- 



CRI2 
157-10 M 



172-8 


^ 


M44 930 


171-11 


2 


177 


170- 8 


A2 


169-11 
168-3 
167- 6 


1 


CRI3 


3 


' M 





M42 946 

178 





fcTV 



M4I 946 
167 




H4I946\ J 

168 p — 158- 

^ y 



CC29> 




(3S> 



M4I 946 

170 




M42 946 >. 11 
171 p— 161-8 

S2 ' 






M42 946 

172 

B2 




LEGEND 




TYPEOf MICROCIRCUIT 
MICROCIRCUIT 
REFERENCE G4TE NO. 



Figure 1-2-10. Shift Register Module 
Schematic Diagram (Sheet 2 of 2) 



1-47 



CC-369B 



LAMP DRIVER MODULE, MODEL CC-369B 



Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


C1-C3 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0, 033 (xF ±20%, 50 Vdc 


70 930 313 016 


CR1-CR19, 

CR20A-CR20S, 

CR21-CR23 


DIODE: Replacement type 1N91 4 


70 943 083 002 


M1-M16 


MICROCIRCUIT: 

936, hex inverter integrated circuit 


70 950 105 004 


M18-M20 


MICROCIRCUIT: 

937, fast hex inverter integrated circuit 


70 950 105 Oil 


M21, M22, M25 


MICROCIRCUIT: 

032, quad NAND gate integrated circuit 


70 950 100 032 


M23, M17 


MICROCIRCUIT: 

949, quad NAND gate integrated circuit 


70 950 105 010 


M24 


MICROCIRCUIT: 

961, dual NAND gate integrated circuit 


70 950 105 009 


QIA-QIS, Q2 


TRANSISTOR, SILICON, NPN: 


70 943 744 003 


RIA-RIP 


RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 


70 932 007 056 


R2A-R2S, R7, 


RESISTOR, FIXED, FILM: 
1-lK ±1%, 1/2W 


70 932 123 203 


R3A-R3S, R4 


RESISTOR. FIXED, COMPOSITION: 
820 ohms ±5%, 1/4W 


70 932 007 047 


R5, R9-R12 


RESISTOR, FIXED. COMPOSITION: 
IK ±5%, 1/4W 


70 932 007 049 


R6 


RESISTOR, FIXED, FILM: 
100 ohms ±1%, 1/2W 


70 932 123 101 



1-49 



o 




O 

n 

W 



Figure 1-2-11. Lamp Driver Modiile Parts Location 



CC-369B 



Mviaow t 


■1 




kMK 


•r-r. 


* 


TAKEN FROM S R .54^320 






B 


CHUs/ICO 931M 


9 MM 


/ »'ltiiM£JI 


c 


ECO 9919 55H 


II/ZV7I 


<?>^^Jt)lf 


D 


CH(i-0 fCA ceo BO^'iS ^l\j% 


v>-ii^ 


^S^i=2j 



LBO- SCHEMATIC | 


REF- GATE NO 


CONVERSION 


LBD 


SCH 


t-99 


t-99 


AO- A9 


100-109 


S0-B9 


1 10-119 


C0-C9 


120-129 


00- D9 


130-139 


E0-E9 


140 -149 


ro-F9 


150-159 


G0-G9 


160-169 


H0-H9 


1 TO- 179 


10-19 


IBO-189 


J0-J9 


190-199 




Ki 


GRID 




' 


GATES 


NO. 


CORD 


TYPE 


1 


2 3 4 5 6 


1 


G4 


936 




6 


11 


16 


21 


26 


2 


G5 


936 




7 


12 


1/ 


22 


27 


■s 


G6 


936 




8 


13 


IB 


23 


28 


4 


07 


936 




9 


14 


ly 


24 


29 


b 


GB 


936 




10 


15 


20 


2b 


30 


B 


E4 


936 


31 


36 


41 


46 


51 


56 


7 


E6 


936 


32 


37 


42 


4/ 


52 


57 


R 


E6 


936 


33 


38 


43 


48 


53 


58 


9 


E7 


936 


34 


39 


44 


49 


54 


59 


10 


EB 


936 


35 


40 


4b 


bU 


5b 


6<J 


11 


C4 


936 


61 


66 


71 


/6 






1? 


C5 


936 


62 


67 


72 


11 






13 


C6 


936 


63 


68 


n 


78 






14 


C7 


936 


64 


69 


74 


79 






IS 


C8 


936 


65 


70 


75 


80 






16 


b8 


936 


Bb 


86 


87 


BU 


yi 




17 


AB 


949 


93 


94 


1?? 


l?4 






18 


A4 


937 


95 


96 


57 


98 


99 


102 


19 


A5 


937 


IOC 


101 


103 


104 


105 




JO 


A7 


937 


82 


B3 


e< 


106 


lOT 


117 


21 


B4 


032 


108 


109 


no 


111 






n 


65 


032 


112 


113 


114 


lib 






n 


B7 


949 


89 


90 


116 








24 


C2 


961 


81 












25 


A6 


032 


19 


l?0 


i?i 


122 






26 


















27 


















28 


















29 
J0^ 






1 j 


_ 




1 



CRI-I 

(21© — - 



Figure 1-2-12. Lamp Driver Module 
Schematic Diagram (Sheet 1 of 2) 



1-51 



CC-369B 



15-H ^"' 



-9 L" I 



CR6 

-M — 

CH7 

-M — 

CRS 

-M 

CR9 

-M— 

CRIO 

-M — 



M24 961 

81 

C2 




CRN 

-M 

CRI2 

-M — 

CRI3 
-+* 



CRI9 

-M — 



TYPICAL DCOOC 



NOTE: 

PIN 14 OF Ml THRU MIS ARE NOT 
CONNECTED TO V^c ON BOARD 




TYPE OF MICROCIRCUIT 

MICROCIRCUIT 
REFERENCE GATE NO 
ASSEMBLY DRAWING GRID 
COORDINATES 



<S°D 



Figure 1-2-12, Lamp Driver Module 
Schematic Diagram (Sheet 2 of 2) 



1-53 



CC-370 



M REGISTER MODULE, MODEL CC-370 



Electrical Parts List 



Ref. 








Desig. 




Description 


Part No. 


C1-C8 




CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 |j.F ±20%, 50 Vdc 


70 930 313 016 


CR1-CR27 




DIODE: Replacement type 1N914 


70 943 083 002 


Ml, M7, MIO, 
M22, M33. M48 


MICROCIRCUIT: 

937, fast hex inverter integrated circuit 


70 950 1.05 Oil 


M2, M18 




MICROCIRCUIT: 

032, quad NAND gate integrated circuit 


70 950 100 032 


M3, M6, M9 


MICROCIRCUIT: 

F-09, dual power amplifier integrated circuit 


70 950 100 009 


M4, M14, ] 
M25, M31, 
M42 


M15, 
M38, 


MICROCIRCUIT: 

949, quad NAND gate integrated circuit 


70 950 105 010 


M5, M8, Mil, 
M12, M24, 
M26, M32, 
M36, M41, 
M46, M49 


MICROCIRCUIT: 

963, triple NAND gate integrated circuit 


70 950 105 012 


M13, M20, 
M29, M30, 
M35, M39, 
M40, M43, 
M44, M45 


M21, 


MICROCIRCUIT: 

961, dual NAND gate integrated circuit 


70 950 105 009 


M16, M17, 
M23, M27, 
M28, M34, 
M37, M47 


M19, 


MICROCIRCUIT: 

944, power amplifier integrated circuit 


70 950 105 008 


Rl-Rll 




RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 


70 932 007 056 



1-55 



A 



B 



C 



a- 



2- 

3- 
4- 

5- 

6- 
7- 

8- 



D 



H 



CC-37(.) 




C33 



n 
n 
I 

o 



COMPONENT VIEW 



Figure 1-2-13. M Register Module Parts Location 



LBD - SCHEH4TIC i 


REF, GATE SO 


. CONVERSION 


LED 


SCH 


1-99 


1-99 


A0-A9 


100-109 


B0-B9 


110-119 


C0-C9 


120-129 


D0-D9 


130-139 


E0-E9 


140-149 


F0-F9 


150-159 


G0-C9 


lHO-169 


HO-HS 


170-179 


lo-iy 


180-1H9 


J0-J9 


190-199 




CC-370 




M 
NO, 


GRID 
CORD 


TVPE 


GATES j 


11 


2 


3 


4 1 5 6 


1 


A8 


937 


1 


2 


3 


4i 6 6 


2 


A6 


032 


12 


13 


14 


'5| 1 


3 


A4 


F09 


16 


i; 






4 


85 


949 


10 


20 


38 


40 ! ; 


5 


88 


963 


19 


77 


23 




1 


6 


87 


F09 


21 


30 






1 


7 


B4 


937 


11 ! 29 


31 


24 


26 i 33 


8 


62 


963 


9 ; 18 


43 






9 


A3 


F09 


32 






1 


10 


Al 


937 


34 ! 35 


36 


26 


7.149 


11 


OB 


963 


?S 


45 


46 








12 


C2 


963 


39 


61 


59 








13 


C4 


961 


4? 


44 










14 


C5 


949 


49 


50 


5? 


58 






15 


G2 


949 


41 


63 


70 


71 






IS 


C7 


944 


48 


56 










17 


C8 


944 


47 


72 










18 


D7 


032 


37 


61 


68 


93 






19 


Gl 


944 


73 


74 










20 


A2 


961 


52 


64 






1 ■ 


21 


81 


961 


66 


67 










22 


D5 


937 


53 


60 


65 


75 


76 


78 j 


23 


E4 


944 


64 


97 










24 


D4 


963 


66 


69 


99 








25 


E5 


949 


79 


SO 


81 


a? 






26 


EB 


963 


83 


84 


100 








27 


E7 


944 


86 


87 










2U 


FB 


944 


88 


90 










29 


F7 


961 


85 


89 










30 


F5 


961 


91 


96 










31 


F4 


949 


8 


96 


103 


Ill 






32 


G8 


963 


92 


98 


108 








33 


F2 


937 


62 


94 


107 


102 


110 


113 1 


34 


G7 


944 


101 


104 










35 


G5 


961 


109 


116 










3B 


G4 


963 


105 


11? 


114 






1 


37 


HB 


944 


106 


133 








1 


38 


H7 


94S 


115 


117 


121 


123 






39 


H5 


961 


118 


119 








j 


40 


CI 


961 


120 


124 






! 


41 


H4 


963 


127 


13ft 


138 






V 


H2 


949 


125 


127 


135 


143 




43 


DJ 


961 


132 


140 








44 


A7 


961 


131 


139 






1 


4b 


01 


961 


134 


141 








46 


Fl 


963 


128 


136 


144 






47 


E2 


944 


126 


129 








48 


El 


937 


27 


137 


146 


146 


147: 77 


49 


HI 


963 


142 


148 






1 



LEGEND 




TYPE OFMiCROCIRCUIT 
MICROCIRCUIT 
REFERENCE G4TE NO 
ASSEMBLY DRAWING GRID 
COORDINATES 



Figure 1-2-14, M Register Module Schematic 
Diagram (Sheet 1 of 2) 



1-57 




CC-370 



"> TYPE OF MICROCIRCUIT 

MICROCIRCUIT 
REFERENCE GATE NO 
ASSEMBLY DRAWING GRID 
COORDINATES 



Figure 1-2-14, M Register Module Schematic 
Diagram (Sheet Z of 2) 



1-59 



CLOCK MODULE, MODEL CC-371 



CC-371 



Electrical Parts List 



Ref. 
Desig, 



Description 



Part No. 



C1-C24 
C25-C32 

CR1-CR29 

L1-L3 

M1-M8, 

M13-M15, MIS, 
M19, M26 

M9, M17, M21, 
M22, M24, 
M30, M35 

MIQ, M20, 
M23, M27 
M29, M31 

Mil, M25. 
M28, M42 

M12, M33 
Ml 6 
M32, M34 



M36-M41, 
M43-M50 

Rl 



R2-R9 



RIO 



CAPACITOR. FIXED. MICA DIELECTRIC: 
75 pF ±2%. 100 Vdc 

CAPACITOR. FIXED, PLASTIC DIELECTRIC: 
0, 033 [xF ±20%. 50 Vdc 

DIODE: Replacement type 1N914 

DELAY LINE 

MICROCIRCUIT: 

961, dual NAND gate integrated circuit 



MICROCIRCUIT: 

944, power amplifier integrated circuit 



MICROCIRCUIT: 

949, quad NAND gate integrated circuit 



MICROCIRCUIT: 

963, triple NAND gate integrated circuit 

MICROCIRCUIT: 

937, hex inverter integrated circuit 

MICROCIRCUIT: 

F-19, logic gate integrated circuit 

MICROCIRCUIT: 

032, quad NAND gate integrated circuit 

MICROCIRCUIT: 

F-09, power amplifier integrated circuit 

RESISTOR, FIXED, COMPOSITION: 
130 ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
510 ohms ±5%, 1/4W 



70 930 004 214 

70 930 313 016 

70 943 083 002 
70 000 206 703 
70 950 105 009 

70 950 105 008 

70 950 105 010 

70 950 105 012 
70 950 105 Oil 
70 950 100 019 
70 950 100 032 
70 950 100 009 
70 932 007 028 
70 932 007 056 
70 932 007 042 



1-61 






A 



e 



D 



H 



n 
o 

-J 






# 



w 



¥f- 



,tt 



n 



*+ 



„tt 







COMPONENT VIEW 



Figure 1-2-15. Clock Module Parts Location 



fcLC 



(I (TT) 



UI6 FI9 

2 

H2 



M36 F09 
3 



M36 F09 
4 



M3I 949 

7 





I £ 3 *» D b I 

C I — C 8 ^T^ ^Ts »-rs ^p, ^T\ ^^ ^rs ^T^ 



MIS FI9 

9 

H2 



Li 10 




CC-371 




n T T X— T I : I T 



20 21 22 23 24 




:a^ I I I T , T I X 




CiEh 





M43 F09 

II 

G7 



f 




M32 05?\ 



M32 032"N 



M3I 949 
12 



-<MD 






GD- 



, " I! 

- (as) T6C 



MI6 FI9 

126 



Q3> 



C*D- 



M50 F09 
17 




QD- 



M43 F09 

23 

07 




CB3?> - 



.J 



(AJD^ 



M36 944 
18 



(HD- 



M33 937 

24 




(A30>- 



M3I 949 

19 

E5 



M35 937 

25 

G5 






"m42 96S\ 

21 VM 






M49 F09 

22 

F8 



M47 F09 
26 




M4e F09\ 

1L>- 



M49 F09 

28 

F8 



29 




(B39>- 



M39 F09 
30 




(IM> 




GM)- 



32 



j^ 




(e4r>- 



M46 F09 

33 
ce 




(845)- 
M46 F09 

34 

C8 




(My 




M48 FoiX 



(TT)-!^ 



CID- 
-dH) 



(W>- 



(CI7> 



(hD- 




65-5 ■ 
68-3 



l2-4_;i 84 



M2I 944 
45 



ciiccii) 






(C27> 



M29 949 
46 



M22 944 

47 




c 



M20 94SN 



M30 944 

49 

DS 




,i 1- M29 949 




30 94 4\ 



(«> 



I — QD 




M2r 944 

52 V\6 



(IM)- 




CmD- 



(l24>^ 




(8«)- 




M29 94^\ 

58 \>5_,, 

£5 y 




TYPEOFMICROCIRCUIT 
MICROCIRCUIT 
REFERENCE 04TE NO. 
ASSEMBLY ORAWINS GRID 
COORDINATES 



CO 371 Sheet 1 



(HD- 



M 


GRID 






GATES 


NO. 


CORD 


TYPE 


1 2 


3 4 5 6 


1 


A1 


961 


83 


91 










2 


B1 


961 


84 


92 










3 


01 


961 


85 


93 










4 


01 


961 


86 


94 










5 


El 


961 


87 


95 










6 


F1 


961 


88 


96 










7 


G1 


961 


89 


97 










8 


HI 


961 


90 


98 










9 


A2 


944 


123 


124 










10 


B2 


949 


67 


78 


81 


87 






11 


C2 


963 


76 


77 


79 








12 


02 


937 


59 


64 


71 


76 


80 


106 


13 


E2 


961 


99 












14 


F2 


961 


119 


120 










15 


G2 


961 


113 


114 










16 


H2 


F19 


1 


2 


9 


10 


176 




17 


A3 


944 


121 


122 










18 


F3 


961 


62 


63 










19 


G3 


961 


110 


112 










20 


A4 


949 


48 


100 


111 


117 






21 


84 


944 


45 


57 










22 


C4 


944 


47 


54 










23 


D4 


949 


61 


10? 


104 


109 






24 


E4 


944 


70 


108 










25 


F4 


963 


69 


116 


lis 








26 


G4 


961 


60 


115 










27 


AS 


949 


56 


66 


73 


74 






28 


85 


963 


53 


55 


72 








29 


C5 


949 


46 


50 


58 


57 






30 


D6 


944 


49 


51 










31 


E5 


949 


7 


12 


19 


70 






32 


F5 


032 


6 


8 


14 








33 


G5 


937 


16 


24 


25 


103 


105 


107 


34 


A6 


032 


65 


68 










35 


F6 


944 


18 












36 


G6 


F09 


3 


4 










37 


A7 


F09 


35 


101 










38 


B7 


F09 


37 


38 










39 


C7 


D09 


29 


30 










40 


D7 


F09 


31 


3? 










41 


E7 


F09 


39 


40 










42 


F7 


963 


5 


15 


21 






1 


43 


G7 


F09 


11 


23 










44 


A8 


F09 


43 


44 










45 


B8 


F09 


41 


42 










46 


C8 


F09 


33 


34 










47 


08 


F09 


13 


76 










48 


E8 


F09 


?7 


3fi 










49 


F8 


F09 


22 


28 










50 


G8 


F09 


17 


126 











TYPE 


VCC 


GRD 


930 963 
SN-7401 
F01-F03 
F03 


14 
4 

: 


7 

11 
11 
11 



LSD . SCHEMATIC 


REF.GATENO. CONVERSION 


LBD 


SCH 


1-99 


1-99 


A0-A9 


100-109 


B0-e9 


110119 


C0-C9 


120-139 


DO D9 


130-139 


E0-E9 


140 149 


F0-F9 


150-159 


G0-G9 


160 169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 190-199 1 




Figure 1-2-16. Clock Module Schematic 
Diagram (Sheet 1 of 2) 



1-63 



CC-371 




TYPEUFMiCROClRCUIT 
MICROCIRCUIT 
REFERENCE G4Tt NO. 



Figure 1-2-16. Clock Module Schematic 
Diagram (Sheet 2 of 2) 



1-65 



REGULATOR COUNTER MODULE, MODEL CC-372 



CC-372 



Electrical Parts List 



Ref. 
Desig. 



C1-C8 

CR1-CR8 
Ml, M3-M8 

M2, M15-M24 

M9-M14 

M25-M35 

M36-M40, 
M42 

M41, M43 

M44-M46 

Rl. R2, R6- 
R14, R16-R18 

R3, R4. R5 
R15 



Description 



CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 |jiF ±20%. 50 Vdc 

DIODE: Replacement type 1N914 

MICROCIRCUIT: 

963, triple NAND gate integrated circuit 

MICROCIRCUIT: 

949, quad NAND gate integrated circuit 

MICROCIRCUIT: 

937, hex inverter integrated circuit 

MICROCIRCUIT: 

944, power ainplifier integrated circuit 

MICROCIRCUIT: 

961, dual NAND gate integrated circuit 

MICROCIRCUIT: 

032, quad NAND gate integrated circuit 

MICROCIRCUIT: 

F-04, flip-flop integrated circuit 

RESISTOR, FIXED, FILM: 
2K ±2%, 1/4W 

RESISTOR, FIXED, FILM: 
510 ohms ±2%, l/4W 

RESISTOR, FIXED, FILM: 
IK ±2%, 1/4W 



Part No. 



70 930 313 016 

70 943 083 002 
70 950 105 012 

70 950 105 010 

70 950 105 Oil 

70 950 105 008 

70 950 105 009 

70 950 100 032 

70 950 100 004 

70 932 114 056 

70 932 114 042 

70 932 114 049 



1-67 



00 






"KJt 'i'.'.'.'J.'." 



m 









"* ' f iT TTT? 33 im'm V i" 



p,\A=Mi^M7' ^33 



C ^^~«* 



1 t 



I ■ 



l, 



R6 



He % ^- 



HI 




R T 



J 

Rl 



O 

n 

IS) 






^gV 













Z. V^yQ |-™!^ 



•wj ^ ^ f/^' 



^^ .^ 



— r*H 







J- 



He- 7 H 






COMPONENT VIEW 



Figure 1-2-17. Regulator Counter Module Parts Location 



CC-372 



orr) "'' « ' [_H6 



dED- 



(AM)- 



> 



p^ 



(«4> 



dJEFf — - 



(XTo> 









MIS 949 \ 



MIS 949"N 

17 WlJ 

G5 / 



C«a> 



-"J 1 9 V-CmT) 



1 39-10 

IB 

S5 .y 



QD- 



^ 



)C^<i«) 




HZi 944 
ZE 



-CbTT) 





MIO 937"N 

26 V>!^ 

H5 y 



GD- 



MiO 937 
2.4 




MIO 937 

33 

HS 



MI7 949 
30 



M2 963 
31 



MI8 949 

32 







,-(xr) 




36 




L-dH) 



-L. M26 94 




M4I 032 

42 



M4I 032 X 

43 )^^ 



Ami 937 

44 





96-1-} 




. . CR2 

fitr) 14-H. 

dD 



M36 96 

49 

H3 



I— GTT) 



50 



L<Br) 



^ 



r— (A23) 



M4 963^ 

51 

G3 




MI9 949 

53 




M37 961 

56 

E3 





MM 


937 N 




57 




^ 


F4 


y 










!11 y 






u 


GRID 




GATES 


NO- 


CORD 


TYPE 


12 3 4 6 6 


1 


H6 


963 


t 


4 


6 








7 


F5 


963 


19 


20 


31 








3 


G4 


963 


38 


45 


47 








4 


G3 


963 


61 


65 


69 








5 


A5 


963 


70 


71 


77 








5 


D5 


963 


86 


89 


142 








7 


C3 


963 


92 


9b 










» 


D2 


963 


98 


109 










9 


F6 


937 


b 


9 


11 


13 


15 




10 


H5 


937 


23 


24 


26 


28 


33 


34 


11 


F4 


937 


35 


36 


44 


46 


57 




12 


C5 


937 


82 


83 


115 


174 


b; 




n 


03 


937 


99 


100 


102 


117 


116 


143 


14 


A1 


937 


110 


130 


131 


138 


144 


146 


IS 


E6 


949 


10 


12 


14 


16 






16 


G6 


949 


2 


3 


7 


63 






17 


G2 


949 


2b 


7/ 


79 


30 






in 


G5 


949 


17 


18 


32 


39 






19 


F3 


949 


60 


53 


b4 


61 






70 


1 66 


949 


65 


66 


73 


81 






21 


S6 


949 


78 


79 


93 


103 






77 


01 


949 


108 


118 










73 


B3 


949 


120 


121 


123 


179 






74 


B2 


949 


134 


135 


140 


141 






7b 


pi^ 


944 


21 


72 










76 


F4 


944 


37 


40 










27 


F2 


944 


60 


64 










78 


H2 


944 


67 


B 










79 


■M 


944 


Ub 


94 










3fi 


A4 


944 


74 


104 










3. 


El 


944 


114 


145 










3? 


E7 


944 


101 


176 










33 


F1 


944 


111 


113 










34 


C4 


944 


S8 


96 










36 


A3 


944 


106 


139 










36 


H3 


961 


49 


57 










37 


E3 


961 


48 


56 










3S 


01 


961 


91 


10b 










39 


C6 


961 


68 


6£ 










40 


81 


961 


127 


13/ 










41 


H4 


032 


41 


47 


43 


58 






4? 


D6 


961 


67 












43 


94 


032 


43 


8' 










44 


A6 


F04 


75 












46 


C2 


F04 


132 












46 


A2 


F04 


127 
















TYPE: 


VCC 


CRD 




930- 963 


14 


7 




SN 


HOI 


4 


11 




FOl 


-F04 


4 


11 ' 











L.EGF-ND 







10 

1 1 


M42 963N 




w^ 



TYPE Of MICROCIRCUIT 
MICHOCIHCUIT 
REFERENCE GATE NO. 
ASSEMBLY DRAWING GRIO 
COORDINATES 



-GD 



;C5-CI2 

GD 



- (Bl») 5N0 



-dsS 



I F'igure 1-2-18, Regulator Counter Module 

Schematic Diagram (Sheet 1 of 2) 



1-69 



CC-372 




M20 949 
66 



V. 



— Be / 



M42 961 

67 

De 






M20 949 

73 






MI2 937 

82 

C5 




(3M> 



- CclD 





MI2 937~N. ig 

80 fP 

c5 y 



MI2 337 

83 





M29 944 
85 




M6 963 

86 

D5 




MI2 937 

87 




M6 963 
89 

DS 




M22 949 
97 

21 y 



(J45>- 



90 

01 




M38 96 

91 

CI 





M2I 949 

93 

B5 




MS 963 
98 

02 



I — CmT ) 




MI3 937 

99 

03 



Ml 3 937\ 
100 fh- 

" y 



M34 944~N 
88 P^ 

^C4 J^ 



M29 944 
94 



M7 963 

95 

C3 




t 



M3-9 944N g 



M32 944\ 

101 p— I 

E2 y CSiTy 




MI3 937^ 

102 







M22 949 
108 




Me 963 

109 




MI4 937 

no 




M33 944 
III 





M33 944 

113 




( A46) ' 



M3I944\ 



MI2937\ ^ 

115 t>-l 



MI3 937 

116 

03 




M43032 
117 




lij M22 9' 



118 






M23 949\ ,1 p 

121 p— 

^ y 




M23 949 

123 

B3 



MI2 937 
124 




M43032\ 1^ 



M32 944 
126 



'— (JoT) 




jlRlS 



< 



^Vr 



M23 949 
129 

83 y 



M40 96f 
137 







MI4 937 

131 



Rte 



MI4 937 

138 





'3g 



< 



M45 - F04 



- CTiT) 



M24 949 

140 

B2 




M24 949 

134 

B2 






M6 963 
142 




MI3 937^\ 

143 yj 

03 ^y 



MI4 937 
144 




22-8 
34-4 



C^JT) n 



CR7 

—M — 

CRe 
-M — 



M3I 944 

145 

El 



I1II4 937 

148 



Figure 1-2-18. Regulator Counter Module 
Schematic Diagram (Sheet 2 of 2) 



1-71 



MEMORY TIMING MODULE, MODEL CC-373 



Electrical Parts List 



CC-373/CS-899 



Ref. 
Desig. 



C1-C32 



C33-C40 



Mi, M2, M9 
MIO, Mil 

M3, M5, M8 
M19, M27 

M4, M7, M14 
M22, M24-M26 

M6, M15, M16 



M12, M13, M17, 
M18, M20, M21 
M23 

M28-M36 



CR1-CR8,CR11 
CR9, CRIO 
Ql 

Q2 



Description 



DLl 


-DL4 


R1-R4, 


RIO, 


R18 






R5, 


R7, 


R8 


R9 






Rll 






R12 







CAPACITOR, FIXED, MICA DIELECTRIC: 
120 jxF ±2%, 100 Vdc 

CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 (jlF ±20%, 50 Vdc 

MICROCIRCUIT: 

949, quad N AND gate integrated circuit 

MICROCIRCUIT: 

963, triple NAND gate integrated circuit 

MICROCIRCUIT: 

961, dual NAND gate integrated circuit 

MICROCIRCUIT: 

937, fast hex inverter integrated circuit 

MICROCIRCUIT: 

944, power annplifier integrated circuit 

MICROCIRCUIT: 

F-03 power amplifier integrated circuit 

DIODE: Replacement type 1N914 

DIODE 

TRANSISTOR, SILICON, NPN: 
Replacement type 2N3011 

TRANSISTOR, SILICON, PNP: 
Replacement type 2N3012 

DELAY LINE 

RESISTOR, FIXED, COMPOSITION: 
510 ohms ±5%, l/4W 

RESISTOR, FIXED, COMPOSITION: 
IK ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
820 ohms ±5%, l/4W 

RESISTOR, FIXED, COMPOSITION: 
100 ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
750 ohms ±5%, 1/4W 



Part No. 



70 930 004 219 
70 930 313 016 
70 950 105 010 
70 950 105 012 
70 950 105 009 
70 950 105 Oil 
70 950 105 008 

70 950 100 003 

70 943 083 002 
70 943 088 001 
70 943 722 001 

70 943 721 001 

70 000 206 703 
70 932 007 042 

70 932 007 049 

70 932 007 047 

70 932 007 025 

70 943 007 046 



1-73 



CC-373/CS-899 



Electrical Parts List (Cont) 



Ref. 
Desig. 


Description 


Part No. 


R13 

R14-R16 

R17 


RESISTOR, FIXED, COMPOSITION: 
39 ohms ±5%, 1/2W 

RESISTOR, FIXED, COMPOSITION: 
330 ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
180 ohms ±5%, 1/2W 


70 932 004 015 
70 932 007 037 
70 932 004 031 



1-74 






I ^-^ :3f2t?io^<5-^^^,%'rf^^^^;^^^^.L^/i;''^ -«^,T,ir.T T T T T TjT - - -r -r ^ ^-aiD^- 



of K I xor 



9^ ft cTo ai C12 C13 CM 






^ILcie . cgs^ds C27 c2a c£9 cao cli c-i2^55tt: 



^TW 



3 X 



3D 



H 

^39 A^ 



C22 C23 C24 

T- T- -•- ^ ;!.' a; ■ 



^czz, 




1 ,. _ „ _ , , „ „, „ „ „ _ ^ 








■^ ' , 



COMPONENT VIEW 



A *^i„ 



s * 






Figure 1-2-19. Memory Timing Module Parts Location 



n 
-J 

\ 

o 



CC-373/CS-899 



The following temporary jumpers must be inserted prior to the start of any tests. 

a. CC-373 

Connect P3 to T30 
P5 to T40 
PI to T25 
P6 to T15 
P7 to T13 
P8 to T33 
P9 to T35 
PIO to T12 
Pll to T14 
P12 to T12 
P13 to T2 
P14 to T30 
P17 to T35 
P5 to P15 

b. CC-899 

Connect P3 to T23 
P5 to T40 
P7 to T13 
P8 to T33 
P9 to T36 
PIO to T14 
Pll to T14 
P12 to T8 
P13 to Tl 
P14 to T30 
P15 to T40 
P17 to T38 
P18 to T13 
P6 to T14 
PI to T22 



1-76 



CC-373/CS-899 



CcD - 



(b30) - 



71-9 

(SD- 

53-2 (IJD- 



— ^-^ M)8 944 

-^2 



(A39) - 
(B43) - 
(fl40) — 



^> 




*-5-> 



(C2D - 

CUD- 





HI9 963 

4 




MIO 949X II 




-rBrr)37-iz 



I — (3ID 



5 963 

9 

C5 



r 




MI9 963 
12 




MB 963 

7 




M15 937 

14 




M4 96 

16 








MI6 937N, 

24 



M16 937 
25 





MI4 96 

20 




LiCMD 



M2 949 

21 



tVl 



M6 937 

27 



■ M25 96 
31 



M25 96 

32 




Mr6 937\ , 

38 b-- 







M27 963 

45 

EZ 




MI4 9&t 

33 

F5 





"15 "7"\ 10 



MIO 949 

35 




M26 961 
47 



CR7 



MM 949 

48 





MI5 937 

49 

E4 



M6937\ 



M3 963 
52 



M3 963 
53 



MI2 944 

55 

B3 



MI6 937 

56 





2D 




- <C26 ) 




M 


GRID 






GATES 


NO 


CORD 


TYPE 


1 2 


3 


4 6 6 


1 


A5 


949 


22 


23 


79 


30 






2 


B5 


949 


21 


36 


37 


61 






3 


Gl 


963 


12 


53 










4 


D5 


9G1 


15 


16 










6 


C5 


963 


9 


28 


63 








e 


C4 


937 


8 


27 


50 


77 


74 


76 


7 


04 


961 


1 


71 










8 


A4 


963 


6 


7 


73 








9 


D3 


949 


67 


6b 


69 


70 






10 


C3 


949 


6 


35 


66 


97 






11 


A3 


949 


11 


48 


99 


43 






12 


33 


944 


S5 


9B 










13 


E5 


944 


13 


40 










la 


Fb 


961 


70 


33 










15 


E4 


937 


H 


19 


41 


49 


7b 


?? 


16 


F2 


937 


24 


25 


:!8 


44 


56 


ha 


17 


f^3 


944 


34 


42 










18 


E3 


944 


7 


B5 










19 


F4 


963 


4 


12 


26 








20 


G2 


944 


59 


60 










21 


H2 


944 


f,l 


B? 










22 


G3 


961 


17 


39 










23 


G4 


944 


3 


S4 










24 


H3 


961 


10 


18 










25 


ri4 


961 


31 


32 










26 


G6 


961 


47 


57 










27 


E2 


%3 


45 


46 


64 








28 


A2 


F03 


78 


85 










29 


A1 


F03 


79 


83 










30 


82 


F03 


86 


87 










31 


B1 


F03 


80 


81 










32 


C2 


F03 


82 


88 










33 


CI 


F03 


89 


90 










34 


D2 


F03 


92 


93 










35 


Dl 


F03 


91 


94 










36 


El 


F03 


95 


96 











CC 273 Sheet 1 



TYPE 


VCC 


GRD 


930-963 
SN 7401 

FOl-FCM 


14 

4 
4 


7 
11 
11 



LEGEND 




■^YPfOPMICHOCIPCUlT 
MICROCIRCUIT 
REFERENCE GATE NO. 



LBD - SCHEMATIC 


REF.GATENO CONVERSION 


LBD 


SCH 


1-99 


1-99 


A0-A9 


100-109 


BO- 89 


110-119 


C0-C9 


120-129 


D0-D9 


130-139 


E0-E9 


140-149 


F0-F9 


150-159 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


.J0-J9 


190-199 



Figure 1-2-20. Memory Timing Module 
Schematic Diagram (Sheet 1 of 2) 



1-77 



ge-37i/e§--r99 



-<i^ 



TZO TI9 Tie TI7 TI6 TI5 TI4 TI3 TI2 

CI6 z^cps :rici4 ZIZCI3 rrciz rrcn zzz^o drc» 

T — T T T T T T T 






T40 T59 Tie rj7 TJ« T35 TJ4 T53 T3Z T5I 

i — f^f^ , — '~v'Y>-^_X_/-Y>no_X_/>-Y>-\.X_onr»'^A_*'Y>'v^l__rv-vv-vX_^ 
3L4 -r-"'^ -}-"' -T-"° i"« -~-C2e -|-e27 -"-czs ^'-C25 




Tl T2 T3 T« T5 T6 T7 T8 T9 TIO 

— 4 — or^_A_y->nrv-^_4-/"r^rv■^-X--/'>~*'Y^-#-./'YY>-^_X— '*Y>'^^ i 

c. zbc2 i|zc3 rp" drc5 ijzce r^c? ±:ce 



>HI4 >R(b >RI6 



PI P2 P3 P4 P5 P6 P7 pe P9 PIO Pll 

9 9 9 9 9 9 9 



PI6 PI7 Pie 



M34 F03^ 

93 



M35 F03~X 

34 ^V^ 



M3G F03 
95 

E! 




(lED- 



M36 F03~N 

96 V>!2_^ 



diD- 



Mll 949 

99 

A3 




PI2 P13 

9 9 



any 



Figure 1-2-20. Memory Timing Module 
Schematic Diagram (Sheet 2 of 2) 



1-79 



ASR INTERFACE MODULE, MODEL CC-374 



Electrical Parts List 



CC-374 



Ref. 






Desig. 


Description 


Part No. 


CI 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
1 jxF ±5%, 50 Vdc 


70 930 316 037 


C2 


CAPACITOR, FIXED, MICA DIELECTRIC: 
300 pF ±5%, 100 Vdc 


70 930 Oil 239 


C3 


CAPACITOR, FIXED, MICA DIELECTRIC: 
10 pF ±5%, 100 Vdc 


70 930 Oil 105 


C4 


CAPACITOR, FIXED, MICA DIELECTRIC: 
680 pF ±5%, 100 Vdc 


70 930 Oil 049 


C5-C13 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 (jiF ±20%, 50 Vdc 


70 930 313 016 


CIS 


CAPACITOR, FIXED, ELECTROLYTIC-TANTALUM: 
1 i^F ±10%, 35 Vdc 


70 930 217 054 


CR1-CR6, 
CR8-CR24 


DIODE: Replacement type 1N914 


70 943 083 002 


CR7 


DIODE: Replacement type FD777 


70 943 088 001 


LI, L2 


COIL, R. F: 
6. 8 \iH ±10% 


70 939 207 023 


Ml, MIO, Mil, 
M17, M36, 
M43 


MICROCIRCUIT: 

962, triple NAND gate integrated circuit 


70 950 105 006 


M2, M12, M14, 
Ml 8, M44 


MICROCIRCUIT: 

936, hex inverter integrated circuit 


70 960 105 004 


M3, M4, M6, 
MS, M9, M15, 
M16, M21, 
M26-M35, M41 


MICROCIRCUIT: 

F-04, flip-flop integrated circuit 


70 950 100 004 


M5, M13, M25, 
M37, M38, 
M42 


MICROCIRCUIT: 

946, quad NAND gate integrated circuit 


70 950 105 002 


M7, M19, M20 


MICROCIRCUIT: 

930, dual NAND gate integrated circuit 


70 950 105 001 


M22, M23 


MICROCIRCUIT: 

032, quad NAND gate integrated circuit 


70 950 100 032 


M24 


MICROCIRCUIT: 

944, power amplifier integrated circuit 


70 950 105 008 


M39, M40 


MICROCIRCUIT: 

F-03, power amplifier integrated circuit 


70 950 100 003 



1-81 



CC-374 



Electrical Parts List (Cont) 



Ref. 
Desig. 



Ql 



Q2-Q8, QU 



Q9, QIO 



Rl, R3, R5, 
R12, R13, R18, 
R23, R26, R28 

R2 



R4, R6, RU 

R7, R8 

R9, R17 

RIO 

R14 

R15 

R16 

R19 

R20, R21 

R22 

R24 

R25 

R27 



Description 



TRANSISTOR, SILICON, PNP: 
Replacement type 2N3012 

TRANSISTOR, SILICON, NPN: 
Replacement type 2N3011 

TRANSISTOR, SILICON, NPN: 
Replacement type 2N2369 

RESISTOR, FIXED, COMPOSITION: 
IK ±5%, 1/4W 



RESISTOR, FIXED, COMPOSITION: 
750 ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 

1. 5K ±5%, 1/4W 

RESISTOR, FIXED, FILM: 

2. 2K ±2%, 1/4W 

RESISTOR, FIXED, FILM: 
1. 5K ±2%, 1/4W 

RESISTOR, VARIABLE, FILM: 
IK ±10% 

RESISTOR, FIXED, FILM: 
IK ±2%, 1/4W 

RESISTOR, FIXED, FILM: 
360 ohms ±2%, 1/4W 

RESISTOR, VARIABLE, FILM: 
lOK ±10% 

RESISTOR, FIXED, COMPOSITION: 
270 ohms ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 

RESISTOR, FIXED, COMPOSITION: 
4. 7K ±5%, 1/4W 

RESISTOR, FIXED, FILM: 
220 ohms ±2, 1 W 

RESISTOR, FIXED, FILM: 
180 ohms ±2%, IW 

RESISTOR, FIXED, COMPOSITION: 
9. IK ±5%, 1/4W 



Part No. 



70 943 721 002 
70 943 754 002 
70 943 720 001 
70 932 007 049 

70 932 007 046 
70 932 007 053 
70 932 114 057 
70 932 114 053 





70 933 302 007 




70 932 114 049 




70 932 114 038 




70 933 302 010 




70 932 007 035 




70 932 007 056 




70 932 007 065 




70 932 115 033 




70 932 115 031 




70 932 007 072 



1-82 




COMPONENT VIEW 



Figure i-2-21. ASR Interface Module Parts Location 



CG-374 



(my- 




(ao> 



r* y 42-I2- 



MS 946 

13 




M5 946 
18 



6 

-6V 




CCI6> 

(06>-?]27 

(CI4 V 



(HD- 



(£24)- 

(czeV- 



CRI I 
CRIZ 



MIS 936 

28 



MI3 946 

29 

E4 



MIT 962 
30 



-^ 



24-9 



MIS 936 

H32 



M44 936 

33 

ca 



MIS 936 

36 



37 



•5 y 79-11 



M44 936 

38 n-^'2-5 

C2 



M44 936 

34 
C2 



M44 936 

39 



40 



I^ „'^^ 



Mi3946\ 




106-12— MI9 930 



105-12- 
IO2-I2I 



L- 97-10 



Mie 936 
43 






CRI7 

—14- 

CRIS 

— 14- 







MIO 962 
48 




49 

Bl 



M22 032 
51 

C4 




MI2 936 
52 




M6 ro4 



< 



6» 



I M7 930 

63-3-^ 21 




M43 962N, 
15 



MI2 936 
16 



MI3 946 
19 





-GID 



MI4 936^^ 

25 D^— i 

4 7 J 



9-6~=- MI4 936 

'20 



53 

CI 




MI2 936 
54 



UI2 936 
55 



58-i2 
15-9 I 7-4— |: 



< 



.*— (43?) 



I NO 



GRID 
CORD 



-OD 



LEGEND 



MI2 936 

50 

CI 





TYPE OF MICROCIRCUIT 
MICHOCIRCUIT 
REFERENCE GATt NO, 




962 
936 
F04 



930 
F04 
F04 
962 
96? 
936 
946 
93$ 
F04 
F04 
962 
936 
930 
930 
F04 
032 
032 
944 
946 
f04 
f04 
F04 
F04 
F04 
F04 
F04 
F04 
F04 
F04 
962 
946 
946 
F03 
F03 
F04 
946 
962 
936 



I GATt 
2 !79 ! 



I 930-963 
i tfj 7aol 
I SiJ.,1 F2.- 
! i^Ol-FO-'J 



"L« 



LBD - 


SCHEMATIC 




REt^ GATE 


NO CQiMVERSICN 


LBO 


J7 SCH 1 


1 


9S 


1 1 


99 


AO 


A^ 


100 


103 


80 


;tH 


1 DO 


113 


CO 


i:h 


i 120 




DO 


m 


1 no 


T .Ci 


^0 


1-4 


1 M-i 


irj 


FO 


.'-9 


1 1&C! 


109 


GO 


oy 


1 150 


MH 


HO 


H?* 


170 


1/9 


la 


19 


180 


1^9 




jy 


i90- 


599 



Figure i-2-22. ASR Interface Module 
Schematic Diagram (Sheet 1 of 2) 



U8S 



CC-374 




ASSEMBLY OUAWING GR'O 
COORDINATES 



Figure 1-2-22, ASR Interface Module 
Schematic Diagram (Sheet 2 of 2) 



1-87 



CC-375 



HIGH SPEED A-U NO. 1 MODULE, MODEL CC-375 



Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


C1-C5 


CAPACITOR. FIXED, PLASTIC DIELECTRIC: 
0. 033 |jiF ±20%. 50 Vdc 


70 930 313 016 


CR1-CR17 


DIODE: Replacement type 1N914 


70 943 083 002 


M1-M4, M17 


MICROCIRCUIT: 

032. quad NAND gate integrated circuit 


70 950 100 032 


M5, MIO, MI2. 
M20-M23, M25 


MICROCIRCUIT: 

944, power amplifier integrated circuit 


70 950 105 008 


M6, M9, M14, 
M15, M24, M26 


MICROCIRCUIT: 

963. triple NAND gate integrated circuit 


70 950 105 012 


M7, M18, M19 


MICROCIRCUIT: 

937, fast hex inverter integrated circuit 


70 950 105 Oil 


M8, M13, M29 


MICROCIRCUIT: 

961, dual NAND gate integrated circuit 


70 950 105 009 


Mil, M16, 
M27, M28 


MICROCIRCUIT: 

949, quad NAND gate integrated circuit 


70 950 105 010 


Rl, R2 


RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 


70 932 007 056 



1-89 



~£1 
O 



CC-375 



o 
o 

I 

-0 




<! f < >s 






COMPONENT VIEW 



Figure 1-2-23. High Speed A-U No. 1 Module Parts Location 




CC-375 



M 


i GRID 




GATES 


NU 


1 CORD 


TYPE 


12 3 4 5 6 




AB 


032 


1 


? 


4 


5 






■i 


A7 


032 


7 


R 


10 


11 






i 


A4 


03? 


13 


14 


16 


17 






4 


A6 


032 


19 


20 


?? 


73 






b 


E6 


944 


3 


?6 










ti 


E7 


963 


6 


9 


1? 








; 


87 


937 


IS 


IR 


21 


24 


27 


36 


8 


07 


961 


25 


35 










y 


Eb 


963 


29 


31 


32 








10 


G3 


944 


30 


34 










11 


G7 


949 


?R 


33 


44 








12 


F8 


944 


5(1 


51 










13 


F7 


961 


40 


55 










14 


Fb 


963 


3S 


41 


57 








lb 


H7 


963 


56 


57 


58 








lb 


Gb 


949 


39 


42 


45 


49 






17 


88 


032 


37 


46 


54 


75 






IB 


04 


937 


43 


47 


48 


53 






19 


08 


937 


70 


77 


R1 








a) 


84 


944 


59 


m 










21 


E4 


944 


61 


63 










22 


C5 


944 


65 


66 










23 


C4 


944 


64 


68 










24 


Db 


963 


69 


71 


7? 








2b 


F4 


944 


73 












26 


8b 


963 


67 


S3 


84 








27 


C8 


949 


78 


80 


8? 








28 


C7 


949 


74 


76 


79 








29 


H8 


961 


62 











TYPE 


VCC 


GRD 


930-963 
SN-7401 
F01-FO4 


14 
4 

4 


7 

n 
n 



LBD - SCHEMATIC 


REFGATENO. CONVERSION 


LBD 


-CH 


1-99 


l-Sri 


A0-A9 


100-109 


80-89 


110-119 


C0-C9 


120-129 


00-09 


130-139 


E0-E9 


140-149 


F0-F9 


150-169 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


J0-J9 


190-199 



TYPE OF MICROCIRCJIT 
MICROCiRCUIT 
REFERENCE GATE NO. 
ASSEMBLY DRAWING GRID 
COORDINATES 



<:«D 



Figure 1-2-24. High Speed A-U No. 1 
Module Schematic Diagram 



1-91 



HIGH SPEED A-U NO. 2 MODULE, MODEL CC-401 



CC-401 



Electrical Parts List 



Ref. 
Desig. 



C1-C5 

CR1-CR14 
M1-M6 

M7, M22, M23 



M8-M11, M13, 
M14. M18 

M12, M2I 



M15-M17 
Ml 9, M20 
Rl, R2 



Description 



CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 [jlF ±20%, 50 Vdc 

DIODE: Replacement type 1N914 

MICROCIRCUIT: 

032, quad NAND gate integrated circuit 

MICROCIRCUIT: 

937, fast hex inverter integrated circuit 

MICROCIRCUIT: 

944, power amplifier integrated circuit 

MICROCIRCUIT: 

949, quad NAND gate integrated circuit 

MICROCIRCUIT: 

961, dual NAND gate integrated circuit 

MICROCIRCUIT: 

963, triple NAND gate integrated circuit 

RESISTOR, FIXED, COMPOSITION: 
2K ±5%, 1/4W 



Part No. 



70 930 313 016 

70 943 083 002 
70 950 100 032 

70 950 105 Oil 

70 950 105 008 

70 950 105 010 

70 950 105 009 

70 950 105 012 

70 932 007 056 



1-93 



^ 
*■ 




COMPONENT VIEW 



o 
o 

o 



Figure 1-2-25. High Speed A-U No. 2 Module Parts Location 



CC-401 



dEH 



fcio> - 



Ml 032\ (BM> 



(cii> 



CC27> 



QD- 



(IE> 



Cnay 



(My 




TYPE 


VCC 


GRD 


930-963 


14 


7 


SN-7«1 




11 


SUHL-F23 




10 


F01-F03 




11 


F09 




11 



M 


ORID 




GATES 


NO. 


CORD 


TYPE 


12 3 4 6 6 


1 


A8 


032 


1 


2 


3 


4 






2 


C8 


032 


6 


6 


7 


n 






3 


D8 


032 


9 


10 


11 


17 






4 


G8 


032 


13 


14 


16 


16 






S 


F7 


032 


20 


21 


22 


23 






H 


F8 


032 


28 


7» 


SO 


68 






7 


88 


937 


17 


18 


19 


24 


30 


31 


tl 


97 


944 


38 


39 










9 


A7 


944 


36 


60 










10 


D6 


944 


36 


46 










11 


D7 


944 


37 


4S 










12 


H7 


949 


33 


34 


42 








13 


AS 


944 


53 


64 










14 


H5 


944 


47 


69 










16 


C6 


961 


41 


62 










16 


C7 


961 


SI 


61 










17 


E5 


961 


49 


6? 










IB 


E7 


944 


2S 


6B 










19 


G7 


963 


32 


66 










20 


ES 


963 


76 


56 










21 


G6 


949 


40 


S6 


S7 


66 






22 


B5 


937 


27 


43 


44 


67 






23 


F5 


937 


48 


63 


64 









LEGEND 




TYPE of MICROCiRCUIT 
MICROClRCUIT 
REFERENCE GATE NO, 
- ASSEMBLY ORAWING GRID 
COORDINATES 



LSD - SCHEMATIC 


REF. GATENO. CONVERSION 


LBD 


SCH 


1-99 


1-99 


A0-A9 


100-109 


BOBS 


110-119 


C0-C9 


120-129 


D0-D9 


130-139 


E0-E9 


140-149 


F0-F9 


150-169 


G0-G9 


160-169 


H0-H9 


170-179 


10-19 


180-189 


JO-jg 


190-199 



Figure 1-2-26. High Speed A-U No. 2 
Module Schematic Diagram 



1-95 



CC-510A/CC-869 



EXTENDED ADDRESS MODULE, MODELS CC-510A AND CC-869 



Electrical Parts List 



Ref. 








Desig. 




Description 


Part No. 


CI - C6 


CAPACITOR. FIXED, PLASTIC DIELECTRIC: 






0.033 [iF ±20%, 


50 Vdc 


70930313016 


CRl - CR4 


DIODE, SILICON 




70943083002 


Ml, M7 


MICROCIRCUIT: 


937, hex inverter integrated circuit 


70950105011 


M2, M38 


MICROCIRCUIT: 


949, quad NAND gate integrated 






circuit 




70950105010 


M3, M8, M41 


MICROCIRCUIT: 


963, triple NAND gate integrated 






circuit 




70950105012 


M4, MIO 


MICROCIRCUIT: 


03 2, NAND gate integrated circuit. 






Type SN 7401 




70950100032 


M5, M6, M37* 


MICROCIRCUIT: 


944, dual NAND gate integrated 






circuit 




70950105008 


M9 


MICROCIRCUIT: 


961, dual NAND gate integrated 






circuit 




70950105009 


Mil - M13 


MICROCIRCUIT: 


F-04, flip-flop integrated circuit 


70950100004 


M14 - M21* 


MICROCIRCUIT: 


F-01, NAND gate integrated circuit 


70950100001 


M22 - M36, 


MICROCIRCUIT: 


F-03, power amplifier integrated 




M39* 


circuit 




70950100003 


M40 


MICROCIRCUIT: 


F-02, quad NAND gate integrated 






circuit 




70950100002 


Rl - R23, 


RESISTOR, FIXED, COMPOSITION: 62 ohms ±5%. 




R25 - R31, 
R34, R35* 


1/4W 




70932007020 


R24. R32, 
R33, R36* 


RESISTOR, FIXED, COMPOSITION: IK ±5%, 1/4W 


70932007049 



*Model CC-869 does not use M14 - M37, M39, and Rl - R36. 



1-97 



CC-510A 



M I : 



■ * I4t t « ' i4Q^ If 1*1 sj 



rrrrt 



•""•--■^r*** 



agS^ 



— \i3 1~*" f7yi3-i ~| — 1^9 1 — ""^r i h— -i fi n— ^ "— -^ ^t — 1 4 f — ^ * — 1 \h-— " , ——4^ [i-^ ' _' — — j y tr-~ 






■MlM"" ^ 



^¥P' 



' ^P -tA' ^^ :^!^ ^^ :tf% ^^ ^W ^^ ^i^ ^i^ 



^A^ V ^j^g ^^^ ^^M ' ^jfg gjl^ ^jl;^ ^^^ 

: . : : :.ymzj^ : : : ;:::::::=S2::::; : : :: ::::.::: !*-gx3-.: 



mm i 




rrrntt 



hi 



X3, 



COMPONENT VIEW 



Figure 1-2-27. Extended Address Module, Model CC-510A 
(Drawing No. C70025464702, Rev C) 



1-98 



CC-869 






^.^^ _ ^7 ^ 



^Vi 



\iili if I f Hi<ii , 



My^ Ml 



"" -1 a r— -— 



r •TiAfciitiiiiir'mti 



m 



•-nz^Hi. 



"'-iftTiiliii f^"- * 



COMPONENT VIEW 



Figure 1-2-28, Extended Address Module, Model CC-869 
(Drawing No. C 70025464703, Rev C) 



1-99 



MEMORY PARITY BOARD, MODELS CC-558 AND CC-621 



CC-558/CC-621 



Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


CI - C8* 


CAPACITOR, FIXED, PLASTIC: 0. 033 tiF ±20%, 
50 Vdc 


70930313016 


CRl - CR7* 


DIODE, SILICON 




70943083002 


Ml - M4* 


MICROCIRCUIT: 
circuit 


949, quad NAND gate integrated 


70950105010 


M5 - M7* 


MICROCIRCUIT: 
circuit 


963, triple NAND gate integrated 


70950105012 


MB - Ml 2* 


MICROCIRCUIT: 
circuit 


961, dual NAND gate integrated 


70950105009 


M13 - MIS* 


MICROCIRCUIT: 
Type SN 7401 


032, NAND gate integrated circuit. 


70950100032 


M19 - M22* 


MICROCIRCUIT: 


937, hex inverter integrated circuit 


70950105011 


M23, M24 


MICROCIRCUIT: 
circuit 


F-03, power amplifier integrated 


70950100003 


M25 - M34* 


MICROCIRCUIT: 


F-04, flip-flop integrated circuit 


70950100004 


MS 5 


MICROCIRCUIT: 


F-02, NAND gate integrated circuit 


70950100002 


Rl, R2* 


RESISTOR, FDCED, COMPOSITION: IK ±5%, 1/4W 


70932007049 



*Model CC-621 does not use CI, C4. C7, CRl - CR7, M3, M4. M7, M9 
M19 - M22, M25 - M34, Rl, R2. 



M17, 



1-101 



CC-558 



c 



D 



H 



;C-558 



2- 
3- 

4- 

5- 
6- 
7- 




=^ 



Bfcl-BB^ - gp -: i^f^. > ^g . ;^^-y-^g? 




" — : c=:]fe-^ 







,'f5j 



Tsw 



^•^-^yi ^^pf gPl -^^Bp 



liiiiiiiii 




COMP VIEW 



Figure 1-2-29. Memory Parity Board, Model CC-558 
(Drawing No. C 70025966701, Rev B) 



1-102 



CC-621 



A 



u 



G 



H 



2- 

3- 
4- 

5- 
6- 
7- 



m^^im 



;C-55B 



iJUMSwaM 



E^!iC 



» K 









*. I ■# »= -• 



""P? h. '. 



>1 »- ■ 



»• ^ p» ♦ 



"" ' ::"»"!""" »* "" 



3S 



5^= k 



* ^ife^^ ^= I ^^'^ ='% '^ m-t 



-» "* «* 



-« iii * — i * a 






M- mW 



r . 



» I' lli' i E * » = '-=' i . — ' I ' ^=~ 



'•* t~~l ^1^1- 



]• *" ■__ V j^-»— — I ^.---™ ^ ,^ ^ 



r^f"' 



^l^ tiifawi 



•*_ 



t:^: 



'%_r • 



«k* » 



* *-• 



:i _♦ 



* 

• f ♦ f » 






iiiiiiuiiiiiiiiiiiiiiiiiiiiiiiiiiiitiiiiiiiiiiiiiiiiliilr 



COMP VIEW 



Figure 1-2-30. Memory Parity Board, Model CC-621 
(Drawing No. C 70025966702, Rev B) 



1-103 



ac-672 



CABLE PAC, MODEL CC-672 

The Cable PAC, Model CC-672 (Figures 1-2-31 and 1-2-32), contains 16 IK resistors 
and one 2.2 |j.F capacitor. One side of each component is connected to +6V. The other side of 
each component is connected to individual plated-through holes and connector pins. In addition, 
16 plated-through holes (numbers 18-31) are connected directly to 16 connector pins (numbers 
51-66). All plated-through holes can accept No. 24 AWG wire. 

Model CC-672 
Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


CI 


CAPACITOR, FIXED, ELECTROLYTIC: 2. 2 m-F ±20%, 
35 Vdc 


70930217017 


Jl, J2 


WIRE, TINNED; No. 24 AWG 


70940001020 


R1-R16 


RESISTOR, FIXED, COMPOSITION: IK ± 5%, 1/4W 


70932007049 


-- 


SLEEVING, ELECTRICAL 


70981003814 



1-105 



CC-672 



INDI6 18^ 

INDM 17^ 



IND 15 20 ^ 

IND 07 19 ^ 
IND 14 22^ 



IND06 21^ 

INDI3 24 ^ 

IND05 23^ 
INDI2 26^ 



IND04 26 ^ 
INDII 28 ^ 



IND03 27^ 



INDIO 30 < 



IND02 29 ^ 
IND9 32^ 



IND 01 31 ^ 
+ 6V 34^ 



CI 



GRD 33^ 

SDR0I 10^ 



Rl R2 R3 R4 R5 R6 R7 R8 R9 RIO Rll RI2 RI3 RI4 RI5 RI6 



SDR09 9^ 

SDR02 12^ 

SDRIO 11^ 

SDR03 14^ 
SDRII 13^ 



SDR04 16 ^ 
SDR 12 15^ 



SDR 05 Z^ 
SDR 13 1^ 



SDR 06 6^ 
SDR 14 3^ 



SDR07 4^ 

SDRI5 5^ 

SDR08 8^ 

SDRI6 7^ 

BS9S7 



-H5) 




6RD 



+6V 



Figure 1-2-31. Cable PAC, Model CC-672, Schematic Diagram 



1-106 



CC-672 




ETCH VIEW 




COM P. VIEW 



Figure 1-2-32. Model CC-672 Parts Location 



1-107 



CC-681 



CABLE PAC, MODEL CC-681 

The Cable PAC, Model CC-681 (Figures 1-2-33 and 1-2-34), contains 17 IK resistors 
and one 2,2 |j.F capacitor. One side of 11 resistors (Rl-Rll) is connected to +6V, and six 
resistors and one capacitor are connected to -6V. The other side of each component is con- 
nected to individual plated-through holes and connector pins. In addition, 14 plated-through 
holes (numbers 11-22, 25, 31) are connected directly to 14 connector pins. All plated- 
through holes can accept No. 24 AWG wires. This PAC is used with the bottom harness 
and can be used in the Model 316 ruggedized computer. 



JMoaei UL>-b»i 
Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


CI 


CAPACITOR, FIXED, ELECTROLYTIC: 2, 2 )j.F ± 20%, 
35 Vdc 


70930217017 


J1-J3 


WIRE, TINNED: No. 24 AWG 


70940001020 


R1-R17 


RESISTOR, FIXED, COMPOSITION: IK ± 2%, 1/4 W 


70932114049 


— 


SLEEVING, ELECTRICAL 


70981003804 



1-109 



CC-681 



CLBMP- 11^ 

CLAMP- 12^ 

CLPMP- 13^ 

CLMMP- 14^ 

SENS I + 15^ 

MASTO- 16^ 

SENS2+ 17^ 

LMPRN- 18^ 

SENSI- 19^ 

SENS2- 20^ 

SENS3- 21^ 

SENS4- 22^ 

SENS3+ 25^ 

SENS4+ 31^ 

MSTCL- 1^ 

ENTRB- 2^ 

ENTRA- 3.^ 



ENTRP- 4 ^ 

ENTRM- 5^ 

MEMAC- 6 ^ 

PFHLT+ 74- 

STEPP- 8^ 

RUN MD 9 ^ 

READY- 10^ 

START+ 23^ 



Rl 



R2 



R3 



R4 



R5 



R6 



R7 



R8 



R9 



RIO 



Rll 



r<5) 
-© 



® 



® 



® 



+ 6V 34^ 

-6V 32^ 



GRD 33 



X 



CI 

2.2 Hf 
35vdc 



DSPLM+ 24^ 

DSPLA + 26^ 

DSPLO+ 27 4" 

DSPLX+ 28^ 

DSPLY+ 29^- 

DSPLB+ 30^ 



RI2 



RI3 



RI4 



RI5 



RI6 



RI7 



@ 



Figure 1-2-33. Cable PAC, Model CC-681, Schematic Diagram 



1-110 



CC-681 



*VUViW%SWAWAVW.VVA 





33 53 59 62 56 39 50 36 

i3^ 63# 5I# A7% 43# 54^ 48# 46l 




ETCH VIEW 



COMR VIEW 



Figure 1-2-34. Model CC-681 Parts Locations 



1-111 



CHAPTER II 
CSM-160 CORE MEMORY MODULE 



SECTION 1 
DESCRIPTION 



The CSM-160 Core Memory Module is a high-speed, digital storage device capable of 
storing a maximum of 16 bits of information in 4096 locations, expandable to 16, 384 loca- 
tions in increments of 4096. Data is stored in an array of 30 mil ferrite cores. Selection 
of address is accomplished by use of conventional four -wire coincident-current techniques. 
The switching time of the cores and the frequency characteristics of the driving and logic 
circuitry permit a full-cycle time of 1. 6 (as. The memory does not contain a data register 
or a timing generator. Memory address signals are received from the address bus at the 
beginning of any memory operation. The appropriate timing signals are also received and 
the selection of a location is accomplished in the memory core array. During a memory 
load (clear-write) cycle, data are supplied to the memory from the computer and stored at 
the selected address. During a memory-unload (read-regenerate) cycle, the data word at 
the selected location is first transferred to the computer and then regenerated (rewritten) 
into the core array. 

SYSTEM LAYOUT 

The system consists of modular connector BLOC assemblies holding groups of |x-PACs 
The solderless-wrap connector assembly is a single piece of molded, glass -filled phenolic 
capable of holding eight |j.-PACs, The memory module is contained in three connector 
assemblies arranged in a 1x3 connector plane. 

The core stack is a plug-in unit requiring six |jl-PAC connectors, three on each side 
(Figure 2-1-1). The stack assembly is made up of four glass epoxy boards, each containing 
four core mats of 4096 cores interconnected to make a stack of 16 bit words. 

LOGIC SIGNAL LIST 

Logic signals used in the memory are identified and defined in Table 2-1-1. Positive 
signals (+6V) are labeled "+", and ground signals (OV) are labeled "-", Amplified signals 
have a letter following the polarity indicator (e.g., XXXX+A). 



2-1 



^j-nj- 



C04 



q_jm 



B04 



■i_pi_r 



A04 



SEE NOTE 2 



SEE NOTE i 



xeos TO xeoe 

fnyrm— timni 



-n^ r": 



veos I 

TO I 

YBOSI 



IRY 



>".— 7^5 ?"«^T^. 7"<r-7"<^ 7"^ 




BITS! 



"^^"'" ^' ^o'-^f7 



:rr 






YSOI I 
TO I 
YB04 



rn 





■ BIT) 



ti---ti 




^5— ?"t /"« »"t 7"^— j'^t 7"r 




BITI 



••-r= — 'r?' ^^7^ 



^^'^^s^' ^r 



BIT 13^ 





-j'- 





'BIT 16 



^^' ^^^ 









Jl- 



^n'— ^5-7' »r7^ 




XO X62 

XBOI TO XB04 



Irx 



C06 



B06 



n--n 



A06 



I. VIEWED FROM CORE MAT SIDE. 

2 CENTER BOARDS NOT PRESENT FOR AN 8- BIT STACK. 

3. X0-XS3 a Y0-YB3 ARE DEFINED AS THE CURRENT 

SOURCE END AT READ TIME. X0-X63 « Y0-Y63 ARE 
DEFINED AS THE CURRENT SINK AT READ TIME. 



Figure 2-1-1. Stack Coding Diagram 



2-2 



♦jo.isK'Ho.ish' 



^ 


^ 



0.5 



^ 



Mnemonic 

BANK- A through D 

INHBX+ 

M01FF+ to M16FF+ 

MAD05- to MAD16- 

MADCL- 

MBSYX+ 

MEMCI+ 

MMOIF- to MM16F 

MSTCL- 

RMBSX- 

RTDL- 

RZ01+ to RZ16+ 

STROB- 

SW01+ tp SW16+ 

SWCYX- 

UNSL- 

UNSL+A through C 

WRITE - 

XB01+ to XB08+ 

XCSR+ 

XD01+ to XD16+ 

XRSW- 

XTIMG+ 

XWSW- 

XYRE- 

XYWE- 

YB01+ to YB08+ 

YCSR+ 

YD01+ to YD 16+ 

YTIMG+ 

ZW01± to ZW16± 

SPECIFICATIONS 



Table 2-1-1 
Logic Signal List 

Name 

Memory Bank Select 

Inhibit Command 

Memory Module Data Inputs 

Memory Address Inputs 

Memory Address Clear Command 

Memory Busy Signal 

Memory Cycle Initiate 

Sense Amplifier Output Pulses 

Master Clear Pulse 

Reset Memory Busy Pulse 

Reset Timing Delay Line Pulse 

Inhibit Winding Termination Resistors 

Sense Amplifier Strobe 

Sense Windings 

Start Write Cycle Pulse 

Unit Select Command 

Unit Select Signal 

Write Enable Signal 

X-Bus Selection Outputs 

X-Current Source Resistor 

X -Drive Selection Outputs 

X-Read Switch Signal 

X -Read/Write Timing 

X -Write Switch Signal 

X & Y Read Enable Signal 

Y-Read Switch Signal X & Y Write Enable Signal 

Y-Bus Selection Outputs 

Y -Current Source Resistor 

Y -Drive Selection Outputs 

Y -Read/Write Timing 

Inhibit Windings 



Capacity 

4K randomly addressable 16 -bit words, expandable to 16K in 4K increments. 



2-3 



Storage Mode 

Coincident-current nnagnetic 
core array (3D, 4-wire) 
XO through X63 X Drive Line 

YO through Y63 Y Drive Line 

Cycle Tinne 
1 . 6 (xs 



Input Levels 

Positive (Passive): +2.4Vto+6.3V 
Ground (Active): OV to 0. 5V at 2. mA 

(max) 

Output Levels 

Positive (Passive): +6. 3V max at mA; 

+ 3. OV to +5. OV at 0. 3 mA 
Ground (Active) : +0. 5V max at 13.6 mA 



Memory Cycle Timing 

For each cycle, the computer must provide the memory with an address and a read or 
write indication, and provide the timing circuits (located outside the memory) with a start 
signal. Once the cycle has been initiated, another cycle cannot be started until 1. 6 |i.s has 
elapsed. During a read cycle, information will be available no more than the time presented 
in Figure 2-1-Z. If the memory is performing a write cycle, information nnust be made 
available to the memory within the time specificied in Figure 2-1-2. Interface connections 
are shown in Section 4 (LBD 80. 06). 



2-4 



YTIMC+-(YRWT-(-) 
INPUT 

XT1MG+(XRWT+) 
INPUT 



STROB— (STRB-) 
INPUT 



MMXXF-(SDXX-) 
OUTPUTS 



WRITE-(WRIT-) 
INPUT 



MXXFF+(DRXX+) 
INPUTS 



MADCL-B(ARRC-) 
INPUT I 



































) 




A.i4.n-i7n .^ 














s^n "^co 












) 




""""■^ — ■— — 
















105-135 
































75 - 125 



40 MAX 



■30 MAX 



MADXX-MAXX- -1 
INPUTS 

MIN 



«— » 



80 MIN 



BANK-X 
INPUTS MIN 



MBSYX+(MBSY+) 



INPUTS 



50-O- 



eo MIN 



NOTE 

1 ALL TIMES MEASURED AT THE +I.5V LEVEL. 

2 CSM-160 NOMENCLATURE IN PARENTHESIS. 

3 PULSE WITH 80NSEC AT + .5VAND 400NSEC 
AT +8.0V 

4 ALL TIMES IN NANOSECONDS 



20-50- 



30-60 



60 MIN 



^0-! 



I*-* 



50 



0-50 



•—J 0-50 



Figure 2-1-2. Interface Timing Requirements for all Units 
Except A70023577705 (70942507002 Stack) 
{A70110011397, RevG) 



2-5 



SECTION 2 
PRINCIPLES OF OPERATION 



PRINCIPLES OF MAGNETIC CORE MEMORIES 

Magnetic Core Storage 

The memory core stack, housed in the magnetic core unit, is a matrix configuration 
of individual (30 mils O.D.. 18 mils I.D.) ferrite cores. Basically, the ferrite core 
is a 1-bit storage element in the form of a ferrite ceramic ring that can be magnetically 
saturated to either positive of negative flux density. The ferrite material retains a large 
part of the magnetic flux developed at the time the core is saturated which is an important 
characteristic of the core. The time required to switch a core from one polarity or state 
to another is primarily dependent on the core material and size. Consequently, cores 
measuring only tenths of an inch in diameter are used in the memory core array to permit 
fast switching speeds. 

A similarity exists between the magetic core and the flip-flop in that both provide 
storage for one bit of data. The two extremes of saturation in a magnetic core represents 
ZERO and ONE, as do the two stable states of a flip-flop. A core can be set to a ONE 
state by the application of a current pulse of similar magnitude applied in the opposite 
direction. Similarly, a flip-flop is set or reset by applying pulses to the appropriate inputs. 
Both the magnetic core and the flip-flop provide memory of the last pulse applied, but the 
core does so without requiring power to hold its state. 

The ferrite core has a nearly rectangular hysteresis loop. The hysteresis loop 
is a graphical representation of the flux density produced in a magnetic material, plotted 
against the magnetizing force that produces it. Figure 2-2-1 is a simplified drawing showing 
the generation of a typical ferrite core hysteresis loop. Starting With an unmagnetized 
core, an increase in magnetizing current (H) increases the flux density (B) along the 
S- shaped curve (A). The flux density levels off when the core is saturated, and any 
additional current applied does not appreciably increase the flux density because the core 
material is supporting as much flux as it can. As the current is decreased, then made to 
flow in the opposite direction, the flux does not collapse along the same line (B); and 
most of the flux remains even after the current has fallen to zero. The amount of flux 
actually remaining is a function of the retentivity of the magnetic material. As a magnetiz- 
ing current is applied in the opposite direction, it has little effect on the flux level until 
the current reaches the knee of the hysteresis loop. 



2-7 



■i-B 



It 



•+H 



As Positive Current Increases 
Rising Flux Density is Limited 
by Core Saturation 



B 



8 




+ H 




Most of the Flux Remains after the 
Current is Removed. 



As Negative Current Reaches the 
Switching Point, the Core is Driven 
to Negative Saturation 




-^ + H 



As with Positive Current, when Negative 
Current is Removed, Most of the Flux 
Remains 




Thus, the Core is always Saturated 
in the Positive or Negative Direction 



Figure 2-2-1. Ferrite Core Hysteresis Loop 



2-8 



A slight increase in current beyond the knee of the curve switches the core rapidly 
to negative saturation (C). The point on the curve representing the amount of current 
required to change the state of the core is termed the coercive current. When the negative 
magnetizing current is remioved, most of the flux is retained as before (D). Note that the 
original sweep from a magnetically neutral condition is never repeated (E). A memory 
core in coincident-current use is never in a neutral condition, but is switched from one 
saturated state to the other. The core is thus an extremely useful binary component 
because it can exist in either of two stable states and can switch rapidly from one to the other. 

For any given toroidal magnetic core, the necessary magnetomotive force required 
to effect switching is a function of the product of the number of turns of wire and the current 
driven through those turns. It is not economically feasible to wind multiple turns of wire 
around the small toroidal cores used in core memories; rather the number of turns is 
reduced to two, one in each of the perpendicular driving coordinates, and the current in these 
coordinate wires is of such a magnitude as to cause switching (rapid flux change) to occur. 

In addition to the perpendicular (X and Y) coordinate selection lines, each core is 
also threaded by two other wires, each of which passes through every core in a plane. One 
is the sense winding, which detects flux-change due to switching of a core and thus provides 
a readout signal from the plane. The other winding is the inhibit winding which is used, as 
its name suggests, to inhibit or prevent the writing of a ONE into the core, thereby causing 
ZERO to be stored. A single memory core, with its associated control windings is illus- 
trated in Figure 2-2-3. 

A disadvantage of the mennory core is that it does not provide a static indication of 
its state, as does a flip-flop. To obtain an indication of the condition of the flux in a memory 
core, the state of the core must be switched. 



SENSE LINE 




X-LINE 



INHIBIT (Z) LINE 



Figure 2-2-2. Core Control Windings 



2-9 



Yn 



\ / ^ ^^^ 



^V 



^^^ 7^ ^^(- 



-^ HALF-CURRENT 



HALF- CURRENT 



Figure 2-2-3. Coincident -Cur rent Selection 

Information Sensing 

Sense lines allow the reading of information stored in the cores. One sense line 
(Figure 2-2-2) is threaded through all memory cores of each mat. 

To read any of the words stored in memory, half-currents in the proper direction are 
generated in the selected X- and Y-lines (Figure 2-2-3). The read half-currents combine 
at the coincident junction of the X- and Y-lines to change the state of the affected core in 
each memory mat. If the affected core is storing a ONE at that instant, the effect of the 
read half-currents will change the state of the core to ZERO. If the core was previously 
in the ZERO state, the read half-currents will have no effect on the core. When the core 
is switched from the ONE to the ZERO state, the rapid change in flux from positive satura- 
tion to negative saturation induces a voltage pulse in the corresponding sense line. Therefore, 
the presence of a voltage pulse in the sense line during the read operation indicates that a 
ONE has been stored in the indicated core. If no voltage pulse occurs in a sense line during 
read operation, a ZERO is indicated. The sense lines designated SWOl through SW16 in the 
memory core stack are connected to sense amplifiers. A ONE input to any of the sense 
amplifiers is amplified and applied to the information register. Thus, output data is trans- 
ferred from its storage location in the core stack to the information register. 



2-10 



Addressing 

The complete core stack for a magnetic core unit consists of a number of individual 
matrices or mats. Each mat contains memory cores assembled in a rectangular configu- 
ration. The memory cores are threaded by X- and Y-lines in each mat so that one memory 
core is physically located at each junction of an X-line and Y-line. 

As previously stated, pulses of current applied along the X- and Y-lines switch a 
memory core from one state to another. If one-half of the current required to switch a 
core is applied along the X-line, and one-half of the necessary current is applied along the 
Y-line, the core situated at the junction of the energized X- and Y-lines will receive the full 
switching current. This type of operation is termed coincident-current operation. 

A coincident-current magnetic core memory depends upon the coincidence of two 
half-currents to read data from or to write data into the cores. Two additive half-current 
pulses will set the core to the ONE state, while two half-current pulses applied in the 
opposite direction will reset the core to the ZERO state. A core with two half-current 
inpnits is essentially an AND circuit requiring that half-current be applied to both X- and 
Y-lines in the same direction to change the state of the flux at the core. A half-current 
applied to one line without a similar half-current applied to the other line has no effect on 
the core. 

Only one X-line and one Y-line of a mat are energized during a single cycle, and 
only that core situated at the junction of the activated X- and Y-lines will respond to the 
coincident half-current pulses. Therefore, only one core in each mat will be affected 
during a single cycle. A simplified diagram of coincident-current selection of a memory 
core is illustrated in Figure 2-2-3. In effect, the X-line selects one row (X-row), and the 
Y-line selects one column (Y-column). 

In coincident-current memories, the X- and Y-lines are wired in series through 
all naats of the memory core array. Thus each X-line and each Y-line threads correspond- 
ing rows or columns of cores in all memory mats. Energizing one of the X-lines (desig- 
nated X] through X in Figure 2-2-3 supplies a half-current pulse to the appropriate row of 
cores in every mat. Similarly, energizing one of the Y-lines (designated Y, through Y ), 
supplies a half-current pulse to the appropriate column of cores in every plane. When 
pulses occur simultaneously on two lines (X and Y), they select the same core position in 
each of the planes. Therefore, the X- and Y-lines select a word in the memory core array 
and enable read or write operations. 



2-11 



Writing 

Inhibit lines are used to enable a computer word or instruction to be written into 
memory at a selected address location. A single inhibit line is threaded through each 
memory core in a mat (Figure 2-2-2) and each mat of the magnetic core stack requires an 
individual inhibit line. 

To write information into memory, half-current pulses in the direction opposite to 
those generated for read operation are applied to the selected X- and Y-coincident junction 
to switch the affected core in each memory plane. 

Since all the cores at the selected address have been cleared to the ZERO state 
prior to the application of the write half- currents, the write half-currents operate to 
switch all cores to the ONE state. If the incoming data dictates that a ZERO is to be written 
into a specific core, some means must be used to prevent the core from switching to the 
ONE state when the write half-currents are generated. This is accomplished by the inhibit 
(Z) lines designated ZWOl through ZW16. An inhibit pulse, when transmitted through the 
inhibit line of the memory plane at the same time that the write half-currents are applied 
through the X- and Y-lines, prevents the writing of a ONE because the inhibit current 
subtracts from X- and Y-write current. 

The inhibit pulse is of the same magnitude but of the opposite polarity to the write 
half-current pulses. Therefore, the inhibit pulse directly cancels the effect of one write 
half-current pulse. The net effect of the two write half-current pulses and an inhibit pulse, 
is equivalent to a single write half-current pulse on the addressed core. This prevents the 
core from switching from the ZERO to the ONE state. 

Information to be written into memory is stored in the information register prior 
to being transferred to the memory core stack. During the transfer operation, a passive 
signal from the register flip-flop will prevent the generation of an inhibit pulse whereas an 
active signal from the register flip-flop allows an inhibit pulse to be generated. In this way 
information is rewritten (or new information is written) into the selected memory location 
exactly as it appears in the information register, 

CORE STACK CONFIGURATION 

The storage array is organized about a conventional four-wire "3D" configuration 
where 4096 addressed cores are made available by the intersection of 64 X lines and 64 Y 
lines in each bit area. 

ADDRESSING AND SELECTION 

Addressing-Random Access 

The memory address register consists of cross-coupled flip-flops located on the 
CM-306 Selector PAC. Data received by the 12 single-ended, address input lines (MAD05 
through MAD 16) will set the flip-flops and a reset pulse (MADCL-) will commonly reset 
all the flip-flops at the end of the cycle. The address flip-flop outputs control the drive line 
selection circuits. Section 5 contains a detailed description of this PAC. 



2-12 



Decoding and Selection 

Figure 2-2-4 is a simplified diagram of the address decoding and selection for a typical 
bit of a 4K memory. Three address bits are transferred to the X switches and three others 
to the X sinks. The X switches uniquely enable one of eight read/write line pairs going to 
the diode matrix; the X sinks select one of eight read/write busses. The selected buss enables 
one end of eight drive lines, each of which has its other end connected to an enabled diode 
matrix. Thus, only one of 64 X lines has been selected. The Y-line selection is accomplished 
in a similar manner. 

Figure 2-2-5 is a simplified schematic diagram of the X decoding and selection matrix. 
Two diodes per line isolate a single line when selected. Consider a read- regenerate cycle 
involving drive line X60. During the read portion of the cycle, X read switch (Ql) and X read 
sink (Q4) are selected by related address register outputs. These selection outputs are turned 
on when read timing pulses XRSW-forthe switch and XYRE- for the sink go to OV. Read current 
then flows in line X60 from +15V through Rl, Ql, CRl, CR2, X60, and Q4 to ground. 
Read current ceases to flow when signals XRSW- and XYRE- return to +6V. During the 
write portion of the cycle the addresses do not change. Write timing pulses XYWE- for the 
sinks and XWSW- for the switches are generated. When these signals go to OV, sink Q2 and 
switch Q3 are turned on. Write current then flows from +15V through Rl, Q3, CR3, line 
X60, CR4 and Q2 to ground. Write current ceases when signals XYWE- and XWSW- return 
to +6V. At the end of the cycle, the addresses will change and, by similar manner, the 
remainder of the X lines will be selected. 

The Y- selection matrix is similar to the one described with the exception of being 
decoded by different addresses and command signals. For a detailed description of the 
CM-306 Selector PAC, refer to Section 5. 

TIMING AND CONTROL 

Section 4 contains the timing and control logic diagrams to illustrate the logical func- 
tions associated with the control and distribution of memory timing pulses. Interface 
timing is presented in Figure 2-1-2. 

OPERATING MODES 

Read-Regenerate Mod e 

Memory interface signals are provided by the CPU or the memory expansion option. 
When the Selector PAC control pulses XRSW- and XYRE- are generated, the sinks and 
switches are turn on. Stored data present in the address register will be read out 
(Figure 2-2-6). The sense amplifier strobe input (STROB-) will sample the data. If a 
ONE was stored at that address, the sense amplifier associated with that bit will produce 
an output, setting the data registers external to the memory module. The set side of the 
data registers (MXXFF+) will be presented to the input of the inhibit drivers and disable it. 
If a ZERO was stored at that address, no output will occur. The data register will remain 
reset and enable the inhibit drivers. During the write portion of the cycle, the selector PAC 



2-13 



I — ' 



ADDRESS 

INPUTS 
(MAOI- THRU 
MAI2-) 



7465 



rCM-306 
1 


AR01 + 


1 1 xnoi 


rcORE STACK 
1 . 1 


XO 








1 




1 

1 


3 

ADDRESS 

FLIP-FLOP 


X 

DRIVE 
OUTPUTS 


1 • 1- 

|XD02 1 


X DIODE 
MATRIX 
8 F-08'» 


xt 1 






1 
1 


AR02 + 


|XD03 1 


X2 I 








1 1 — 

1 

1 


AR03± 


1 1 1 

XDI6 I 


X'63 1 












1 

1 YDOI 


— 1— 










1_ 


















1 

1 

1 , , 


fcM-306 


AR07 + 




YO 


1 


1 

1 
, 1 


3 

ADDRESS 
FLIP-FLOP 


Y 

DRIVE 
OUTPUTS 


-1 ■ (— 

|.YD02 1 


YDIODE 

MATRIX 

8 F-0 8'$ 


y7 




1 

1 


AR08± 


Y003 


Y2 






1 

1 


H — ! — 1 

! 1 

YDI6 1 


i 
Y63 






1 

1 


1 

1 

L 


AR09 + 






1 


1 

XBOI 


— r 


XO r-- 








A 










1 


^-306 


AR04± 





1 
1 , 


1 
1 
1 


3 

ADDRESS 
FLIP-FLOP 


X 

DRIVE 
OUTPUTS 


1 h- 

XB02 


8X 

BUSSES 


X 1 ] 












AR05* 


XB03 . 


X2 


_ 










,i — 1 — 
1 

1 
1_ 


AR06± 


! 1 
xb'os 


x'ea I 














1 1 






-• 1 
1 1 

1 YBOI 1 , 


YO 


~~~ 




—^ 


— 1 










1 


-CORE ARRAY 


-ci 


^-3a6 


ARIO± 








1 

1 


3 

ADDRESS 

FLIP-FLOP 


Y 

DRIVE 
OUTPUTS 


1 YB02 


BY 
BUSSES 


Yl 






ARll-^ 


{ YB03 


Y2 






1 1 — 

1 


ARI2i 


1 i 1 

! YB08 1 








1 




yIss 




1_ 






J 


L_ 







— 


— 




_l 



Figure 2-2-4. Address Decoding and Selection, Simplified Block Diagram 



READ OR 
WRITE COMMAND 

ADORES^ 



X READ SINK 
OR X WRITE SW 
COMMAND I 

ADDRESS 




Figure 2-2-5. Decoding and Selection Matrix, Simplified Schematic 



2-15 



control pulses (XRSW- and XYWE-) are generated, and X- and Y-line currents are once 
again established. When the inhibit pulse (INHBX+) is generated, a ONE will be inserted 
into the stack if the inhibit drivers were disabled. A ZERO will be reinserted if the drivers 
were enabled. 

Clear -Write Mode 

The clear-write mode operation is identical to the read-regenerate mode except the 
sense amplifier strobe signal is not generated. Without the sense amplifier strobe, data 
stored in a selected address are destroyed. During the write portion of the cycle, new 
information stored in the data register is inserted in the core stack in the same manner 
that information is regenerated. 

INTERFACE TIMING 

The interface tinning for the read-regenerate and clear-write modes is shown in 
Figure 2-1-2. The timing distributor does not form an integral part of the memory system, 
therefore, with the exception of signals XYRE-, XYWE-, XRSW-, andXWSW-, all signals, 
whether used internally or as commands, are classified as interface timing. 

The address inputs (MAD05 through MAD 16-) must be present for all cycles for the 
duration shown on the interface timing diagram. The data lines (MO 1FF+ through M16FF+) 
must be stable for the duration of the INHBX+ pulse as defined on the timing diagram for 
a read-regenerate or clear-write cycle. 

MEMORY RETENTION 

The magnetic core array does not require power to provide a static memory 
capability. A pulse of power is required to switch cores from one state to the other, 
but the pulse is not necessary to hold cores in their respective states. All cores remain 
in the state to which they have been switched because of material retentivity in the core. 
If power is removed or lost, the magnetic core array retains stored information 
indefinitely. 

The turn-on sequencing of the main power supply is designed to allow the +15 voltage 
to remain off until the +6V and -6V logic supplies are stabilized. Similarly, the +15V 
supply is turned off before the logic supplies go out of regulation. This feature ensures 
that no current can flow during the power supply turn-on and turn-off transients providing 
memory input commands are quiescent which might change data previously stored in the 
core array. 



2-16 



I DATA RESISTER 

I ( NOT INCLUDED IN THE 
CSM MEMORY MODULE) 



CORE 
STACK 



SWOI- 



SWOI — 



STRB- 




ZWOI + 



INHB + 



Figure 2-2-6. Regeneration Loop, Simplified Diagram 

INTERFERENCE FROM MAGNETIC FIELD 

Fan motors or power supplies having large magnetic fields should not be mounted 
close to the core stacks (some fan motors have fields that exceed 10 gauss). Reliable 
memory operation is guaranteed only if the peak magnetic field is held below 3 gauss 
in the region of the core mats. 



2-17 



SECTION 3 

MAINTENANCE 



This section contains data on preventive and corrective maintenance, service and repair 
for the H316 Magnetic Core Memory Module. Detailed PAC descriptions are included in 
Section 5 of this chapter. 

TOOLS AND TEST EQUIPMENT 

Table 2-3-1 lists the tools and test equipment required to service the memory. 
Detailed information on wire-wrapping tools and procedures is contained in the Instruction 
Manual for Solderless Wrapping of |j.-PAC Digital Modules, Doc. No. 70130071371. 

RECOMMENDED SPARE PARTS 

One spare PAC of each type specified in Section 4 (LBD 80. 08) is recommended as a 
spare part. Two F-08 microcircuits (70950100008) are recommended as spare parts if a 
spare corestack is not purchased. Section 5 contains parts lists for all PACs in the memory. 

PAC HANDLING AND REPAIR PROCEDURES 

Inserting and Removing System PACs 

The fi-PAC connector is polarized to protect against incorrect PAC insertion. 
M-'PAC removal from the memory is accomplished by engaging the two holes in the handle 
of the PAC with the fi -PAC extractor tool. Do not remove or insert printed circuit cards 
without turning off the dc power to the unit. 



PAC Troubleshooting 



£. 



The Extender PAC, Model XP-330, can be used to gain access to points on the (jt-PACs. 
Signals on the pins of the |a -PACs may be ascertained from the PAC descriptions contained 
in Section 5. 

Component Checking 

Many K-PACs have identical channels. Components can be checked by resistance 
comparison with parts on other channels or other ^ -PACs. 

Component Replacement 

When replacing defective components, use a low-wattage soldering iron and rosin core 
60/40 solder. Remove excess solder from the printed circuit board. Care should be taken 
to avoid lifting the etch. 



2-19 



Table 2-3-1 
Tools and Test Equipment 



Quantity 



1 
1 
1 
1 
1 
1 

1 

1 

1 

25 ft 

1 

25 ft 

1 



Description 



Oscilloscope 

Dual- Trace Preamplifier 

Multimeter 

Card Extender PAC 

jj, -PAC Extractor Tool 
AC Current Probe 

Hand Wire -Unwrapping Tool 

Hand Wire -Wrapping Tool, 
Battery Operated 

Wire Stripper 

No. 30 AWG Solid Wire 

Quick Disconnect Terminal 
Crimper 

No. 3 AWG Twisted- Pair 
Solid Wire 

Precision DC Voltmeter 



Type (or Equivalent) 



Tektronix 585 

Tektronix 82 

Simpson 260 

XP-330 

B008428 

Tektronix P6016 probe and 
passive ternciination (or type 131 
amplifier) 

70 917 202 001 (Gardner-Denver 
505084-LH) 

70 917 200 001 (Gardner-Denver 
No. 14R2) 

70 917 250 001 (Ideal 45-179) 

70 940 061 010 

T and B WT 145 

70 940 402 002 

Weston Model 931-1905003 
30/7 5/3 volts, ±1/2%, 
1000 ohms /volt 



Insert the leads of the new component through the drilled hole or eyelet, clip off 
excess wire, and solder to the printed circuit etch. A flat pack should be placed squarely 
on the etched area, using an insulator between it and the |j,-PAC (except F-33 use Insulgrease 
instead of insulator). The leads should then be cut to the proper length and soldered. 
Examine the PAC carefully for excess solder. Remove rosin deposits with a commerical 
cleaning solvent and wipe the PAC clean with a dry lint-free cloth. 

MAINTENANCE INSPECTION 

Conduct a visual inspection periodically. Watch for accumulation of dust, dirt, 
improperly seated PACs, and damaged or improperly dressed cable and signal leads. Check 
to see that all connectors are securely mated and that the cooling fans are operating properly. 
Clean fan filters periodically. Do not clean core stack with air hose. 

PREVENTIVE MAINTENANCE PROCEDURE 

The memory is thoroughly tested at Honeywell Inc. , Framingham, Mass. , 
prior to shipment. All planes are tested simultaneously under all ZEROs, all ONEs, and 
worst-pattern conditions. The drive currents and strobe timing are set so that optimum 
operating margins result. The memory should be tested periodically, as a preventive 
maintenance procedure, by using a memory test program. 



2-20 



Memory Drive and Inhibit Voltage Calibration 

The memory drive and inhibit currents are determined by the setting of the +16 Vdc 
supply and the CM-384A precision resistors. The +16V supply setting should be periodically 
checked by using a voltmeter capable of reading the voltage within ±1%. Measurements 
should be made at the memory terminals while a program is running in the memory. 

The +15 Vdc supply should be within the following ranges as a function of stack inlet 
ambient temperature. 

Temperature +15 Vdc Range 

0°C +16.0 ± 0.6V 

25°C +15.0 ± 0.8V 

50°C +13.8 ± 0.6V 

The memory may be operated at marginal +15 Vdc supply for corrective or preventa- 
tive maintenance purposes. The diagnostic program should contain at least the worst 
pattern (exclusive-OR of MAO 1-, MA03-, MA04-, MA07-, MA09-, and MA10-), all ONEs 
and all ZEROs. Failure points at high +15V setting (do not exceed+17. 5V) and low +15V 
setting should be noted; their differences should be at least 1. 6V at 0°C and 25°C and 1. IV 
at 50°C. The +15V supply may be set at the center of the failure point margins or at the 
values shown above . 



Strobe Timing Calibration 

The timing of the sense amplifier strobe pulse is set for each unit to give optimum 
operating margins. It should not be necessary to adjust the strobe timing. If a change in 
timing is required to obtain proper mennory operation, the associated PACs should be 
checked (e.g., CM-306, CM-305) before a timing change is made. The CC-373 description 
in the Appendix should be referred to if a timing change is required. The STROB- pulse should 
be between 150 ns and 200 ns wide at the 1.5V points. 

CORRECTIVE MAINTENANCE PROCEDURES 

Memory system troubleshooting consists of determining the type of problem, predicting 

the (J.-PAC at fault, and locating the faulty circuit. Test procedures to aid in troubleshooting 

are as follows. 

CAUTION 

Use oscilloscope probes carefully to avoid shorting of 
connector terminals resulting in damage to the PAC. 



2-21 



a. In some cases, spare PACs may be used to isolate faulty circuits by inter- 
changing identical PACs and noting any shift in the faulty bits or addresses. All memory 
PACs with the same designation are interchangeable. 

b. Refer to PAC schematic and assembly drawings in Section 5 to isolate the 
defective components on the printed circuit card. Replace defective components. 

c. Memory failures are generally of the following types: 

(1) Operation failures, which are caused by faulty timing and control circuits. 

(2) Partial data word failures caused by a faulty sense amplifier, data register 
flip-flop, or data regeneration circuits. 

(3) Address failures caused by faulty address register or selection circuits. 

d. Memory failures may be localized by the following procedures: 

(1) Load the test pattern into the memory. 

(2) Initiate a read operation at each address sequentially and check each 
readout data word for the following failures: 

(a) Operation failures: No apparent response to commands applied to the 
memory, or faulty operation at all addresses (Table 2-3-3). 

(b) Partial data word failures: Failures of one bit or series of two or 
nnore bits at all addresses (Table 2-3-4). 

(c) Address failures: Faulty memory operation at particular addresses 
only (Table 2-3-5). 

MAGNETIC CORE STACK MAINTENANCE 

Under normal operating conditions, it is unlikely that troubles will occur within the 
magnetic core stack. However, continuity nneasurements of the sense inhibit and drive 
windings will enable maintenance personnel to check core stack wiring. Exercise caution 
in taking these measurements to avoid damaging the matrix windings. 

CAUTION 

Multimeter current and voltage should be kept below 
300 mA and 30V, respectively, to avoid damage to 
matrix windings and components . 

Sense Windings 



a. Turn off memory power. Remove the Sense Amplifier PAC, CM-363A associated 
with the sense windings to be checked. 

b. Place the ohmmeter leads across the sense winding inputs (SWXX+ and SWXX-) 
to the Sense Amplifier PAC as determined from the logic diagrams of Section 4 and check 
for continuity. One sense winding links 4096 cores (Table 2-3-5). 



2-22 



Table 2-3-2 
Operational Failures 



Symptoms 


Probable Fault 


No apparent response to commands 


1. 


DC voltage 






2. 


CC-373 PAC 






3. 


MBSYX-. MEMCI+, RTDL- 


signals 


Unable to read from any address 


1, 


CC- 373 PAC 






2. 


15.5 volt supply 






3. 


STROB- Signal 





Table 2-3-3 
Partial Word Failures 



Symptoms 


Probable Fault 


Failure of one bit (ZERO or ONE) 
at all addresses 


1. Sense Amplifier PAC (CM-363A) 

2. Data register 

3. Inhibit PAC 

4. Sense winding 

5. Inhibit winding 

6. Resistor PAC 


Failure of one bit at particular 
addresses 


1. Sense Amplifier PAC 

2. X or Y- switch or sink PAC 

3. Sense winding 

4. X or Y-drive line 

5. X or Y- selection diode (F-08) 


Failure of one bit at one address 


1. Marginal Sense Amplifier PAC 

2. Marginal core 



Table 2-3-4 
Address, Decoding, and Selection Failures 



Symptom 


Probable Fault 


All bits fail as a function of 
particular address bits 


1. X or Y- switch or sink PAC 

2. CC-363A PAC 

3. X- or Y-drive line 

4. X- or Y- selection diode 



2-23 



c. Resistance readings should be approximately 28 ohms for all sense windings. 

The resistance readings for all bits should agree within ^10%. 

Drive Windings 



a. Turn off memory power. Remove the Selector PAC, CM-306 associated with 
the X- and Y-drive line to be checked. This can be determined from the logic diagrams by 
relating the bad address to a sink and switch output for both the X- and Y- coordinates. The 
drive winding connections to the core stack are shown in Figure 2-1-1. 

b. The actual drive line connections are located on the core stack printed circuit 
board. The selection switch outputs are isolated by a diode from each drive line so that the 
resistance reading between any dual bus (XDXX) and line bus (XBXX) will include a diode 
forward drop. 

c. Measure continuity by referring to the simplified selection diagram, Figure 2-2-5, 
For example, to check the continuity of drive line X60, put one ohmmeter probe on the 
corresponding sink output (collector output of transistor Q4) and the other ohmmeter probe 
on the proper switch output (collector of transistor Q2). A low resistance (one forward 
diode drop plus a drive line resistance of approximately 6 ohms) indicates continuity for 
both diodes and the drive line. It may be necessary to reverse the probes to obtain the 
correct polarity to forward-bias the selection diodes. The continuity of the current path 

for the opposite drive polarity should be similarly checked by moving the probe from the 
collector of Q2 to the emitter of Ql and reversing the polarity. In this mode of measuring, 
two diodes will be in the circuit. A high resistance reading in both drive current polarity 
paths indicates an open drive winding or drive bus. If a drive bus is open, the other drive 
lines connected to the same bus will also have a high resistance reading. A high resistance 
reading in only one of the read or write current paths indicates an open F-08 flat pack diode. 

Inhibit Windings 

a. Turn off memory power. Remove the Inhibit PAC CM-305 associated with the 
inhibit line to be checked. 

b. Place the ohmmeter leads across the inhibit winding inputs (ZWXX+ and ZWXX-) 
to the Inhibit PAC as determined from the logic diagram of Section V and Table 2-3-6. 

c. Resistance readings should be approximately 11 ohms for all inhibit windings. 
The resistance windings for all bits should agree within ^10%. 



2-24 



Table 2-3-5 
Sense Winding Check List 



Sense Winding 


Location 


Sense Winding 


Location 


SW01 + 


A1BX0323 


SW09+ 


A1BX0114 


SWOl- 


A1BX0321 


SW09- 


A1BX0116 


SW02+ 


A1BX0319 


SW10+ 


AlBXOllO 


SW02- 


A1BX0317 


SWIO- 


A1BX0112 


SW03+ 


A1BX0315 


SW11+ 


A1BX0124 


SW03- 


A1BX0313 


SWU- 


A1BX0122 


SW04+ 


A1BX0311 


SW12+ 


A1BX0118 


SW04- 


A1BX0309 


SW12- 


A1BX0120 


SW05+ 


A1BX0324 


SW13+ 


A1BX0123 


SW05- 


A1BX0322 


SW13- 


A1BX0121 


SW06+ 


A1BX0318 


SW14+ 


A1BX0119 


SW06- 


A1BX0320 


SW14- 


A1BX0U7 


SW07+ 


A1BX0314 


SW15+ 


A1BX0115 


SW07- 


A1BX0316 


SW15- 


A1BX0113 


SW08+ 


A1BX0310 


SW16+ 


AlBXOlll 


SW08- 


A1BX0312 


SW16- 


A1BX0109 



2-25 



Table 2-3-6 
Inhibit Winding Check List 



Sense Winding 


LiOcation 


Sense Winding 


Location 


ZW01 + 


A1CX0603 


ZW09+ 


A1CX0406 


ZWOl- 


A1CX0601 


ZW09- 


A1CX0408 


ZW02+ 


A1BX0632 


ZW10+ 


A1AX0426 


ZW02- 


A1BX0631 


ZWIO- 


A1AX0428 


ZW03+ 


A1BX0601 


ZW11 + 


A1CX0607 


ZW03- 


A1BX0602 


ZWll- 


A1CX0605 


ZW04+ 


A1AX0631 


ZW12+ 


A1AX0627 


ZW04- 


A1AX0629 


ZW12- 


A1AX0625 


ZW05+ 


A1CX0402 


ZW13+ 


A1BX04-30 


ZW05- 


A1CX0404 


ZW13- 


A1BX04-29 


ZW06+ 


A1BX0432 


ZW14+ 


A1BX04-03 


ZW06- 


A1BX0431 


ZW14- 


A1BX04-04 


ZW07 + 


A1BX0401 


ZW15+ 


A1BX06-30 


ZW07- 


A1BX0402 


ZW15- 


A1BX06-29 


ZW08+ 


A1AX0430 


ZW16+ 


A1BX06-03 


ZW08- 


A1AX0432 


ZW16- 


A1BX06-04 



2-26 



SECTION 4 
LOGIC BLOCK DIAGRAMS 



This section contains the following logic block diagrams. The logic block diagram 
(LBD) number is shown in the upper righthand corner of each drawing. 

Description 

Timing and Control 

X -Selection Sinks and Switches 

Y -Selection Sinks and Switches 

X- and Y -Selection Diode Matrix 

Sense Amplifiers 

Inhibit Drivers 

1x3 Connector Wiring 

PAC Complement and Allocation 

Parts List 



LBD No. 


Dwg. No. 


80, 


,00 


C70022843 


80. 


,01 


C70022835 


80. 


02 


C70022836 


80. 


03 


C70022837 


80. 


04 


C70022838 


80. 


05 


C70022839 


80. 


06 


C70022840 


80. 


08 


C70022841 






P70022841 



2-27 



[bo 01 



iU WRITE- 

/aNwRiT- 



[60 06] 



[INHB+) 
[8006] YTIMG+- Hz 
(YRWT+I 



[eO 05 ] WHITE- 
(WRIT-) 




[eO,06] BA 



[80 06] MADCL-B 
^(ARRC-) 



M' 




^{INHB+) 



IN 



A 
A 
A 
A 



DESIGNATES MODULE LOCATION G,H,I aj FOR M-3ie MODULE A, B , C B D RESPECTIVELY. 



CSM-160 NOMENCLATURE IN PARENTHESIS. 



in 



§ 



HONE 

i/aCL COMPUTE 



Y W E L L . 



ENG. [X OAVIES 



*pp. g 



:T NO. 5! 



""i^'/V i? 



^'^-'»-'? 



TITLt 

CSM-160 AND 

H-316 MEMORY 
TIMING CONTROL 



SIZE 

c 



DWG NO. I BEV. 

(70022842 T7 



[eo ooj 

[80 00] 



[8006] MAOIO- - 

[so 06J MADCL-B - 
(ARRC-B) - 



[8C .)&] taADO?- 
!MAOa-) 



tar. r,^-^ 



[800G] MIDCL -S 
(ARRC-B) 



[8006] MA0O6- 
(MAII- ) 




WQTES; 

/\ B BIT MEMORIES ONLY 

^^ CSM-160 AND ICM-160 NOMENCLATURE IN PARENTHESIS 
/\ IKOHM RESISTORTO +6 VDC FOR ICM-160. 

A 



a 



i! 



M 



HONEYWELL 



^< 



DR. HAMEL 



0. NAVIES 



DATE'/^.^t; 



TITLE 
CSM-160, ICM-160 AND 

H-3ie MEMORY Y SELECTION 
SINKS a SWITCHES 



DWG NO. 



70022636 ~f 



[lB-D. ..v. 



[eo Ol] KDOt (32) 

[bo oi] xtios na) ^ 

A 



[BOOl] XD05 (2)— 
[90.01] XD04 Q^ — 



A " 



X60 
X50 



[80 CZ] VDOI (J) 

[80 02] Y002 Cl)— 



[80.'i2] YD05 (25> 

[aoo3j Y004 (Vs)— 



fllAX04 

tlT© 



9 - X31 

10 - X2I 



^T^ 



€) 



-<3) 



006 (24)- 



X„07 @_l— l- 



05 

YDOe (^4)- 



007 (^2)- A 
8@ 



Y27 

io[— in? 

1 -YZS 

2 - Y23 



^ 



5 



© 



<D 



B 



® 



€) 



XDIO 0- 



,on 0^=1:: 






^0 .,_^^ 
*—(b) YU12 Ol) * 



-Y3S 
-Y49 



■Y63 
■Y43 



&- 



-0 



^^ 



"-JlJ 






m® 



-@ 



XDI4 (TV 



4 j— XIO 

5 1-X4 
9 |j~ X2S 

,ol-X.6 

I2|— X22 



-e 



.(=>^ 



© — 

°" ©— n 



6 



— Y3j 

— Y47 
~Y3T 

— Y59 



-© 
:i:r© 



-® 










5^ 



X2 XO XS6 XSe X60 X62 



0- 



i i i i I L 



B02 (zT) i i— 



XIZ X54 X52 X; 

4 1 L 



[eooi] ^ 



XIB X20 X40 



„o, — 1 — 1 — i — 1 — 1 — L 



X?6 XJB 



@-i i i L 



X59 X6I X63 



BOo'"0l4 i 1 i 1 i- 



XS5 X53 X49 X5 



[80 0,J ^ 



07@h4 i j^ i ^ i 

X39 X37 X35 X33 XZ5 X27 
08 i 1 1 1 1 i_ 



50 X4e 



X3B X36 X34 

J u 




Y57 Y5tl 



BOI (2)" 



602 (30)— 



[eo 02] -< 



603 (32)— 



= 04 0- 



0- 



[ao 02] -< 



(S>- 



rB08 (2^— 



i i L 



J [ J I 



Y23 yi7 



4 i I. 



4 i L 



Y56 Y58 Y60 

-i—1 L 



1—i I 



■0 V40 y46 y44 Y42 



30 Y38 Y36 Y34 

-4 i L 



K a u :l 



:: n n n ii n a 



;l u ii 



TYPICAL F-08 FLAT PAC CONNEcrlO^S 
(Ml TH'^U Miei 



A 'h 



I OF FLAT P4C 1 F-08) 



/^ (7a) PIN No. OF STACK CONNECTOR 

A 
A 



5 » 






1:: 



HONEYWELL 



? COIVTPOL, DPVISIOrM 



DR. a hAMEL 

ENG. P. DAVIES 

PROJECT NO. S5202 



| D*TE/„4, 
29-' -1969 



TITLE 
C3M-I50,ICM-I60 AND 
H-3i6 MEMORY X 6Y SELECTION 
DIODE MATRIX 



SIZE 

c 



700 2 2 837 -& 



A , 

[aIBX06'22] SWOl-t- *— 

[AIB*06-2i] SWOI- * — 



[/■.'BXCfi -19] SWO:? + — f— f9 

[4iBX06-20] 3W02~ — 1— 17 



A'^ 





MMOIF- 

A (SDOI-) [Al 



IBKO6-I5] SW03+ 1— 15 

BX06-I6] SW03- «— 13 



[aiOX.06-M] 3W04 + 




[AiexOl-ZZ] SW05 
MM03F- 
(S003-) [AiexOt-2l] ■ 



[aiBxofl-ia] swi 




[AIBX04-14] SW07-*- — t— 14 

MMOSf- 1 

(SD05 - 1 [AieX04-l3] SW07- *— 



[AIBX04-I l] SI 




—' 1 \ 

TaiBXC'' 1'?] y*l3*- — I — 23 1 ^\^ 

[AIBXO4-20J S*li- — 1—21 ^^ 



IS 



. flXO' -I5J S* 



r,«-if] 5W!>- — i- 



[80 06] STROB 

A(STRB-) 



]-_Q)i J'_ 



TD 




[Aiex06-24J sw 
-MMI5F- 
(SD15-1 [a 8X06-23] SW 



TP 



CAiexOfe-Os] SW!2* — I — 

(SDI6- ) [AiBxae- 10] SWI2- — 1~ 




I 

[-113/04-24] ?W09+ 1— 

[a 'BX 04-25] SW09- *— 



[t I 8X0-1 09] .S« C- 
fil(BX04- 10] SWIO - 



' <°' A 





■>^- 



A 

A THIS PAC NOT USED ON S BIT MODULES. THIS PAC REPLACED 
BY CM-489B ON 12 BIT MODULES. 

A 
A 



,IBX04 a AIBX06 ARE CORE STACK CONNECTOR LOCATIONS 



■160 AND rCM-160 NOMENCLATURE IN PARENTHESM 



; ?( 



HONEYWELL 



DR D. HAMEL 



ENG. D/viES 



iE 



DATE ■/i,/,.. 



PROJECT NO. 55202 



i-±-li^ 



TITLE 

CSM-160, ICM-160 AND 
H-:SI6 MEMORY 
SENSE AMPLIFIERS 



_^002283^^ 



[80.06] M08FF4- V- 
A[Dft08 + J 



M07FF+ V- 
(DR07 + ) 



M05FF+ V- 
[DR05+) 



[boos] M04Ft+ y — 
(DR04+) 



[aO.OO] INhBX+ - 
(INHP + ) 



[aO.OO], UNS14B 

/.\(YRWT+I 

[80.06] M03FF+V" 
(DR03+) 



M02FF+ \— 
(0RO2+) 



[b006] M06FF+^>— 
(DR06 + ) 



CM-305 

jh 




X 



^ 

D- 



■ HTTJ- 



.--Ul 



[--m 



--a 



417] 



J--ra 



■s 






in: 



A 



[80.06] M09FF+ V- 
/^iOR09 + ) 



MI2FF+ V- 
(0RI2 + 1 '^ 



MIOFF-^ V- 
(DR10+J 



[boob] MI6FF-t- V- 
(DRI6 + ) 



[eO.OO] lNrtBX+- - 
(IMHB + I 



[bo.oo] a unsl+c 

/4\iYRWT + l 
[bo Ob] M13FF+ \— 

tORI54-) 



MI5FF4- V- 
(DRI5 + 1 '^ 



tORI44-) 



06] MlfFr+ y- 



:s 



CM-S05 




4n}- 






--Q] 



^ 



£=0 



">' 



[s] 



Kji] 



'Hill 



-■(13 



--0 



-dS 



Xtl 



BIT 
XX 


RZXX-t- 


Z*XX + 


1 


CM-305 


CM- 3e4A 


CM- 305 


STACK 


STACK 


CM-384A 


01 


AIBX07-29 


Aicxoe -09 


AlBXOr-iO 


AICX06-Oi 


AICX06 -03 


AICX08-05 


02 




29 








?a 


AIBX06-31 


AtBX06-52 




■ 05 


03 




II 




i5 




OB 


AIBX06-O2 


A(BX06-0I 




19 


OA 




05 




14 




06 


A1AX06-29 


AlAXOS-31 




02 


05 




— 




— 




32 


AICX04-04 


A(CX04 -02 




07 


06 




_ 




— 




24 


AIBX04-3I 


AIBX04-32 




01 


07 




II 




10 




12 


A1BX04-OZ 


AIBX04-0I 




04 


08 


AIBXQ7-02 




08 


AlB 


X07-O4 


816X04-32 


AIAX04-30 




06 


09 


AIB 


X08-02 




20 


AIBXD8- 04 


4ICX04-06 


AICX04- 06 




30 


10 




., 




23 




32 


AIAX04-2a 


AIAX04-26 




31 


' 1 








— 




24 


AICX06-O5 


A1CX06-07 




27 


1 Z 




1 1 




(3 




12 


AIAK06- 25 


AIAX06-27 




21 


13 




1 1 




26 




08 


AiBX04-29 


AlfiX04~30 




28 


14 




— 




_ 




28 


AIBXO4-04 


AIBX04-03 




29 


IS 




29 




IT 




30 


Al BX06- 29 


AIHX06- 30 


" 


16 


AIBX08 05 


A1CX0S 22 


AIBX08-06 


AIBX06-04 


AIBXC6-03 


AICXOB- 32 






NOTES : 

A 



CONNECTIONS FOR 



r DRIVERS Table i shows correct pin locations for 

SED OM 8 BIT MODULES. THIS PAC REPLACED BY CM- 488 ON 



A THIS PAC NOT U 

'— ^ 12 BIT MODU LI 

/^ TCM-i60 AND CSM-160 NOMENCLATU 

A 



RE 1 N PARENTHESIS. 



60 NOMENCLATI 



a-' 



ti 



HON 



E Y W E L L 



DR. D 



ENG- D DAV1ES 



DATE^^/6aAi ■ 



.Uj 



PROJECT NO ■i5202 



TITLE 

CSM-160. ICM~)60 AND 
H-316 MEMORY 
INHIB IT DRIVERS 



DWG NO. _ 

7002283S 



_REy^ 



, LB.D. NO. 

L 8006 



A 



A 









AXOI 


-M02FF + 


BANK-C 




Al 


AX02 




MOIFF+ 




2 


1 


t 


-BANK-B 


MMI6F- 






4 


-MMI5F- 


MM05F- 




3 


4 


-MM04F- 


MAD09+ 






6 


-MAOIO- 


M12FFt- 




5 


6 


-MI3FF + 


M03FF+ 






8 


-M04FF + 


MAD06- 




7 


8 


- MA006 - 


MMI4F- 






1 


-MMI3F- 


MMD5F- 




9 


1 


- GND+F 


MADII- 






J Z 


~MADI2 -■ 


MAD07- 




1 1 


12 


— MADCL-A 


M<J7FF-»- 






14 


-M08FF + 


MAD06- 




15 


14 


- BND + G 


MMI2F- 






16 


-MMIIF- 


MM02F- 




1 5 


IS 


h-STfloe- 


MADIJ- 






18 


-MADI4- 


MI5FF+ 




17 


IS 


i~ 6ND + H 


M05FF+ 






20 


-M06FF + 


MI4FF + 




19 


20 


-MADCL-B 


MM10F- 






22 


-MM09F- 


MMOIF- 




21 


22 


— GND+J 


M1 IFF + 






24 


-MADIfl - 


MI6FF + 




23 


24 


— X7\UG + 


MMOaF- 






26 


-MADl$- 


GND +t< 




25 


2fi 


I-YTIM6 + 


BANK-fl 






26 


-MIOFF + 


WRITE- 




27 


2* 


|- 6M04-! 


M09FF+- 






30 


-MM07F ~ 






29 


50 


- GND-t-M 


MM06F- 






32 


~BANK-D 


MBsyx+ 




3, 


52 


- GND+N 







, 


2 


_ 


3 


4 


- 


5 


6 


- 


7 


a 


- 


9 


10 


- 


13 


14 


_ 


IS 


16 


„ 


17 


18 


- 


13 


20 


- 


21 


22 


- 


23 


24 


- 


25 


26 




27 


28 


- 


29 


30 


- 


31 


32 


- 





1 


_ 




2 


- 


3 


4 


~ 


5 


6 


- 


7 


e 


- 


9 


10 


- 


II 


12 


-- 


1 3 


14 


- 


15 


16 


- 


17 


IS 


- 


19 


20 


- 


21 


22 


- 


23 


24 




25 


26 


- 


27 


26 


- 


29 


30 


~ 


51 


32 



1 


, 


2 


3 


4 


3 


6 


7 


8 


.9 


10 


1 1 


12 


1 5 


14 


19 


16 


1 7 


la 


19 


20 


21 


22 


23 


24 


25 


26 


27 


28 


29 


30 


31 


32 







2 




4 




6 




e 




10 




14 




16 




18 




20 




22 




24 




26 




26 




30 




32 



A 



A 



1 


1 

3 


2 

4 


5 


6 


7 


B 


3 


10 


' ' 


12 


1 5 


16 


17 


18 


19 


20 


21 


22 


23 


24 


25 


26 


27 


28 


29 


30 


31 


32 





. 


A 


AX07 


-BANK-a 


MOIFF + 




AIA 


OB 




BANK-e 


1 




, 


2 


— mo!:ff + 


MM05F- 


-1 


3 




-KIM04F- 


MMI6F- 


- 


3 


4 


— MMI5F - 


MI2FF + 


^ 


5 




-M13FF 4 


MAD09- 


- 


5 


6 


-MADIO - 


MAD05- 


- 


7 




- MAD06- 


M03FF + 


- 


T 


6 


- MO«FF + 


MM03F- 


-, 


9 




- GND+F 


MMI4F- 


- 


9 


10 


~MM13F — 


MADOT- 


- 


1 1 




-MAOCL-A 


MA011- 


- 


11 


12 


-MADIZ - 


MADOa- 


~1 


13 




U GNO+G 


M07FF+ 


- 


13 


14 


-MOSFF + 


MM02F- 


- 


15 




-STROB- 


MM12F- 


- 


15 


16 


-MMI IF - 


MI5FF + 


- 


17 




~ GND+H 


MAD13 - 


- 


17 


18 


-MADI4 - 


MI4FF + 


-H 


19 




-MADCL-B 


M05FF+ 


- 


19 


20 


- MOeFF + 


MMOIF- 


- 


21 




- GND+J 


MMIOF- 


- 


21 


22 


-MM09F- 


M16FF + 


-H 


23 




-XTIMG + 


MIIFF + 


- 


23 


24 


-MAC'IS - 


GMO + K 


^ 


25 




- YTIMG + 


MMOeF- 


- 


25 


26 


-MADIS- 


WRITE- 




27 




- GND+L 


BANK-D 


- 


27 


28 


~ MIOFF + 




^ 


29 


50 


— GND+M 


M09FF + 


- 


29 


30 


~MM(}7F- 


M8SYX + 


-^ 


31 


32 


- 3ND+N 


WM06F- 


- 


31 


32 


-BANK-C 



1 




2 


3 


4 


5 


6 


7 


8 


9 


10 


1 1 


12 


IS 


14 


IS 


16 


17 


18 


19 


20 


21 


22 


23 


24 


2S 


26 


27 


26 


29 


30 


31 


32 





1 




3 




5 




7 




9 




1 1 




13 




15 




IT 




19 


20 


21 


22 


23 


24 


25 


26 


27 


28 


29 


30 


31 


32 





1 






2 

4 






6 






8 


-A 




lO 






12 


A 




14 


^ 




16 


^ 




19 






20 






22 




23 


24 




2S 


26 




27 


28 




23 


30 






32 



NOTES; 

/\ INPUT CABLE CONNECTORS (CE-OEO) 



tt^ 



A 
A 
A 



NTER- MODULE CONNECTORS I DWG &0 1 4998 ) 



a < 



S ft 



e"' 



HONEYWELL. 



L COMPUTCF* CONTROL OIVISIOM 



ENG. DflVIES 
AFP. C 'f'/^'.a.-it 



ImlSS- 



i2£2 



PROJECT NO. 55202 



TITLE 
H-316 MEMORY 
I XS CONN. WIRING 



DWG NO. TTie7 

70022840. R" 



CABLE PAC 



CM -306 01 



JUMPER PAC 



JUMPER PAC 













MODULE 


A 
















LOG 


PAC 


fl 





C 


D 


E 


F 


G 


H 


J 


K 


L 


M 


N 


P 


6 


CM-305 


05 


05 


0-, 


05 


OS 


05 


05 


03 


























7 


CM- 305 


05 


05 


05 


- 


09 


05 


05 


05 



























CORE STACK 



00 00 00 00 00 00 00 00 00 



LOC 


pac 


ft 


B 


C 


D 


E 


F 


G 


M 


J 


K 


L 


M 


N 


P 


9 
















7 


/z\ J 






























6 
































5 
































4 
































3 
































2 


f. 






























J_ 

































LOC 


^AC 


A 


B 


C 


D 


E 


F 


G 


H 


J 


K 


L 


M 


N 


P 


B 
































7 
































6 
































5 
































4 
































3 
































2 
































1 








L_ 

























LOC 


PAC 


A 


B 


C 


D 


E 


f 


G 


H 


J 


K 


L 


M 


N 




B 
7 






























































6 
































5 






























4 
































5 
































2 
































1 






^_ 



























LOC 


PAC 


A 


B 


C 


D 


E 


F 


G 


H 


J 


K 


L 


M 


N 


P 


8 


' '\ 






























? 


iN 






























6 
































5 






























4 








_.. 










_._ 


..._ 


- 










3 












2 


-^^ 












1 


/A 







































MODULE 


C 
















LOC 


PAC 


A 


B 


C 


D 


£ 


F 


G 


H 


J 


K 


L 


M 


N 


p 


8 




















- 












7 


























6 
































5 
































4 




























3 
































2 






























1 

































LOC 


PAC 


A 


B 


C 





£ 


F 


G 


H 


J 


K 


L 


M 


N 


p 


8 
































7 
































6 
































5 
































4 
































3 
2 




- 


























_ 


























' 


























1 



MODULE D 






LOC 

8 

7 


PAC 


A 


B 


C 





E 


F 


G 


H 


J 


K 


L 


Nl 


N 


P 


































e 

5 








- 














































4 
































3 
































2 
































1 

































USED FOR MULTi-MODULE CONNECTIONS 



LOC 


PAC 


A 


B 


C 





E 


F 


G 


H 


J 


K 


L 


M 


N 


P 


8 

7 


- - 
























- 
































6 
































5 
































4 
































3 
































2 
































Lj.J 
















^-... 

















VIEWED FROM WIRING SIDC 



/l\ JUMfFR PAC AOl499670i 

^\ JUMPER PAC 6014998702 

/A PAC LOCATIONS FOR ALL MODULES THt SAME AS MOOiK.E "fl" WITH TMF. EXCEPTION OF 

A 



A»A 



< 



1 



LOC 


PAC 


A 


i 


c 


D 


E 


F 


G 


H 


J 


K 


L 


M 


N 


P 


8 






- 


















- 


.„. 




~- 


7 


















6 






























5 
































4 
































3 
































2 
































1 































' F7n02Z84l PAINTS LIST 



HONEYWELL 



DR. D HAMEL 



DATE 



ENG, K IZBICKI 



PROJECT NO 55202 



TITLE 
H-;!I6 MEMORY 
P4C: COMP a ALLOCATION 



^ 



70022841 



H3l6 Memory PAC Complement 



Part Number 


Description 


Quantity 


70 006 707 701 
70 021 896 701 
70 022 970 702 
70 022 955 707 
70 021 402 701 
70 942 507 002 


NAND Type 1 PAC. Model DI-335 
Selector |i-PAC, Model CM-306 
Resistor |jl-PAC, Model CM-384A 
Sense Amplifier |jl-PAC, Model CM-363B 
Inhibit ji-PAC, Model CM-305 
Core Memory Unit, Plugable 


1 
4 
1 
2 
2 
1 



2-45 



SECTION 5 
MEMORY PAC DESCRIPTIONS 



This section contains the following circuit descriptions and parts lists for the special 
|j,-PACs used in the H316 Magnetic Core Memory Modules. 



CM-305/CM~488 

CM-306/CM-640 

CM-363A/CM-489A/ 
CM-734/CM-735 

CM-363B/CM-489B/ 
CM-734/CN-735 

CM-384A 

DI-335 

XP-330 



Selector PAC 

Sense Amplifier PAC 

Sense Amplifier PAC 

Resistor PAC 
NAND Type 1 PAC 
Extender PAC 



2-47 



CM-305/CM-488 



INHIBIT H-PAC, MODELS CM-305/CM-488 

The Inhibit p,-PAC, Model CM-305 (Figure 1 and 2), contains two groups of four 425 mA 
transistor switches and one NAND gate. Each switch is controlled by a data input and strobed 
by a common line within each circuit. 

An output switch is turned on (active state) when the corresponding data input is at an 
active state, the timing input for circuits A, B, C and D is at a passive state, and the timing 
input for circuits E, F, G, and H is at an active state. 

The emitters of the output transistors are brought out to external pins 1 and 27. 
Optional capacitors CI, C2, and C3 are provided for filtering the +15V supply. Clamp 
diodes at each collector are used with inductive loads. 

The CM-488 contains one group of four transistor switches. Circuits D, E, F, and 
G of Figure 1 and 2 are omitted. 

Specifications 



Frequency of Operation 
DC to 2 MHz 

Input Loading 

1 unit load each (1.6 mA) 

Output Characteristics 

Current: 425 mA (max) 
Voltage: 17.5V (max) 
Power: 200 nnW (max) 



Circuit Delay (420 mA Resistive Load ) 

Turn-on Delay (1.5V of input 190 ns (max) 
to 10% of current) 



Turn-off Delay (1.5V of input 
to 90% of current) 

Power Dissipation 
2.2W (max) 



190 ns (max) 



Current Requirements 
+ 6V: 70 mA (max) 



2-49 



CM-305/CM-488 



03 Qll 013 



M4 M2 





C3 C4 CR8 0i5 QI6 R8 
6485 



R2 Q6 05 CR2 



Figure 1. Inhibit [i-PAC, Models CM-305/CM-488, Parts Location 

(Dwg B70021402, Rev. D) 



Electrical Parts List (No. P70021402, Rev. E) 



Ref. 

Desig. 


Description 


Part No. 


C1-C4 


CAPACITOR, FIXED, SOLID TANTALUM: 6.8 m-F 
±20%, 20 Vdc 


70 930 235 211 


C5 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 0. 033 
jxF ±20%, 20 Vdc 


70 930 313 016 


CR1-CR8-- 

CR1-CR3, 

CR8* 


DIODE, SILICON 


70 943 083 003 


Ml 


MICROCIRCUIT: Type 936, hex single -input inverter 
integrated circuit 


70 950 105 004 


M2-M4-- 
M4* 


MICROCRICUIT: Type 946, quad two-input NAND 
gate integrated circuit 


70 950 105 002 


01,03,05,07, 
07,09.011, 
013,015-- 
01,03,05,015* 


TRANSISTOR: Silicon NPN 


70 943 722 002 


02,04,06,08, 
010,012,014, 
016-- 
02,04,06,016* 


TRANSISTOR: Silicon NPN Type 778-2 


70 943 778 002 


R1-R8-- 
R1-R3,R8* 


RESISTOR, FIXED, COMPOSITION: 100 ohms ±5%, 
1/4W 


70 932 007 025 



*CM-488 only 
2-50 



Mar, 72 




o 

M2 



PIN NUMBER OF PAC 

PIN NUMBER OF MICROCIRCUIT 

REFERENCE DESIGNATION OF 
MICROCIRCUIT 



936 TYPE OF MICROCIRCUIT 







l^HtCto: 



-f—f?*) 



CR8 



-® 



I I 



Figure 2. Inhibit |a-PAC, Models CM-305/CM-488, 
Schematic Diagram and Logic Symbol 
(Dwg B70021402, Rev. D) 



CM-30S 
2 




29 



J-El-- 



KI>- 



? 



o 



HT>- 

29 



29 
?5- 



J-iih- 

29 



Hi3-- 



+« GND -H." 

34 S3 6,5.11.29' 



LOGIC SYMBOL 






@-Hl 

f-O cs f-© 



O 

I 

o 

O 



□0 
00 



CM-306/CM:-640 

SELECTOR H-PAC, MODELS CM-306/CM-640 

The Selector fx-PAC, Model CM-306 (Figures land 2), contains three registers, as well 
as decoding and drive circuitry for half of an 8 x 8 selection matrix. The outputs can sink or 
switch inductive loads of up to 450 mA with voltages up to +17V. 

The CM-640 is identical to the CM-306 except the address gates are connected as 
buffers rather than register stages. 

Address Circuits 

Three Type 961 power amplifier gates constitute the three register stages of the 
CM-306. Pin 6 is a common reset input to all three register stages. Pins 3, 14, and 20 
are set inputs; pins 8, 9, and 17 are reset inputs; pins 10, 16, and 22 are set outputs. One 
type 961 gate serves as an address buffer. Five type 961 gates serve as address buffers for 
the CM-640. 

Decoding and Drive Circuitry 

Four F-33 flat packs decode the address circuit inputs and sink or switch up to 450 mA 
of current into inductive loads. Input pin 24 at logic ONE enables the switch outputs. Pins 
25 and 28 are inputs to a NAND gate whose output, at logic ONE, activates the sink outputs. 
Only one output (sink or switch) of an F-33 can be activated during a given cycle. 

, The expansion input, pin 4, must be at logic ONE to enable the CM-306 |j.-PAC. 

Input and Output Signals 

Table 1 lists logic levels on various pins and the resulting active outputs. 











Table 1 
















Input /Output Logic 


Signals 
















Pin 24 










Pin 20 


Pin 14 


Pin 


3 


(Timing 


Pins 


25 


and 28 


Active Output 


(A3+) 


(A2+) 



(A1+) 



Switch) 



(Timing Sink) 

1 


Pin No. 





11 













1 









13 








1 













18 








1 




1 








15 





1 
















27 





1 







1 








30 





1 


1 













31 





1 


1 




1 








32 





















1 












1 









5 







1 













12 







1 




1 









7 




1 
















19 




1 







1 









21 




1 


1 













26 




1 


1 




1 









23 



2-53 



CM-306/CM-640 



Specifications 



Input Loading 
Address Inputs 
Reset Input 
Expansion Input 
Timing Inputs 

Output Characteristics 



Current (sink or switch) 

Voltage (sink or switch) 

Power (sink or switch) 

Collector -Emitter 
Saturation Voltage 
(sink or switch) 

Register Set Output 



unit load 
unit loads 
unit loads 
unit load 

450 mA (max) 
17V (max) 

560 mW (max) 
0.9V (max) 

4 unit loads 



Sink 120 ns (max) 
Switch 140 ns (max) 

Sink 200 ns (max) 
Switch 120 ns (max) 



Circuit Delay (430 mA Resistive Load) 

Turn-on Delay ( 1 . 5 V of 
timing input to 907o of 
current) 

Turn-off Delay (1.6V of 
timing input to 10% of 
current) 

Current Requirements 

100 mA at 15V 
45 mA at +6V 

Power Dissipation 
2.5W (max) 



2-54 



CM-306/CM-640 





Figure 1. Selector |ji-PAC, Model CM-306/CM-640, Parts Location 
(Dwg B70021896, Rev. D) 



Electrical Parts List (No. P70021896, Rev. D) 



Ref. 






Desig. 


Description 


Part No. 


CI 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0.033 |jlF ±20%, 50 Vdc 


70 930 313 016 


C2 


CAPACITOR, FIXED, SOLID TANTALUM: 6.8 ^iF 
±20%, 20 Vdc 


70 930 235 211 


CRI-CR8 


DIODE, SILICON 


70 943 083 003 


M1-M4 


MICROCIRCUIT: Type 961, dual four -input NAND 
integrated circuit 


70 950 105 009 


M5-M8 


MICROCIRCUIT: F-33, selection switch integrated 
circuit 


70 950 100 033 



2-55 






n 

o 

n 

% 

>{^ 
o 




rE 



F-33 



I I«l5v[]27 



fc 



[H>l 



f^ 



^^ 



n 



aI 



"t 



I 1+15 



x{14 



V\ 



\ 






I L ^_J J 



fi 



CM-306/CM-64 

•« F-33 




32 303r Z7 4 



•» CONNECTIOM NOT MADE OK CM-C40 PAC5 IPIN 5 OPEN) 






»©- 



.OlSpf 

-II — 



^•HO. 



Figure 2. Selector (x-PAC, Model CM-306, 
Schematic Diagram and Logic Symbol 
(Dwg B70021896, Rev. D) 



CM-363A/CM-48.9A/CM-734/CM-735 



SENSE AMPLIFIER [j-PAC, MODELS CM-363VCM-489A/CM-734/CM-735 

The Sense Amplifier |a-PAC, Models CM-363A and CM-734, contains four dual-in-line 
integrated circuit sense amplifiers, each of which contains two complete amplifier circuits 
capable of detecting and amplifying core signals. Each circuit has its own strobe input, all 
inputs being driven by the same buffer amplifier. A resistor divider network determines 
the threshold voltage for the eight circuits. Each amplifier output is connected to an inverter 
gate. The |ji-PAC also contains the sense line termination resistors for each circuit. 

The CM-489A and CM-735 contain only two dual-in-line integrated circuit sense amplifiers. 
Circuits A and B are omitted. 

Circuit Function 



A differential signal which is greater than the threshold voltage will produce a positive 
sense amplifier output if the strobe circuit is enabled. A negative strobe signal applied to 
the strobe buffer amplifier will enable the strobe gate and a positive signal will disable it. 
The sense amplifier output will be inverted, making a negative signal available to perform 
a logical OR function. 



Specifications 

Strobe Input 

Input loading: 1 . 6 mA 

DC Threshold 
14 mV to 28 mV 

Current Requirements 

+ 6V: 332 mA (max) 

-6V: 110 mA (max) 



Power Dissipation 
2.7W (max) 

Output 

Delay from strobe input to PAC output 

Leading edge: 155 ns (max) 
Trailing edge: 155 ns (max) 

Pulse width with 100 ns sense input 

pulse width: 80 ns (min) 

Drive capability: 12.8 mA 



2-57 



CM-363A/CM-489A/CM-7 34/CM-7 35 





6483A C3* R3 R4 RIO* R9 M3 

^ NOT USED ON CM-489A AND CM-735 



Figure 1. Sense Amplifier |j.-PAC, 
Models CM-363A/CM-489A, CM-734/CM-735, 
Parts Locations (Dwg No. A70022955, Rev. E) 

Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


C1-C4 


CAPACITOR, FIXED, MICA DIELECTRIC: 120 pF 
±10%, 100 Vdc 


70 930 016 030 


CS-C9 


CAPACITOR, FDCED. PLASTIC DIELECTRIC: O.OSS^-F 
±20%, 50 Vdc 


70 930 313 021 


CRl, CR2 


DIODE, SILICON 


70 943 083 002 


Ml 


MICROCIRCUIT: Type 936, hex inverter integrated 
circuit 


70 950 105 004 


M2 


MICROCIRCUIT: Type 946, quad two-input NAND 
gate integrated circuit 


70 950 105 002 


M3-M6^ 

M3,M4 


MICROCIRCUIT: Dual sense amplifier integrated 
circuit (See note 5) 


70 950 100 XXX 


M3-M6^ 
M3, M4 


MICROCIRCUIT: Dual sense amplifier integrated 
circuit 


70 950 100 042 


R1-R16 


RESISTOR, FIXED, FILM: 150 ohms ±2%, 1/4W 


70 932 114 029 


R17 


RESISTOR, FIXED, FILM: 270 ohms ±2%, 1 /4W 


70 932 114 035 


R18 


RESISTOR, FIXED, FILM: 1 ohm ±2%, 1/4W 

^CM-363/CM-363A 

^CM-489/CM-489A 

^CM-734 

*CM-735 
Part No. 70 950 100 034 (plastic) may be used 
interchangeably with 70 950 100 042 (ceramic) 


70 932 114 145 



2-58 



Mar. 72 




£> ^[-HD 





1 


TP 


23 — 
21 — 


(SEE NOTE n 


TP 


1 9 - 
17 - 


■-1 


p^30 




-. D 






JJ 1 ^ 


LTl 




-ev +6V GND 
32 54 7 6 33 * 



ur 




LOGIC SYMBOL 



/"-^ CRI 
■HSV@ -^ p^l p 

ic9 :j=c8 ^c 

IND^sYe) i 1 1 — 



-Ovcci 



-O^vo 



CR2 



-OvCC2 



:m-. 



=0- 



i 



-Oa 



-o» 










(SEE NOTE 1) 


4 

TP 


^■•4>' 


-- 


10 -- 
12 -- 


^- 


- 


"']- cJ 


.. 




-I 



LEGEND 

(T) PIN NUMBER OF PflC 

-\Z PIN NUMBER OF MICROCtRCUIT 

M3 REFERENCE DESIGNATION OF 
MICROCIRCUIT 

936 TYPEOFMICFTOCIRCUIT 

NOTE i: CM-363A OR CM-734 



O 



o 



00 

> 









Figure 2. Sense Amplifier |jl-PAC, Models CM-363A/CM-734, 
Schematic Diagram and Logic Symbol 
(Dwg A70022955, Rev. E) 



-0 

00 
LP 



o 




{> ^[^ 



SCHEMATIC 




'(^ 



CR2 



LOGIC SYMBOL 



-6V (34) 1 1— W '- 



CS ^Ci 



-Qvcci 



-Ohvg 



-OvCC2 

-Oa 



-* Oe 




LEGEND 

(T) PIN NUMBER OF PIC 

-|2 PIN NUMBER OF Ml CROCIBCUIT 

M3 REFERENCE DESIGNATION OF 
MICROCIRCUIT 

936 TYPE OF MICROCIRCUIT 
NOTE 1: CM-4B9A OR CM- 735 



o 

00 
> 

O 
I 

00 
sO 

> 
-J 

O 
I 

LO 



Figure 3. Sense Amplifier p.-PAC, Models CM-489A/CM-7 35, 

Schematic Diagram and Logic Symbol 

(Dwg A70022955, Rev E) 



CM-363B/489B 7734/73 5 



SENSE AMPLIFIER ^-PAC, MODELS CM-363B/489B/734/735 

The Sense Amplifier |j.-PAC, Models CM-363B and CM-734, contains four dual-in-line 
integrated circuit sense amplifiers, each of which contains two complete amplifier circuits 
capable of detecting and amplifying core signals. Each circuit has its own strobe input, all 
inputs being driven by the sanne buffer amplifier. A resistor divider network determines 
the threshold voltage for the eight circuits. Each amplifier output is connected to an inverter 
gate. The |j.-PAC also contains the sense line termination resistors for each circuit. 

The CM-489B and CM-735 contain only two dual-in-line integrated circuit sense 
amplifiers. Circuits A and B are omitted. 

Circuit Function 

A differential signal which is greater than the threshold voltage will produce a positive 
sense anaplifier output if the strobe circuit is enabled, A negative strobe signal applied to 
the strobe buffer amplifier will enable the strobe gate and a positive signal will disable it. 
The sense amplifier output will be inverted, making a negative signal available to perform 
a logical OR function. 



Specifications 



Strobe Input 

Input loading: 1.6 mA 

DC Threshold 
14 mV to 28 mV 

Current Requirements 

+ 6V: 332 mA (max) 

-6V: 110 mA (max) 



Power Dissipation 
2.7W (max) 

Output 

Delay from strobe input to PAC output 



Leading edge: 
Trailing edge: 



1 55 ns (majc) 
155 ns (maix) 



Pulse width with 100 ns sense input 

pulse width: 80 ns (min) 

Drive capability: 12.8 mA 



Apr. 72 



2-61 



CM-363B/489B/734/735 



M6'**' R5 R6 RI6* RIB* RI5* 



C7 





64836 C3-H R3 R4 RIO* R9 M3 

X- NOT USED ON CM-489B AND CM-735 



Figure 1. Sense Amplifier fi-PAC, Models CM-363B/489B/734/735, 
Parts Locations (Dwg No. A70022955, Rev. F) 



Electrical Parts List 



Ref. 
Desig. 


Description 


Part No. 


C1-C4 


CAPACITOR, FIXED, MICA DIELECTRIC: 120 pF 
±10%, 100 Vdc 


70 930 016 030 


C5-C9 


CAPACITOR, FDCED, PLASTIC DIELECTRIC: 0.033(jlF 
±20%, 50 Vdc 


70 930 313 021 


CRl, CR2 


DIODE, SILICON 


70 943 083 002 


Ml 


MICROCIRCUIT: Type 936, hex inverter integrated 
circuit 


70 950 105 004 


M2 


MICROCIRCUIT: Type 946, quad two-input NAND 
gate integrated circuit 


70 950 105 002 


M3-M6^ 
M3,M4 


MICROCIRCUIT: Dual sense amplifier integrated 
circuit (See note 5) 


70 950 100 XXX 


M3-M6^ 

M3, M4 


MICROCIRCUIT: Dual sense amplifier integrated 
circuit 


70 950 100 042 


R1-R16 


RESISTOR, FIXED, FILM: 150 ohms ±2%, 1/4W 


70 932 114 029 


R17 


RESISTOR, FIXED, FILM: 270 ohms ±2%, 1/4W 


70 932 114 035 


R18 


RESISTOR, FIXED. FILM: 1 ohm ±2%, 1/4W 

^CM-363B 

^CM-489B 

;:CM-734 

*CM-735 
Part No. 70 950 100 034 (plastic) may be used 
interchangeably with 70 950 100 042 (ceramic) 


70 932 114 145 



2-62 



Apr. 72 



> 









r-<i) 




^Q 



|, £y sO^ 



I 



TP 

i: 



CM-363B OR CM-734 




xu 





1 




CM-363B OR 


CM-734 


TP 


f^ 






24 

22 


^ 


>o-- 3 


TP 


^ 1 




-h 


18 - 




\>^^ 




I 


20- 




w 






- d 


, 




JJ 1 A 




l1'_ 






C 



LOGIC SYMBOL 



/--^ CRI 
^6V (34) . pH ^ 0«CI 

=:c9 ipcB =rc5 

D(3r)(T) — 1 1 i — O"™ 

©CR2 y 
J M * OvCC2 



-'(!> 



I 



-Oa 



-OB 








TP 


Chf-363B OR CM-734 


TP 


10 - - 
12 -- 


>- 

^ 


r^ ^ 




I-C^ 


Tif 




1 



(T) PIN NUMBER OF P/VC 

-|2 PIN NUMBER OF MICROCIRCUIT 

M3 REFERENCE DESIGNATION OF 
MICROCIRCUIT 

936 TYPE OF MICROCIRCUIT 



Figure 2. Sense Amplifier |ji -PAC, Models CM-363B/734, 
Schematic Diagram and Logic Symbol (Dwg No. A70022955, Rev. F) 



n 



td 

00 
W 



o 



a^ 
*■ 




{y «^M5) 




;RIT 



■'(Z> 



LOGIC SYMBOL 



CR2 



-Qvca 



-6V (34) 1 »— W ^- 

5 00 1 1 1 Ohvg 



-OvCC2 



J 



-o* 



-Ob 




(T) PIN NUMBER OF P4C 
-|2 PIN NUMBER OF MICHOCIRCUIT 

M3 REFERENCE DESIGNATION OF 

MICROCIRCUIT 
935 TYPE OF MICROOIRCUIT 



w 

td 

CO 

td 



-0 

U1 



> 

►1 






Figure 3. Sense Amplifier |j.-PAC, Models CM-489B/735, 
Schematic Diagram and Logic Symbol (Dwg No. A70022955, Rev. F) 



CM-384A 



RESISTOR H-PAC, MODEL CM-384A 

The Resistor ^-PAC, Model CM-384A (Figures 1 and 2), contains 20 3W wirewound 
resistors. Sixteen of these (R 1 through R16) are used as current limiting resistors for the 
inhibit drive lines. The four noninductive resistors fornn two groups of parallel pairs used 
as cur rent -limiting resistors for the X- and Y- drive lines. 



RI7 



RI8 




/ 



R6 



R2- 

R3 



z=.^W--I 



.R7 



'to^^— -r 



w< 



f yw 



%^«iMr.« 



iJ-- 



jmmM — * : 4 








6587 



Figure 1. Resistor fj.-PAC, Model CM- 384A, 
Parts Locations (A70022970, Rev D) 



Electrical Parts List (No. P70022970, Rev D) 



Ref. 
Desig. 



R1-R16 

R17 

R18-R20 



Description 



RESISTOR, FIXED, WIREWOUND: 30 ohms ±1%, 3W 
RESISTOR, FIXED, WIREWOUND: 60 ohms ±1%, 3W 
RESISTOR, FIXED, WIREWOUND: 50 ohms ±1%, 3W 



Part No. 



70 932 206 409 
70 932 223 123 
70 932 223 122 



2-65 



CM-384A 



& 
@- 



& 



& 



&■ 



& 



Rl 

-wv- 



R2 



R3 



R4 
-AAAr- 



R5 
-WAr- 



R6 
■AAAr- 



R7 
-WA- 



RS 
■AAA- 



R9 
■AAAr- 



RIO 
■AAA- 



Rl I 
-VNAr- 



RI2 
■AAAr- 



RI3 
■AAV- 



RI4 
■AAAr- 



RI5 
■AAAr- 



RI6 
-AAAr- 



RI7 
-WAr- 



RI8 
-WAr- 



RI9 
-WAr 



R20 
-AW- 



-© 



■O 



<D 



-® 



-© 



<S) 



5942 



Figure 2. Resistor |x-PAC, Model CM-384A, Schematic Diagram 



2-66 



DI-335 



NAND TYPE 1 PAC, MODEL DI-335 

The NAND Type 1 PAC, Model DI-335 (Figures DI-335-1 and DI-335-2), contains 
10 independent 2-input NAND gates. Each gate performs the NAND function for positive logic 
(+6V = ONE, OV = ZERO). For negative logic, it becomes a NOR gate. 

Two of the 10 gates have separate load connections available at the PAC terminals. 
Outputs of these gates can be tied together, using a single load resistor, without loss of 
output drive capability. A detailed description of the basic NAND circuit appears in Section 1 

INPUT AND OUTPUT SIGNALS 



Inputs 



When both inputs to a gate are +6V or not connected, the output is at ground. When 
any input is at ground, the output is +6V. 

Load 

This point is internally connected through a collector load resistor to +6V. 

Collector Output 

The collector output must be connected to at least one load resistor, either internal 
or external to the n-jodule. 

Output 

Each output terminal is internally connected to a collector load resistor. If an out- 
put is connected to load points or other outputs, the output drive capability of the structure 

is reduced. 



SPECIFICATIONS 

Frequency of Operation (SystetTij 

DC to 5 MHz 

Input Loading 

1 unit load each 

Fan-In 

Refer to Section 1 

Output Drive Capability 

8 unit loads each 

Outputs in Parallel 

Refer to Section 1 



Circuit Delay 

(Measured at +1. 5V, averaged over two 
stages) 
30 ns (max) 

Current Requirements 

+6V: 112 mA (max) 

Power Dissipation 

0. 67W (max) 

Handle Color Code 

Red 



2-67 



DI-335 




INPUT 



OUTPUT 



.CI 

> 0.03 3jjf 



LOAD 



COLLECTOR 
OUTPUT 



INPUT 



1341+6V 



(331 GND 






01-335 




DI-355 




SCHEMATIC 



PIN NUMBER OFPAC 

-|e pin number of MICROCIRCUIT 

M3 REFERENCE DESIGNATION OF 
MICROCIRCUIT 

F-04 TYPE OF MICROCIRCUIT 




LOAD 



COLLECTOR 
OUTPUT 



LOGIC SYMBOL 



Figure DI-335-1. NAND Type 1 PAC, 
Schematic Diagram and Logic Symbol 



2-68 



DI-335 




M3 



M2 



Ml 



^J^i r. 



% I r 



I ■ S '-f ■-! fill * ''s " '- 

h '..:■ '1 ^^ ■ =^^^ 1 IL ■' ,: ' ^.: 



Mini 



Figure DI-335-2. NAND Type 1 PAC, Parts Locations 



Electrical Parts List 



Ref. 






Desig. 


Description 


3C Part No. 


Ml, M2 


MICROCIRCUIT: 

F-02, quad NAND gate integrated circuit 


950 100 002 


M3 


MICROCIRCUIT: 

F-01, dual NAND gate integrated circuit 


950 100 001 


CI 


CAPACITOR, FIXED, PLASTIC DIELECTRIC: 
0. 033 laF ±20%, 50 Vdc 


930 313 016 



2-69 



DI-335 



APPLICATIONS 

The NAND gates operate on levels, pulses, or combinations of both. Two gates can 
be wired back-to-back to form a dc set-reset flip-flop. 

The two gates with separate load outputs form standard NAND gates when the load 
and collector output terminals are connected. When the collector outputs of gates are con- 
nected in parallel as in Figure DI-335-3, the AND-OR -INVERT function is performed. At 
the point where the outputs are tied together, an AND operation with logic ONEs (OR opera- 
tion with logic ZEROs) takes place. 




C 




G = AB + CD + EF=(AB)»(CD)«(EF) 




Figure DI-335-3. NAND Type I PAC, 
Gates Used in Parallel 



2-70 



XP-330 



EXTENDER PAC, MODEL XP-330 

The Extender PAC, Model XP-330 (Figure XP-330-1), provides unobstructed access 
to any (i-PAC while it is electrically mounted in its appropriate (x-BLOC connector. The 
connector terminals at the front end of the XP-330 mount into any fi-BLOC connector and 
the connector at the rear accepts the |jl-PAC it is displacing. Front and rear terminals 
are directly tied together electrically. 




Figure XP-330-1 , Extender PAC 



2-71 



CHAPTER III 
CSM-150 CORE MEMORY MODULE 



SECTION 1 
INTRODUCTION 



GENERAL DESCRIPTION 

The 8192-word CSM-150 Core Memory Module, used for the Type 316 processor main 
memory, has a word length of 17 bits. The 17th bit is not used if the mainframe does not 
have the parity option. The nominal memory cycle time is 1600 ns . The module occupies 
one l-by-3 location in the processor drawer and can be paralleled with up to three modules 
on a single memory bus. A 4096-word, 17-bit memory module is also available for main- 
frames requiring only 4096 words of memory. Expansion above 4096 or 8192 words is 
allowable in 8 192 -word increments only. 

Physical Description 

The core memory module is packaged on a backplane with 7 rows of 3-connector-high 
assemblies. The connectors are mounted on 0.375-inch centers. Each connector is 2.3 
inches long and has a double row of 34 solder less -wrap pins. The backplane assembly, 
when mounted in the H316 drawer, takes the same area as the CSM-160 Core Memory 
Module but requires extra height, which is available in the drawer. The printed circuit 
board used in the design is the MACRO-PAC with three connector tongues. The IvIACRO- 
PAC measures 8.45 by 4. 5 inches. The core plane unit is a two-board folded design that 
plugs into two rows of six connectors. The X and Y drive electronics is packaged on one 
printed circuit board, and the sense-digit electronics is packaged on two printed circuit 
boards, thus requiring three rows of connectors for circuit boards. The I/O and module- 
to-module interconnections are accomplished by using cable PACs that plug into two con- 
nectors in each outside row of the backplane assembly. 

Electrical Design 

The CSM-150 Core Memory Module is built around a magnetic core array wired in a 
3D, 3 -wire organization, where each core is threaded by three wires; two of these wires 
are used for addressing a word, and the third is used for both reading and writing data in 
the bits of a word. Integrated circuits are used for addressing and read sensing, and a 
transfornner-coupled discrete transistor driver is used for writing. The remaining circuits 



3-1 



are of the common or high-speed TTL type, with open-collector drivers on all outputs. 
The required memory voltages are +6, -6, and +15 Vdc, with the last one requiring 
temperature compensation for operation over the specified temperature range. The data 
outputs fron:i the module are the outputs of open collector hex buffers. 

SPECIFICATIONS 



General 



Organization 
Capacity 

Word Size 

Addressing 

Modes of Operation 

Cycle Time 

Access Tinne 



3 -wire, 3-D coincident current 

4096 or 8192 words, expandable in 8192-word 
increments only 

17 bits 

Random access 

Clear-Write 
Re ad -Write 

1600 ns (maximum rate at which memory may 
be cycled for all modes) 

350 ns max from MXYTM+ input 



Physical (Nominal) 

Width 
Length 
Thickness 
Weight 



2-3/4 in. (7.00 cm) 
9-7/16 in. (24.00 cm) 
5-3/4 in. (14.60 cm) 
2.3 lb (1.05 kgm) 



Environment 



Operating Temperature 

Storage Temperature 

Relative Humidity 

Cooling 

Altitude 

Magnetic Fields 



to +60°C 

-55 to +85°C 

95% without condensation 

220 linear ft per min. 

15,000 ft max. 

3.0 gauss max. magnetic field strength at 
the core plane 



Power 



Current requirements are listed in Table 3-1-1. The +6 Vdc and -6 Vdc inputs must 
be held within ±5 percent at the backplane of the core memory module. The +15 Vdc must 
be within the range shown in Table 3-1-2 at the backplane pins. Current drain on the 



3-2 



+ 15 Vdc supply and power dissipation in the core memory module are strongly dependent 
on the number of data zeros being written into the memory. 





C 


Table 3-1-1, 
urrent Requirements 


Voltage, 
Vdc 




Current, 


Amperes 


Active 
1.27 


Standby 


+ 6 




1.01 


-6 






0.25 


0.25 


+ 15 






3.50 


0.32 



Table 3-1-2. 
Operating Limits of Temperature- 
Compensated 15 VDC Supply 



Temperature, 


Limit, 


°C 


Vdc 





15,6 ±0.6 


25 


15.0 ±0.8 


60 


14.0 ±0.6 



Interface 



Input, Standard 



Input, Exceptions 
MXYTM+ 
WRITE-, 

MADCL-A, Address and 
Bank Select 

Output, Standard 



One standard TTL load 

-2.0 mA max, at+0,4V 

+ 50 i^A max, at +2,4V 

+ 1. 0mA max, at +5, 5V 

Input uncertainty range, +0, 8 to +2, OV 

Three standard loads 
Two standard loads 



One open-collector drive 
+ 0, 4V max. at +20 mA 
+ 250 fj.A max, at +5, 5V 
All outputs are 7407 except EPARB+ 
(74H04) and PAMEO- (7405) 



Data Retention 

Data stored in the memory will not be altered during power on/off sequencing if the 
following conditions are met, 

a. Sequencing Up -- No commands to the memory module should be initiated until 
all the supply voltages have attained their nominal values (within the limits of the 
specified tolerances). The +6 and -6 voltages should attain 90 percent of their 
nominal values prior to sequencing up the +15V supply. 

b. Sequencing Down -- Memory cycle should not be in progress (all commands to 
the memory are halted) prior to or during the power down sequencing. The +15V 
should reach +3V prior to sequencing down the -6V and +6V supplies. 



3-3 



Parity 

All core memory modules contain storage for the parity {17th) bit, the data register, 
and the parity generation electronics. These circuits are not used if the CPU does not have 
the parity option. 



3-4 



SECTION 2 
OPERATING PROCEDURES 

OPERATING MODES 

The core memory, when commanded by the processor, performs read or write cycles 
at 1600 ns or slower. The address, mode, and exact timing of these cycles are controlled 
by the processor. All operating modes, each requiring one memory cycle, are listed in 
Table 3-2-1. 

Table 3-2-1. 
Operating Modes 

Mode Description 

Read-Write One word read from storage onto memory data 

output bus. Storage location cleared by fetch 
but written into storage from data input bus. 

Clear-Write One word in storage cleared and written with 

new data from memory data input bus. 

ADJUSTMENTS AND LIMITATIONS 

Adjustments 

No operating adjustments are required for the core memory module. The power 
supply voltages and strobe calibration should be checked, as specified in Section 6. 

Limitations 

Cooling. -- Systems containing core memory must not be operated unless the cooling system 
is functioning properly. Fan failures longer than 30 seconds cause overheating and may 
damage components. Blockage of cooling by cables or dust must be avoided to ensure cool 
air at a uniform temperature (±5°C) to all core memory modules operated from a single 
temperature-compensated power supply. 

Looping. -- Higher memory reliability and lower power drain are achieved if a single cycle 
loop is avoided. Preferred loops occupy two or three cycles and contain mostly ONEs in 
instruction and operand words. 



3-5 



SIGNALS 

The following signal descriptions assume the reader has some familiarity with the 
organization and operation of the core memory module. Persons unfamiliar with the module 
should read Section 3, Functional Theory of Operation. 

Address Interface Signals 

Address Inputs (MADD04+ through MADD16+). -- Input signals to the address registers are 
single ended and are stored in registers under the control of MADCL-A. 

Bank Select Input (BANKX-). -- The memory bank-select input, a single-ended signal, is 
stored in a register under the control of MADCL-A. A ground level on BANKX- signifies 
module selection, BANKA-, BANKB-, BANKC - and BANKD- control memory modules A, 
B, C and D, respectively. 

Data Interface Signals 

Data Inputs (M01FF+ through M16FF+). -- Data inputs to the inhibit drivers are single 
ended and buffered through a 74H04. A high data input during the write cycle results in no 
inhibit current, and a ONE will be stored in the memory. 

Data Outputs (MMOIF- through MM16F-). -- Data outputs are single ended and supplied in 
open collector 7407 gates for wire-OR'ing with other modules. A negative data output pulse 
signifies a ONE output from the memory. 

Timing and Control Interface Signals 

Memory Read/Write Timing (MXYTM+). -- MXYTM+ is a single rail, positive -going double 
pulse that starts the read and write cycle timing in the core memory module. 

Memory Strobe Enable (MSTEN-). -- MSTEN- is a single rail input to the core memory 
module that, when low, enables the memory sense strobe generation circuit. 

Memory Address Register Clear Command (MADCL-A). -- Address register clear com- 
mand is a single rail negative pulse whose trailing edge latches the address and bank regis- 
ter flip-flops. It is also used as parity data register clear pulse. 

Write Enable (WRITE-). -- Write enable, a single rail negative pulse, gates the MXYTM+ 
command to generate the write timing for the core memory module. 



3-6 



Parity Bit Data Output (PAMEO-). -- The sense data output of the parity bit is stored in 
the parity data register, and the buffered output of the register (PAMEO-) is transmitted to 
the processor for parity error checking. 

Parity Generator Output (PAGEO-). -- This is the output of the parity tree transmitted on a 
single rail to the processor. 

Parity Error Strobe (EPARB+). -- This is a parity strobe pulse generated in the core mem- 
ory module and transmitted single rail to the processor for parity error strobing. 



3-7 



SECTION 3 
FUNCTIONAL THEORY OF OPERATION 



BASIC OPERATION 

The core memory module consists of an array of 139, 264 ferrite cores including 
those for the parity bits, surrounded by interface and control electronics. The core plane 
serves as a storage device due to the magnetic properties of the ferrite cores. Each ferrite 
core has two possible stable magnetic states, arbitrarily called ONE and ZERO. The act of 
writing a ONE consists of altering or switching a ferrite core from its ZERO state. To 
write a ZERO, the ferrite core is prevented or inhibited from altering its state. To read a 
ONE, the ferrite core is switched from its ONE to its ZERO state. The change of flux thus 
produced develops a voltage that is detected by the sense amplifier connected to the sense- 
inhibit line. To read a ZERO, the core remains in its ZERO state; therefore, no change of 
flux is detected. The purpose of the electronics surrounding the core array is to detect a 
particular word-set of cores in the array and either clear them and write in new data, or 
sense them and then, since the word has been set to ZERO in order to sense it, save and 
rewrite the sensed data back into the word. The time taken by either of these two opera- 
tions, clear -write or read-regenerate, is one memory cycle. 

FUNCTIONAL ELEMENTS 

LED 8114, Drawing No, 70032889, in Section 9 best illustrates the CSM-150 Core 
Memory Module. For additional details of each functional element and circuit, see Section 
4, Detailed Theory of Operation, and the logic block diagrams in Section 9. 

Storage Array 

The storage array, which is the core plane, consists of 139, 264 ferrite cores, in- 
cluding the parity bit, wired into an array to permit access of one of 8192 words (17 bits 
per word) per memory cycle. Addressing the array requires selecting one of the 128 
X-lines and one of the 64 Y-lines and pulsing these lines with two address, selection currents 
(nominally 400 mA in amplitude and 300 ns wide) twice per cycle. The core plane is also 
threaded with 17 sense-inhibit lines, each passing through one ferrite core at each of the 
8192 different X- and Y-line intersections. In every cycle each sense-inhibit line requires 
a nominal 750 mA, 350 ns wide inhibit current, if, in that bit, a ZERO is to be written. A 
data output from the array on the sense-inhibit winding is a differentially sensed voltage, 
approximately 38 mV for a ONE and less than 12 mV for a ZERO. Included on the core 
plane are 8-by-8 and 8-by-16 bipolar diode matrices which, coupled with the inherent 
64-by-128 decoding in the array, simplify the addressing of 8192 separate words. These 
diodes are packaged in a 14-pin dual in-line package with 16 diodes per package. In the 



3-8 



two-diodes-per-line selection scheme used in this design, 16 DIPs (256 diodes) for the 
X-line selection (128 lines) and 8 DIPs (128 diodes) for the Y-line selection (64 lines) are 
required, thus nnaking a total of 24 diode DIPs to complete the X-line and Y-line selection 
for the 8192-word core plane. 

Selection Interface Circuits 

Address selection currents are driven through the storage array from selection inter- 
face circuits, via the X- and Y-diode matrices. The address bits (13 for an 8192-word 
memory and 12 for a 4096-word memory) and Bank-Select signal supplied to the memory 
are latched in registers within the core memory module. These registers are set up before 
a memory cycle and remain stable for the duration of that cycle. The MA04 address regis- 
ter output is disabled for 4096-word memories, as shown in LBD 8101, Drawing No. 
C70032890, in Section 9. Selection circuits decode the address bits to select and drive a 
unique word in the nnemory. All currents are disabled if the core memory nnodule is not 
selected by the BANKX- signal. 

Write or Regenerate Interface Circuits 

The core memory module contains 17 write circuits, one per bit in the data word. 
The information present on the data input bus lines is used to write data into the memory. 
During the second, or write, portion of a memory cycle, a write -inhibit current will be 
supplied to the core array if that data bit is to be stored as a ZERO. No inhibit current 
occurs if a ONE is to be written. Write circuits are required to write data in a word being 
read (Read- Write cycle) as well as to alter the stored data (Clear-Write cycle). 

Read Interface Circuits 

The core memory module contains 17 read circuits, one per bit in the data word. 
During the first, or read, portion of a memory cycle, the sense amplifiers, at strobe time, 
discriminate between the core ONE and ZERO signals on the sense-inhibit lines. If a ONE 
is detected, the Memory Data output bus is pulled to ground for the time shown in Section 9, 
LBD 8110, Drawing No. C70032895. If a ONE is not detected in a bit, no action occurs, and 
the data output bus remains high. 

Timing and Control Circuits 
t' 
Input signals MXYTM+ and WRITE- control the majority of timing in the core memory 

module. These signals are gated and buffered to control the inhibit-current pulse widths and 

delayed to provide the proper read- and write-drive current timings. 

The sense amplifier strobe pulse is generated by a one-shot during the read portion of 
a read-write cycle. The MSTEN- input gates the sense amplifier strobe during a read- 
write cycle. 



3-9 



Parity Logic 

Electronics to generate odd parity during every memory cycle are included in every 
core memory module. Also included is a parity data register to store the parity bit data 
output from the read portion of a read-write cycle for use later in the cycle for parity 
error check and parity rewrite. 

The output of the parity generator is buffered through two separate buffers to drive 
two individual memory interface lines, PAGEO- and PAMEO-, The signal PAGEO- indi- 
cates to the processor the output state of the parity generator for comparison with PAMEO- 

The buffered outputs of the parity register and parity generator output (gated with 
LPREG+) are coUector-OR'ed to drive the memory interface line PAMEO- and also tied 
internally to the memory write interface circuits to close the parity regeneration loop. 

The use of parity by the processor is an optional feature at the CPU. 



3-10 



SECTION 4 
DETAILED THEORY OF OPERATION 



STORAGE ELEMENT 

Information in a core memory is stored in an array of ferrite toroidal cores. Each 
core may be individually set to one of two magnetic states, thereby representing one bit of 
binary information. A discussion of ferrite core storage is best conducted in ternns of the 
core B-H relationship, shown in Figure 3-4-1. Magnetizing force, H, is proportional to 
the total current on wires passing through the core. Magnetic flux density, B, is propor- 
tional to the resulting magnetization of the core. Figure 3-4-1 illustrates two useful 
properties of the core. First, the core is a threshold element. A core in state B„ remains 
in that state if a magnetizing force of magnitude H or less is applied and removed. Second, 
the core is a menaory element. If a larger magnetizing force, H , is applied, the core 
switches from the state of negative magnetic flux density, B-, to the state of positive 
magnetic flux density, B and remains there even after H is reduced to zero. The core 
remains in state B until an equally strong magnetizing force in the opposite direction 
switches it back to B . Figure 3-4-1 also illustrates one difficulty of core storage. In 
order to sense the state of a core it is necessary to measure the change in B resulting from 
the application of a force H, and the change in B is almost undetectable until that force 
exceeds H,. Therefore, a core must be switched to be sensed. 




Figure 3-4-1, Ferrite Core B-H Characteristics 



3-11 



STORAGE ARRAY AND ADDRESSING 

Read- Write Cycle and Coincident Current Selection 

The storage array is formed by arranging cores and wiring so that there are as many 
sets of cores as there are bits in the storage word. In each set of cores a common sense- 
inhibit wire threads every core, and running through all sets are X- and Y-address selection 
lines that intersect each other only once in each bit-set of cores. A two-bit, four-word 
array is shown in Figure 3-4-2. 





READ HALF 
CYCLE 

ONE 

WRITE HALF 
CYCLE 

ZERO 



+ 1/2 Ip 


+ 1/2lp 





-1/2 Ip 


-1/2 Ip 





+1/2 Ip 



1/2 Ic<It< I[ 



WHERE Ij ISTHE MINIMUM CURRENT 
REOUIRED TO SWITCH A CORE. 



Figure 3-4-2. Two-Bit, 4-Word, 3D, 3-Wire Core Array 

Figure 3-4-2 shows that if a current, slightly weaker than required to switch a core, 
is applied to one X-line and one Y-line, then only one core per bit mat will see a current 
Ijj + I strong enough to cause switching. If that core switches, a voltage is induced in the 
sense winding for that bit and shows up at the sense terminals, S^ or S^. A core that 
switches as a result of such read-select currents is defined as having been in the ONE 
state. All cores in the selected word are then in the ZERO state after the read-select 
currents have ended, either because they were already ZERO, or because the read currents 
switched them to ZERO. After the read half cycle currents have read and cleared the 
word, write half cycle currents are applied to the same X- and Y-lines. These currents 
are equal to, but of opposite polarity from, the read-select currents. Again, only one 
core per bit set may see a total current strong enough to cause switching. The write half 
cycle currents drive all the bits in the selected word back to the ONE state. If a ZERO is 
to be written into a particular bit instead of a ONE, the sense-inhibit winding for that bit is 
driven with an inhibit current 2I„,, which cancels one write-select current in the selected 
core. The inhibit current prevents that core from switching out of the ZERO state. As 
many inhibit currents are required as there are ZEROs in the word to be written. Study of 
Figure 3-4-2 will prove that the inhibit current does not add to any write select currents, so 
no other core in that bit-set will be switched during a write half cycle. 



3-12 



Figure 3-4-3 shows the means of connecting two diodes to one end of each X- or Y- 
selection line and bussing the other ends of the selection lines to form a 2-by-2 bipolar 
diode matrix. The matrix permits driving a particular selection line, without driving any 
other line, by selection of one bus line and one pair of drive lines (one drive line for each 
current polarity). The simplified matrix shown is not efficient, but the actual matrix is 
efficient, since one of the two matrices, namely the Y-matrix on the core plane, addresses 
64 drive lines with only eight bus lines and eight drive line pairs. The X-matrix addresses 
128 lines with 16 bus lines and 8 drive line pairs. A 4096 word memory module has an 
8192 word core plane, but half the X address lines are disabled by the MA04 address regis- 
ter wiring change shown in Section 9. LED 8101, Drawing No. C70032890. 



X OR Y 
DRIVE 
LINES 



oo- 

io- 



20 



30- 



'w 



'W 



-M- 



-M- 



-W- 



■+#- 



*♦ — f — M '> 



-»■ 



CORES 



/y\\yy\\ 



XOR Y 

SELECTION 

LINES 



yy v^ yy \^ 



-O 



-O 1 



XOR Y 
BUS 

LINES 



Figure 3-4-3. Two-by-Two Bipolar Diode Matrix 



SELECTION CIRCUITS 



Selection Switches 



Figure 3-4-4 illustrates how bipolar selection currents are driven through the 
storage array. Each switch circuit acts as a single-pole, double-throw switch. If all sbc 
address bits are true, a pair of read-timing or write-timing commands cause a current 
path to be completed through the selection line, from the drive current node to ground. 
The current flows through the selection line in either of two opposite directions, depending 
whether read or write timing is commanded. The core memory module contains 8 drive 
line switches and 8 bus line switches for the Y-axis and 8 drive line switches and 16 bus 
line switches for the X-axis. 



3-13 



)+15V 

DRIVE 
(CURRENT NODE 



READ 
TIMING" 




ADDRESS 
BITS 



=D-' 



WRITE 

timing' 



TTTTTTTr 

8 
DIODE 
PAIRS 




8 , 
SELECT' 



LINES 

//\\//\\ it H 



t^ 



iximL 



'w ' 



<J^ 



_ WRITE 

'timing 



ADDRESS 
BITS 



J 



J ^ 



7^ 



READ 

"timing 



DRIVE LINE SWITCH 
(1/2 25862) 



SELECTION LINE 
WITH MATRIX DIODES 



BUS LINE SWITCH 
(1/2 25862) 



Figure 3-4-4. Selection Switches 



DATA LOOP 



Read Data Path 

The read data path is illustrated in Figure 3-4-5. The ONE signal from the core 
plane is a differential signal of typically 38 mV peak amplitude, of either polarity (hence 
the sense amplifier exclusive-OR symbol). The ZERO signal is ideally zero, but various 
effects bring it up to about 10 mV at strobe time. The sense amplifier is biased with 
external resistors to discriminate between ONEs and ZEROs at a nominal threshold of 
18 mV. The sense amplifier is strobed early in a memory cycle when the address selection 
noise on the sense-inhibit lines has decayed below the threshold level. If a ONE is detected, 
a negative going pulse appears on the data output bus. If a ZERO is present, the data output 
remains high. A pulse stretcher circuit on each data output circuit guarantees the minimum 
pulse width needed to set the memory information register in the CPU. All data output lines 
are from open collector 7407 buffers. 

O +5V <? +5V 



ONE SIGNAL O- 
FROM CORE 
PLANE °- 



v^^y 






DATA OUT TC 
MEMORY BUS 



OUTPUT BUFFER 



STROBED SENSE 
AMPLIFIER 



PULSE 
STRETCHER 



Figure 3-4-5. Read Data Circuits 



3-14 



There are 17 read circuits in a core memory module, including the parity bit. The 
17th bit is not used if the CPU does not have the parity option. 

Write Data Path 



The write data path is shown in Figure 3-4-6. Inhibit current is driven into a sense- 
inhibit winding only when a ZERO is to be written in that bit of the word. The two-input gate 
turns on (ground output) at inhibit time if the memory data input is low. Current in the gate 
output is coupled through a 1 to 1 transformer to turn on the inhibit driver transistor. The 
saturated transistor completes the inhibit current path, from +15 Vdc through the sense- 
inhibit winding to ground. The value of inhibit current is set by the +15 Vdc supply and the 
inhibit resistor. A balun-connected transform.er forces equal current sharing in the two 
legs of the winding. 

When inhibit time ends and the transistor is turned off, inductance of the inhibit 
winding tends to continue the current flow in the same direction as before, and the inhibit 
driver end of that winding swings sharply to a negative voltage. The turnoff diode clamps 
this swing and provides a path for the current to decay exponentially to zero. There are 17 
inhibit circuits in a core memory module. 



H5 VDC 



INHIBIT 
TIMING 



DATA 

INPUT 

FROM 

MEMORY 

BUS 




INPUT 
GATE 



DECAY CURRENT PATH 

^ ^W-^V. 

INHIBIT DRIVER & INHIBIT 



J V 



r^TU-T^ 



TURNOFF DIODES 



SENSE/INHIBIT 
RESISTOR WINDING 



CURRENT BALANCE 
CIRCUIT 



Figure 3-4-6. Inhibit Circuit 



TIMING AND CONTROL 



Refer to Section 9 for detailed diagrams of the timing circuits. Signal names used 
below follow the same conventions used in the LBDs in Section 9; that is, when several 
similar signals (e.g., data inputs) are described together, their differentiating characters 
(e.g., MOJ.FF+) are replaced with double letters (MXXFF+). Also, signals that differ only 
by a suffix (INHEN+A and INHEN+B) have identical timing except for differences in gate 
delays. 



3-15 



m 



Address and Current Timing 

Prior to a memory cycle, address and bank-select are gated into registers by 
MADCL-A. Register outputs follow the inputs as long as MADCL-A is low. 

The cycle begins with the leading edge of the first positive pulse of MXYTM+. The 
leading and trailing edges of this first pulse are shifted in an RLC network and combined i 
gates to form read current timing commands {XRSW+. XRSK+A, XRSK+B, YRSW+ and 
YRSK+). The second positive pulse of MXYTM+ is similarly shaped to produce the write- 
timing (XWSW+A, XWSW+B, XWSK+. YWSW+, YWSK+) and inhibit -timing (INHEN+A and 
INHEN+B) signals. 

Data Loop Timing 

Sense amplifier strobe (STROB-) timing is generated by ANDing three signals: XRSW+ 
(read current timing signal). MSTRB- (reset output of a one-shot triggered from YRSK+), 
and MSTEN+ (buffered memory strobe enable input from the CPU). 

The XRSW+ input removes a race condition due to triggering delay in the one-shot and 
also defines the trailing edge of strobe. The MSTRB- input defines a critical timing edge, 
the leading edge of strobe. The MSTEN+ input disables the strobe pulse during clear -write 
cycles. The strobe pulse enables the sense amplifier data to the data output bus through the 
pulse stretcher and buffer. 

Parity Logic 

The electronics and logic associated with the parity bit consist of the following: 

a. The 17th bit (parity bit) read data path, 

b. The 17th bit (parity bit) write data path, 

c. The parity generator, 

d. The parity data register. 

The 17th bit, read-data and write-data paths have previously been explained. The 
parity generator consists of two 8-bit parity generator checker circuits (PGl and PG2) 
connected in series to generate odd parity. The system data input lines are broken into two 
8-bit groups. The buffered outputs of M01FF+ through M08FF+ drive PGl, and the output 
of PGl and buffered outputs of M09FF+ through M16FF+ drive PG2 (see Figure 3-4-7). The 
output of the parity generator is buffered through the 7404 and 7407 gates to drive the mem- 
ory interface line designated PAGEO-. The output of PG2 is also gated with a timing pulse 
called LPREG+. The output of this gate is coUector-OR'ed with the parity register's buf- 
fered output to control the interface signal line called PAMEO-. The PAMEO- has two func- 
tions depending upon the memory cycle in progress. During a read-write cycle the 17th bit 
is stored in the parity register and PAMEO- is used to compare with PAGED- at the pro- 
cessor end. It is also tied internally to the write interface to complete the regeneration or 
write portion of the cycle. During clear-write cycles PAMEO- is controlled by the gated 
output of PG2 to write the parity information into the memory. 



3-16 



PARITY BIT 



BIT 17 
SENSE 
INPUTS 





MOIFF + 
THROUGH > 
M08FF+ 
DATA INPUTS, 
BITS I THROUGH 8 




INHIBIT 
CIRCUIT 
SAME AS 
FIGURE 
3-4-6 



IZ 17+ BIT 17 
INHIBIT LINE 



+6V 



LPREG+ O- 



PG2 



M09FF+ 8 

THROUGH > 3 

MI6FF + 
DATA INPUTS, 
BITS 9 THROUGH 16 



PAMEO — 
OUTPUT 



+ 5V 





PAGEO- 
OUTPUT 



Figure 3-4-7. Parity Generation and Register Logic 



TIMING DIAGRAMS 

Refer to Section 9, LBDs 8110 and 8111, Drawing No. C70032895 and G70032897, for 
interface and internal timing, respectively. 



3-U 



SECTION 5 
INSTALLATION 



Service personnel should be familiar with the complete installation procedure and the 
interface requirements before attempting to install the core memory module. 

TOOLS AND TEST EQUIPMENT 

Table 3-5-1 lists the tools and equipment required to install the core memory module. 

Table 3-5-1. 
Installation Tools and Test Equipment 

Quantity Description Type or Equivalent 

1 Digital voltmeter Honeywell Model 623 (±0. 05% F. S. , 

1 Megohm Input Resistance) 

1 Trimpot adjustment tool 

or screwdriver 

1 Screwdriver Phillips 

2 Screw, pan head 70904113021 
2 Lockwasher, split 70902006078 
2 Washer, flat 70902054003 
2 Bushing, insulated 70916300007 

2 Spacer A700322753701 

SPACE AND ENVIRONMENT 

The core memory module occupies the same space as a l-by-3 omni-BLOC. 
Environmental specifications are listed in Section 1. 

INTERFACE CONSIDERATIONS 

The interface requirements are met by inserting the two I/O cable PACs into the 
appropriate connector slots provided in the memory connector block. Interface pin con- 
nections and cable PAC locations are shown in LBD 8112, Drawing No. C70032896, in 
Section 9. 

INSTALLATION PROCEDURES 

Unpacking, Repacking and Reshipping 

Upon receipt of the core memory module, care must be exercised in unpacking. A 
thorough visual inspection should be made for damage and loose hardware. Check for 



3-19 



foreign objects between the core plane boards. Extreme caution must be observed to 
prevent any object from penetrating into the core plane area. 

Should reshipping become necessary, wrap the module in plastic, seal with tape, and 
place in a sturdy cardboard box with more than one inch of resilient packaging on all sides. 

Mechanical Procedures 



Insert the core memory module with the circuit boards side up in the upper level of 
the chassis. Use the spacer, tools, and mounting hardware outlined in Table 3-5-1. 

Electrical Checkout Procedure 



To perform the electrical checkout procedure, 

a. Load the Core Memory Test Program, CMT5, Document No. 70181454000. 

b. Run the diagnostic test in the installed module. 

c. Halt the program, fetch any location in the module, turn power off and on, and 
fetch the location again to see that it is unchanged. 

d. Perform the voltage and strobe margin checks described in Section 6. 



3-20 



SECTION 6 
MAINTENANCE 



EQUIPMENT CONFIGURATION 



Mechanical Assemblies 



The mechanical components of the core memory module are shown in Section 10. 
There are five major subassemblies: three circuit boards, one core plane, and one 
solderless-wrap connector backplane. 

Module Location 

The core memory module occupies the same area as a l-by-3 omni-BLOC. Since 
the CSM-150 Core Memory Module is higher than a CSM-160 Core Memory Module, it 
requires slightly different mounting methods, as described in Section 5. 

OPERATOR MAINTENANCE 

No operator maintenance is necessary on the core memory module. The operator 
should periodically check the cooling fans and air filters. 

STANDARD MAINTENANCE 

Tools and Test Equipment 

The tools and equipment listed in Table 3-6-1 are needed for maintenance and 
troubleshooting in addition to those listed in Table 3-5-1. 

Table 3-6-1. 
Troubleshooting and Maintenance Tools and Test Equipment 

Quantity Description Type or Equivalent 

1 Oscilloscope Tektronix 454 

1 Multimeter Simpson 260 

3 Card Extender PACs Honeywell XP-330 

1 MACRO-PAC Extractor Tool Honeywell B70026032701 

1 AC Current Probe Tektronix P6020 

1 Hand Wire-Unwrapping Tool Gardner-Denver 505244 

1 Hand Wire- Wrapping Tool, Honeywell 70917200001 

Battery-Operated (Gardner-Denver No. 14R2) 

1 Wire Stripper Honeywell 70917250001 (Ideal 

45-179) 



3-21 



Table 3-6-1. (Cont) 
Quantity Description Type or Eq uivalent 

5 Ft No. 30 AWG Solid Wire Honeywell 70940061010 

1 Quick Disconnect Terminal T & B WT 145 

Crimper 

Preventive Maintenance 

Cleanness. -- The core memory module must be kept free of dust, dirt, and any foreign 
objects. The air filter of the cooling system must be kept clean to ensure sufficient air 
flow. Should it be necessary to clean the core plane, only use de-ionized water . However, 
cleaning the core plane is not recommended as a field procedure. 

CAUTION 
Never use an air hose to clean the core plane. 

Margin Checks. -- The power-supply margin checks can detect performance degradation 
before operational failures occur. The memory drive and inhibit currents are determined 
by the setting of the +15 Vdc supply and the resistors on the CM-866 and CM-867 boards. 
The +15V supply setting should be periodically checked by using a voltmeter capable of 
reading the voltage within ±1 percent. Measurements should be made at the memory 
terminals while a program is running in the memory. The CMT5 diagnostic program con- 
tains several test patterns, including the worst pattern (exclusive-OR of MAD13- and 
MAD08-), all ONEs and all ZEROs. Failure points at the high +15V setting (do not exceed 
+ 17. 5V) and low+15V setting should be noted; their differences should be at least 1.6V at 
25°C and 1. 2V at and 60°C. The +15V supply should be set at the center of the failure 
point margins. Temperature tracking specifications are listed in Section 1. 

Adjustment 

The core memory module has no adjustable components. The timing of the sense 
amplifier strobe pulse is set at Honeywell Inc. for each unit to give optimum operating 
margins. It is not necessary to adjust the strobe timing. If a change in timing is required 
to obtain proper memory operation, the associated boards and core plane should be checked 
before a change is made. 

Table 3-6-2 presents the strobe jumpers that can be added for test purposes to un- 
cover marginal operation. The jumper locations are shown in Figure 3-10-1 in Section 10 
and on LED 8101, Drawing No. C70032890, in Section 9. 



3-22 



Mode 



Early Strobe 



Late Strobe 



Normal 



Table 3-6-2, 
Memory Strobe Test Modes 



Mean 

Jumper J 2. (between 
SST5 and SST2) 



Jumper J3 (between 
SSTl and SST4) 

No Jumpers 



Function 



Increase tendency for memory 
to pick ONEs (detect margi- 
nal ZERO bits) 

Increase tendency for mennory 
to drop ONEs (detect margi- 
nal ONEs ) 

Normal 



Removal and Replacem e nt 

The board connectors are polarized to protect against incorrect board insertion. 
Board removal from the memory is accomplished by engaging the cut-out in the handle of 
the board with the board extractor tool. Do not remove or insert printed circuit cards 
without turning off the dc power. Additional care should be taken when removing the 
CM-867 data board adjacent to the I/O cable slot in the first memory module as the cable 
sleeving can be ruptured due to scratching by the DIP leads on the etch side of this board. 

CAUTION 

Remove the boards on both sides of the core plane. 
This allows more room for gripping the handle when 
removing the core plane. Do not use the MACRO- 
PAC Extractor Tool or any other tool; otherwise, 
damage to the core plane will result. 

When replacing defective components, use a low-wattage soldering iron and rosin 
60/40 solder. Remove excess solder frona the printed circuit board. Care should be taken 
to avoid lifting the etch. 



3-23 



SECTION 7 
TROUBLESHOOTING 



GENERAL, PROCEDURES 

The following steps should be performed before repairing the module, 

a. Uncover symptoms. 

b. Determine type of problems. 

c. Determine section at fault. 

d. Locate faulty circuit. 

If the module is to be forwarded for repair, troubleshooting should nonetheless be 
carried at least through Step b and specifics of the problem forwarded along with the 
module. Include the module serial number with all documentation. If the module is to be 
replaced, use the checkout procedure in Section 5 on the new module. The reader should 
be familiar with the material in previous sections of the manual before attempting repairs 
other than module replacement. Refer to Section 6 for maintenance tools and procedures. 
Section 8 for signal mnemonics. Section 10 for mechanical assemblies, parts locations, and 
parts lists, and Section 9 for logic diagrams and detailed timing diagrams. 

SPECIFIC PROCEDURES 

Module Interchangeability 

Module interchangeability involves no wiring changes. Unless the problem is a 
marginal condition in the processor or power supply, module swapping will isolate a faulty 
module. Because of the above uncertainty, diagnosis should be carried beyond module 
swapping. All memory boards with the same designation are interchangeable. For 
example, a CM-867B will replace a CM-867B, CM-867A or CM-867, A CM-867 will not 
be interchangeable with a CM-867A or CM-867B.* 

Core Memory Test Program 

The core memory test (CMT) program exercises the memory in various troublesome 
and diagnostic patterns and prints out errors. It is useful for uncovering and determining 
the type of problem. 

Control Panel Debugging 

Control panel debugging is invaluable if the processor cannot load and run CMT, but 
is almost useless for intermittent or pattern-sensitive errors. A general path to try is as 

*This is an example only. CM-867A and CM-867B do not exist at this time. 



3-24 



follows. Store ONEs throughout the module, and examine suspect locations. Repeat with 
ZEROs. To check if address bit circuits are operating, go to the lowest address in the 
module, and store ZERO in it. Set each address bit (4 through 16) to ONE, one at a time, 
and store the address in itself. Fetch the lowest location again, check that it is still ZERO. 
Store ZERO in it again. Fetch each of the other locations stored; they should be unchanged. 
Any errors in the words being read will point to the address bit at fault. This test is most 
stringent with +6 Vdc supply to the module set 5 percent low. In all above tests, fetching 
two or three times at the same address will check regeneration. 

Waveform Checks 

Waveform checks isolate a problem tp a specific circuit. The majority of signals can 
be observed on the backplane connector pins or the board test point terminals (labelled TP 
on the LBDs and assembly drawings). If additional signals must be viewed, three XP-330 
|i-PAC extenders can be used. 

The drawings in Sections 9 and 10 can be used to determine the proper waveforms. 
Common circuits (e.g., data bits) can be compared to determine signal differences. Check 
the CM-866 drive and timing signals if failures are common to all data bits. Observe the 
CM-867 sense and inhibit waveforms if failures are at all locations and at some or all data 
bits. Probing sense amplifier inputs requires a differential oscilloscope preamplifier and 
should be done carefully to avoid component damage and introduction of spurious signals. 

CORE PLANE TROUBLESHOOTING 

Under normal operating conditions it is unlikely that troubles will occur within the 
core plane. However, continuity measurements of the sense-inhibit and drive windings 
enable maintenance personnel to check core-plane wiring. Exercise caution in taking these 
measurements to avoid damaging the matrix windings. 

Repair should not be attempted on the core plane since it may affect vendor warranties. 
A defective core plane should be returned to Honeywell Inc. for repair or replacement. A 
report describing failure symptoms or diagnosis should be returned with it. 

CAUTION 

Multimeter current and voltage should be kept below 
300 mA and 30V, respectively, to avoid damage to 
matrix windings and components . 

Sense -Inhibit Windings 

a. Turn off memory power. Remove the CM-867 data board associated with the 
sense -inhibit windings to be checked. 

b. Place the ohmmeter leads across the sense winding inputs (SWX:X+ and SWXX-) 
to the CM-867 data board, as determined from LED 8104, Drawing No. 
C70032893, in Section 9 (bits 1 to 16) or from LED 8105, 'Drawing No. C70032894, 
(parity bit 17), and check for continuity. One sense-winding links 8192 cores. 



3-25 



d. 



Resistance readings should be typically 13 ohms (across SWXX+ and SWXX-) for 
all sense-inhibit windings. The resistance readings for all windings should agree 
within ±7 percent. 

Measure between signals IZXX+ and SWXX+ to check inhibit wiring continuity. 
Results should be 6.4 ohms ±7 percent. Repeat for IZXX+ to SWXX-. 



Drive Windings 

a. Turn off memory power. Remove the CM-866 address board. The drive winding 
connections to the core plane are shown in LBDs 8102 and 8103, Drawing No. 
C70032891 and C70032892, respectively, in Section 9 and Figures 3-10-3 and 
3-10-4 in Section 10. 

b. The actual drive line connections are located on the core plane printed circuit 
board. The selection switch outputs are isolated by a diode from each drive line 
so that the resistance reading between any drive bus (e.g., XDXX) and line bus 
(e.g., XBXX) includes a diode forward drop. 

c. Measure continuity by putting one ohnimeter probe on the XDXX (or YDXX) pin 
and the other probe on the XBXX (or YBXX) bus. A low resistance of one forward 
diode drop plus a drive line resistance of approximately 8, 5 ohms indicates con- 
tinuity for the diode and the drive line. It may be necessary to reverse the probes 
to obtain the correct polarity to forward bias the selection diodes. A high impe- 
dance measurement in both directions indicates an open line or diode. 

Troubleshooting Table 

Memory failures are localized by loading the test pattern into the memory and by 
initiating a read operation at each address sequentially and then checking each readout data 
word for the type of failures. Generally, memory failures are operational failures, partial 
data word failures, or address, decoding and selection failures. An operational failure, 
caused by faulty timing and control circuits, occurs when commands applied to the memory 
have no apparent response or when there is a faulty operation at all addresses. 

Partial data word failures are caused by a faulty sense amplifier, data register flip- 
flop (in the processor), or by data-write circuits. 

Address, decoding and selection failures are caused by a faulty address register or 
selection circuits. The memory operation is faulty at only particular addresses. 

Table 3-7-1 lists the general type of memory failure along with symptoms and 
probable causes. 



Failure 



Operational 



Table 3-7-1. 
Troubleshooting Memory Failures 



Symptom 



No apparent response to 
commands 


1. 

2. 




3. 


Unable to read from any 
address 


1. 
2. 




3. 



Probable Cause 



Dc voltage 

No timing inputs (CPU failure) 

MXYTM+, WRITE-, MADCL-A, 
BANK X- signals and associated 
logic. 

+ 15 Vdc supply 

MSTEN-, STROB- 

CPU 



3-26 



Failure 



Partial Data Word 



Address, Decoding, 
and Selection 



Table 3-7-1. (Cont) 
Symptom 



Failure of one bit 
(ZERO or ONE) at all 
addresses 

Failure of one bit at 
particular addresses 



Failure of one bit at one 
address 

All bits fail as a function 
of particular address 
bits 

All bits fail at lower or 
upper 4096 addresses 



1. 
2. 
3. 
1, 
2, 
3. 
4. 
5. 
1. 
2. 
1, 
2. 
3. 



Probable Cause 

CM-867 data board 

CPU data register 

Sense -inhibit winding 

CM-867 data board 

CM-866 address board 

Sense -inhibit winding 

X- or Y-drive line 

X- or Y-selection diode 

Marginal data board (CM-867) 

Marginal core 

CM-866 address board 

X- or Y-drive line 

X- or Y-selection diode 



Configuration junaper (LED 8101) in- 
correct 



Cable Information 

LED 8113, Drawing No, 70032899, in Section 9 shows the locations of two |j.-PAC 
jumper cables required for each CSM-150 Core Memory Module, LED 8112, Drawing No, 
70032895, in Section 9 shows the backplane pins for all interface signals. Power (+15 Vdc, 
+ 6 Vdc, -6 Vdc and ground) is connected to the Heyco connectors on the solderless -wrap 
backplane. 



3-27 



SECTION 8 
REFERENCE DATA 



The signal mnemonics 

Signal 

BANKA- through BANKD- 
INHEN+ A. B 
M01FF+ througn M16FF+ 
MAD04- through MAD16- 

MADCL-A 

MMOIF- through MM16F- 

PAMEO- 

PAGEO- 

EPARB+ 

APGNCH- 

IZ01+ through IZ17+ 

STROB± 

SW01± through SW17± 

MXYTM+ 

WRITE - 

MSTEN± 

MWENB+ 

LPREG± 

MLATC+ A, B, and -A 

AR04± through AR16± 

MSTRB- 

MRGEN-A and MRGEN-B 

MWGEN-A and MWGEN-B 

Test Points A, B, C, and X 

XRSW+ 

XRSK+A and XRSK+B 

XWSW+A and XWSW+B 

XWSK+ 

YRSW+ 



for the CSM-150 Core Memory Module are 

Description 

Memory Bank Select Inputs 
Inhibit Timing Command 
Memory Module Data Inputs 
Memory Address Inputs 

Memory Address Clear Command 

Memory Data Outputs (sense 
amplifier outputs) 

Parity Bit Data Output 

Parity Generator Output 

Parity Error Strobe Output 

8 -Bit Parity Generator Output 

Inhibit Windings 

Sense Amplifier Strobe Command 

Sense Windings 

Memory Read and Write Timing 
Commands 

Write -Enable Timing Command 

Memory Strobe-Enable Command 

Memory Write -Enable Command 

Load Parity Register Command 

Memory Address Latch Command 

Memory Address Latch Output 
Commands 

Memory Strobe Leading Edge 
Timing Command 

Memory Read-Enable Command 

Memory Write-Enable Command 

Test Points 

X-Read Switch Timing Command 

X-Read Sink Timing Command 

X- Write Switch Timing Connmand 

X- Write Sink Timing Command 

Y-Read Switch Timing Command 



listed below. 

LED 

8101, 8112 

8101, 8104, 8105 

8104, 8105, 8112 

8101, 8102, 8103, 
8112 

8101, 8112 

8104, 8105, 8112 

8105, 8112 
8105, 8112 
8105, 8112 
8105, 8112 
8104, 8105 
8101, 8104, 8105 
8104, 8105 
8101, 8112 

8101, 8112 

8101, 8112 
8101 

8101, 8105 

8101, 8102, 8103 

8101, 8102, 8103 

8101 

8101 
8101 
8101 

8101, 8103 
8101, 8103 
8101, 8103 
8101, 8103 
8101. 8102 



3-28 



Signal 

YRSK+ 

YWSW+ 

YWSK+ 

XDCSR+ 

XBCSR+ 

YDCSR+ 

YBCSR+ 

SAVTH- 

MITOl- through MIT 17- 
MOIFF-A through M17FF-A 



Description LBD 

Y-Read Sink Timing Command 8101, 8102 

Y-Write Switch Timing Command 8101, 8102 

Y -Write Sink Timing Command 8101, 8102 

X-Diode Drive Current Source 8103 

X-Bus Drive Current Source 8103 

Y-Diode Drive Current Source 8102 

Y-Bus Drive Current Source 8102 

Sense Amplifier Threshold 8104, 8105 
Voltage 

Memory Inhibit Bit 01 through 17 8104, 8105 

Buffered Data Inputs 8104, 8105 



3-29 



SECTION 9 
LOGIC BLOCK DIAGRAMS 



This section includes the logic block diagrams (LBD) referenced throughout Chapter 3. 
The LBD number of each drawing is shown in the upper right-hand corner. 

Description 

CSM-150 Memory Timing and Control, 
CM-866 Address Board, Slot 2 

CSM-150 Memory Y -Selection, CM-866 
Address Board, Slot 2 

CSM-150 Memory X-Selection, CM-866 
Address Board, Slot 2 

CSM-150 Memory Data Bits 1 through 16, 
CM-867, Slots 5 and 6 

CSM-150 Memory Parity, CM-867, 
Slots 5 and 6 

CSM-150 Memory Interface Timing 

CSM-150 Memory Internal Timing 
Diagram 

CSM-150 l-by-3 Connector Wiring 

CSM-150 Memory PAC Complement/ 
Allocation 

CSM-150 Memory Block Diagram 



LBD 


Drawing 


No. 


No. 


8101 


C70032890 


8102 


C70032891 


8103 


C70032892 


8104 


C70032893 


8105 


C70032894 


8110 


C70032895 


8111 


C70032897 


8112 


C70032896 


8113 


C70032899 


8114 


C70032889 



3-30 




4K MEMORY D£LE"TE CONNECTION 804 \Q CO 7, ADD B33 TO 007. 
8K MEMORY DELETE CONNECTION B33 TO C07, ADD BO* TO C07. 

ADD J2 JUMPER FOR EARLY STROBE MARGIN CHECK, OMIT J3 JUMPER. 
ADD J3 JUMPER FOR LATE STROBE, OMIT J2 JU^iPER 



A 
A 
A 

AOdESIGNATES board CONNECTOR and pin. > — INDICATES CSM-I50 (NTERFACE SIGNAL. 
[] INDICATES SOURCE LBD OR I/O PIN 

farm LQD f2760-&71 



CM-ft66 SPARE GATE ■ M I 3 OUTPUT 1 ^ 



P.K^. 



ih 



HONEYWELL 



L COMPUTER CONTROL DIVISION 



DR. R. BOUDROT 



ENG.S. DURVASULA 



APP. D ROTHENBERG 



PROJECT NO. H404-0i 



TITLF. 

CSM-150 MEMORY 
TIMINS a CONTROL 
CM-86G ADDRESS 
BOARD SLOT 2 



SIZE DWG NO. 

Q 70 032 890 



REV. 

c 



00 





Foim L8D F276067I 



INHIBIT (CM-867) 



[sss 



[NHEN+P (UUU, 
[8,0,] 




CORE PLANE 
(SLOTS 3AND4) 



rtH-- 



^SrMi^' -.s..™,e,T 



>0-' 



'7^--*<£S)[f0 



CRIN CR2N 

, TSS 



LJ^ 



B3 BITS I THRU 8 | 
B4 BITS9 THRU 16 I ' 

J 



\ u_ 

■ •WW P 



J 



STROB- 
[8,0,] 



LOGIC GND 



A INH,Bfr +I5V 
'-^ GND 



<:,, ,d 



RQB* 



L.B.D. NO- 

8104 



SENSE (CM-8671 




CM867 
SLOT 


OfiTfl BIT, 
MXXFFt, 
MXXFF-fl, 
MITXX- 

swxxtjzxx*, 

MMXXF- 
XX 


co^ 

HU 

s 


PON 
FFE 

N 


ENTS 
RED 
LS 

P 





INHIBIT 


core: 

PLANE 


SENSE 1 




DIP MAA 


BD. 

PINS 


DIP MGG 


XFMR. THM 


INHIBIT 
PINS 




XFMR. TSS 


7524 DIP MNN 


OIPMCC 


DIPMHH 


DIPMPP 


DATA 

OUTPUT 

PINS 


INPUT 
PINS 


DIP 


IM 
PIN 


0., 

PIN 


DIP 


eo. 

PIN 


IN 
PINS 


OUT 
PIN 


X 
F 
M 
H 


IN 
PINS 


OUT 
PINS 


I^ENSE 
PINS 




X 

F 
M 

R 


IN 

PINS 


OUT 
PINS 


DIP 


IN 

PINS 


OUT 

PIN 


D 

1 
P 


IN 
PIN 


DUT 
PIN 


DIP 


IN 
PIN 


our 

PIN 


DIP 


IN 
PIN 


JUT 
PIN 




VARIABLE 




VARIABLE 










VARIABLE 




SSS 


TTT 


AA 


BB 


CC 


VVV 


GG 


UUU 


DD 


EE 


FF 


HH 


JJ 


KK 


LL 


MM 


Z2Z 


AA 


BB 


CC 


pppIrrr 


SS 


uu 


VV 


WW 


YY 


NN 


DD 


EE 


GG 


FF 


CC 


A A 


SB 


HH JJ 


MM 


PP 


KK 


LL 


ZZZ 


TTT 


5 


1 
02 
03 
04 
05 
06 
07 
08 


A 
fl 
B 
B 

C 

D 
D 


A 

B 
C 



F 

G 
H 


A 
A 
A 
A 
B 
B 
B 
B 


COI 


A06 


1 


03 


i^^. 


A0 7 


4 


AI2 


04 


05 


06 




05 


12 


II 


06 


BOS 


03 


02 


01 


B04 B03 


3 


03 


14 


04 


15 


7 


07 


06 


1 1 


12 


3 


U 


10 


1 09 


08 


13 


01 


02 


A 19 


A2I 


C02 
C07 
COS 
CI9 
C20 
C,3 
CI4 


A04 

A08 
Al 
C25 
C23 
C2I 
Cl9 


1 
1 
1 

2 
2 
2 
2 


01 

05 
13 
13 

1 1 
CI 
03 


02 
06 

I¥ 

12 

10 
02 

04 


AGS 
AG 9 
A 1 1 


4 

4 
4 
5 
5 
5 
5 


AI2 
AI2 
AI2 
CI7 
CI7 

c,7 

CI7 


01 


02 


03 

08 

,, 

08 


2 
2 
2 


07 
03 

01 
01 
03 


10 
14 


09 
13 
15 
15 
13 


08 


B06 


04 
09 
10 
29 
30 
23 


06 
08 
1 2 
32 
28 
26 


05 
07 

1 1 

31 

■ 
27 


BOB 
BIO 
BI4 
B32 
828 


B07 

ao9 

Bl3 
631 
B27 


3 


1 


16 


02 


15 


7 


03 


02 


1 5 


14 
12 
14 
12 
14 


3 

3 

3 

15 
15 
15 
15 


09 
05 
03 
03 
01 
05 
1 1 


08 

06 

04 

04 

02 
- - 
06 

10 


1 09 

1 09 


08 
08 
08 


13 
13 


09 
03 

05 


08 


fl25 
A2I 
A23 


A15 
A 09 

A04 


10 


09 


04 
02 
02 
04 


Bl 1 

Bl 2" 
829 
B30 


3 
3 
4 
4 

4 
4 


1 

1 1 
08 
03 


06 
07 
06 

09 


1 2 


05 


8 
8 
9 

9 


07 


06 


1 1 
15 

15 


04 
06 


12 
09 
12^ 
04^ 
02 


13 
10 

^3 


09 

1 2 
07 


08 
05" 
10 


02 
07 
02 


03 
06 
03 


2 
2 


09 


13 


05 
05 
05' 


06 
06 


14 
14 


03 

°=. 

01 
09 


04 
06 
02 
08 


CO 
C05 
CI 2 
(.08 


A03 

C3I 

C3'u 
02 5 


05 
01 


06 
03 


05 
07 


12 
10 


1 1 


06 


B23 


25 
21 


B26 
Q22 


B2 5 

82 1 


14 

15 


04 


13 


10 
10 


07 
02 


06 


1 1 
15 


12 
14 


06 
06 


14 
14 


09 


08 


B24 


24 


22 


02 


1 


15 


03 


2 ;o5 


6 


09 

10 
1 1 
1 'd. 
1 3 
14 
IS 
16 


A 
A 
B 
B 

C 
D 
D 


A 
B 
C 
D 
F 
F 
G 


A 
A 
A 
A 
B 

e 

B 


c^^ 

C28 
C23 
A05 
AOG 
AI9 
Al 7 
A^5 


A06 


1 
1 

1 

2 
2 
2 


03 
01 
05 
13 

13 
1 1 
01 
03 


04 
02 
06 
12 
12 
10 
02 
04 


A07 4 


AI2 


04 


05 


06 


1 


05 


12 


1 1 


06 


805 


03 


02 


01 


B04 


BO 3 


3 


03 


14 


04 


13 


7 


07 


06 


1 1 


12 
14 
12 
14 
12 
[4 
12 


3 
3 
3 
3 

15 


1 1 
09 
05 
03 
0? 


10 
08 
06 
04 
04 
02 
06 


1 
1 
1 

2. 
2 
2 
2 


09 


08 


13 


01 


02 


ai9 


C22 
C2I 
CI6 

CI5 
CIO 
C09 


A04 

Aoa 

AID 
C2 5 
C23 
C2I 
CI9 


AOS 
A09 
Al 1 


4 
4 
4 


AI2 
AI2 

AI2 
CI7 
CI7 
CI7 
CI7 


01 

10 


02 
09 


03 


( 
1 

2 
2 

■2 


07 

03 
01 
01 
03 
OS 


10 

14 
16 


09 
13 
15 


08 
04 
02 


B06 


04 


06 

08 
12 


05 
07 


608 

BIC 
BI4 


B0(' 
809 
B13 


3 

3 
3 

4 


t 
1 1 
10 
1 1 


16 
06 
07 
06 
09 


02 
12 
09 
12 
07 


15 
05 
08 
05 


7 
8 
8 
9 

9 


03 
07 
0? 
07 
02 


02 
06 
03 
06 
03 


1 5 
1 1 
15 
1 1 
15 


09 
09 
09 
05 
05 
05 
05 


08 
08 
08 
06 
06 
06_ 
06 


13 

13 
13 
14 
14 
14 


09 
03 

03 

05 


06 
04 
06 
04 
06 


A25 
A21 
A23 
CIO 


08 

1 1 
08 
1 1 
06 


GM 
BI2 


09 
10 


1 2 
09 
12 
04 


13 
10 
]_\ 
05 


5 

- . 5 

- 5 

5 


16 
14 
12 


15 
13 


02 
04 
06 


B29 
B30 
B23 


29 


32 


31 

P 
25 


B32 


B3I 


30 
23 


28 
26 


B28 


B27 


4 


08 


10 


15 
IS 


01 
05 


C06 


o26 


B25 


4 


03 


14 


04 
01 


13 
16 


10 
IC 


0? 
02 


06 


, 1 


01 


0? 




02 


01 


03 


2 


07 


10 


09 


08 


B24 


24 


22 


21 


B22 


B2I 


4 


02 


15 


03 


15 


14 


15 


1 1 


10 


14 


09 


08 


coe 


C03 



































































































/^ L.Otir. INHIBIT AND SENSE AMP &NDS ARE TIED TOGETHER BY THE BACKPLANE GND. 

. M, N, .-', OUUHLE: and triple let rtRS are variables SHOWN IN TAB 
/3\ INHIBIT VARIABLES GG, FF, XX AND N IS THE MITO I -- CONNECTION FR 



lUS 



', OUUHLE: and triple letters are variables SHOWN IN TABLE. AN EXAMPLE FOR 

FROM 01 P M4 OUTPUT 06 TO 

RESISTOR RIA 

R\ SPARE 



? AND I 



TES. M3 OUT 

NATES BOAR 
[] INDICATES SOlJRCF LBD OR I/O PIN 



12, M I30UTPUTS 10 AND I 



AO DESIGNATES BOARD CONNECTOR AND PIN >-- INDICATES CSM-150 INTfRFACF SIGNAL 



HONEYWELL 



L COMPUTER CCJ 



DR. R BCUDRQT 



ENG.S DLRVASUL/i 



APP. [: ROTHENSERG 



PROJECT NO. H 401- 01 



TITLE 

CSM- 150 MEMORY 

DATA BITS I THRU 16 

CM-867 

SLOTS 5 AND 6 



SIZE ^DWG NO. 

Q 70032893 



REV. 
B 



NHIBIT (CM-e67SU3T6 ) +0" 

A 

07 15 09 




M^@-f|@)-^*l^ 



+H- tV/(5)-I-|-@- 

BITI7 II <R5j 

CONNECTOR B3 ,' ^ 



CRIJ T5 CR2J 



STROB-t- 
[8104] 



-1 



SENSE (CM-867 SLOT 6) A 



SflVTH- SENSE AMP. 

[8IO4] GND. 



LB.D. NO. 

BIOS 



MI5 

09 0|X>— r 
74H05 



T 




MRITY GENERATOR (CM- 867 SLOT 5)A i 

+5V +5V 



PARITY GENERATOR (CM- 867 SLOT 6) 




[bIOi] MLATC-AJ— ^s}- 
[bioi] [ ^-> 




MI3FF-A — 
[8104] 

MI4FF-A - 
[8 104] 

MI5FF-A — 




[8104] 
MIOFF-A — HC27}- 

[6104] I W 
M09FF-A — |-{C29\- 

[8104] I V<' 
MIIFF-A — MC32)- 

[ei04] I y:i 

MI2FF-A _|_(C3I) 

[8104] [ v_y 



♦^I6)-|*PAME0- 

[a724,A124] 



i^> i — (czo)4-^ PAGEO- 

407 I ['"'] 



-^\ 



A 
A 

^cy-8&7 Slot 5 has spare inhibit, sense and parity circuits 

AOdesigmates board connectorand pin. >— indicates csm-150 interface signal. 
L ] (ND " " " " " 



Odesignates board connectorand pin. 

' " " NDICATES source LBD OR I/O PIN 






M 



JD 



HONEYWELL 



L COMPUTER CONTROL C 



DR. R.BODDROT 



ENG.S OURVASULA 



APP- D ROTHENBEF'G 



DATE B/io/7: ■ 



PROJECT NO. H404-0 



TITLE 

CSM-150 MEMORY 

PARITY 

CM-867 SLOTS 5 AND 6 



SIZE . DWG NO. 

Q 70032894 



BEV. 

B 



n LBD r2760-571 



TIME IN NANOSECONDS 



L0O NO 



MXyTM+ .i. 

INPUT / 

[a726, AIZe] 



maocl-a y-MiS"" • 

INPUT \ — 

[a7I2, AIIZ] 



MADXX- 

8ANKX- 

INPUTS 




I MIN 
I'ZERO' 



WRITE- 

INPUT 

[a727, Al27] 



MSTEN- 

INPUT 
[Ari6,AII6j 



MXXFF-I- 

INPUTS 



MMXXF- 
OUTPUTS 



A 



PAG EC - 
OUTPUT 
[A73I] 



- CYCLE TIME ilSOO- 



f 



\ 



CLEAR/WRITE 



I 



READ/WRITE 



X 




5Vl ONEjKOS 



J 



f-AMEO- J[ ^ 

OUTPUT ^ 

[4724, A124] — ^■*-- 



EPARB + 
OUTPUT 
[.72,] 



I 



ZERO 
ONE 



-J. 
I 



J 



I 
—I. 



r 






3[ 



A 



SEE LB0 8I04 FOR INTERFACE PINS 



^ SEE LBO BIOI FOR INTERFACE PINS 

A TIME IN NANOSECONDS MiASURED AT C5M-I50 BACKPLANE AND I 5V POl NTS, UNLESS 
£i\ OTHERWISE SPECIFIED 



c;? 






g 



Kg 

5m 



I 



HONEYWELL 

I " e. 

^B. COM^UTCW COMTHOL DIVI«ION 



OH. n 80UDROT 



ENO. ii DURVASULA 



C) R0THEN6ERG 



IMTEVtt'Ti ■ 



8/10/7; 



PROJECT NO. H404-0I 



CSM-150 MEMORY 
INTERFACE TIMIN6 



iiMlbwANA. 

C . TOOJZ895 



c 



TIME IN NANOSECONDS 



LOCATION SIGNAL 

CM866 NAME 



MADCL-A 
INPUT 



TPB 
MI4-6 



MI5-2 
TPA 




MXYTM+ 
INPUT 



YRSK + 
YRSW + 



XRSK + A 
XRSW + 



STROB- 

A 



WRITE- 
INPUT 



B207 


INHEN+A 


B209 


INHEN-HB 


TPC 


XWSW+B 


MI6-8 


XWSK + 


MI3-4 


YWSW + 


MI3-6 


YWSK + 



*— — 340 ■*■ * 325 



^ 



Jf 



y ^i 



s>- 



J/ t 



A 

^ JUMPERS J 2 AND J 3 SHALL VARY STROBE TIMING I2±3NS EARLIERAND LATER RE- 
SPECTIVELY. 

/f\ INPUTS NOT SHOWN AND OUTPUTS SHALL BE PRE LBDeilO. 
/l\ TIME IN NANOSECONDS (1.5V POINTS), TOLERANCE +8NS, 

Form LBD F2760-571 



h 






HONEYWELL 



L compute:r control division 



I DR. W. OBRIEN 



ENG. S DURVASULA 



APR. D RQTHENBERG 



PROJECT NO. H404-0I 



TITLE 

CSM-150 MEMORY 
INTERNAL TIMING 
DIAGRAM 



SIZE . DWG NO. 

C . 70032897 



REV. 

B 



ISO. NO 

81 12 



MEMORY/MAINFRAME INTERFACE 



A 





INTERMODULE CABLE 


CONNECTOR 




SLOT ) 




_ 


A 1 




BANKC- 


01 




02 


- BANKB- 


MMOSF- 


- 


03 




04 


- MM04f- 


MI2FF* 


- 


05 




06 


- MI3FF* 


MAD05- 


- 


07 




08 


- MA006- 


MM03F- 


- 


09 




10 


- GNOXX^e 


MAD0 7- 


- 


j 1 




12 


- MAOCL-A 


MADOB- 


- 


1 5 




14 


- GNDXXfB 


MM02f - 


- 


15 




16 


- MSTEN- 


MI5FF + 


- 


1 T 




IB 


- GNOXX« 


UI4FF + 


- 


19 




20 


- MAD04- 


MMOIF- 


- 


2 1 




22 


- GNOXX+B 


M t 6FF + 


- 


23 




24 


- PAMEO- 


GNDXX+il 


- 


25 




26 


- MXYTM + 


WRITE - 


- 


27 




2B 


- GNOXX+A 




- 


29 




30- GNOXX+A 




- 


51 




32 


- GNDXX*A 


GNO 




33 




34 


- 




S 


B 1 
SPARE 


St 




C 1 




MOrFF *■ 


01 




02 


- M02FF* 


MMI6F- 


- 


03 




04 


- MMI5F- 


MAD09- 


- 


05 




06 


- MAD 10- 


M03FFt 


- 


or 




Ofl 


- M04FF* 


MMI4F- 


- 


09 




10- MMI3F- 


MAO 1 1 - 


- 


1 1 




12 


- MADlZ- 


M07FF+ 


- 


13 




14 


- W0SFF+ 


MMI2F- 


- 


15 




16 


- MMIIF- 


MAO 1 3 - 


-i 


17 




IB 


- MA0I4- 


M05FF* 


-• 


19 




20 


- M06FF+ 


MWIOF- 


-1 


21 




22 


- MMOW- 


Ml IFF'f 


- 


23 




24 


- MAO 15- 


MMCiBF' 


- 


25 




26 


- MADI6- 


BANKA- 


- 


27 




28 


- MIOFF+ 


MOTFF + 


- 


29 




30 


- MM07F- 


MM06F- 


- 


31 




32 


- BANKO- 


GND 


-■ 


33 




34 


- 





NTERFACE 


CABLE 


CONNECTOR 


SLOT 7 




. 


A7 




BANKB- 


OC 




02 


- 8ANKA- 


MM05F- 


- 


03 




04 


- MM04F 


MI2FF* 


- 


05 




06 


- M15FF* 


MA005- 


- 


07 




oa 


- MAD06- 


MM03F- 


- 


09 




10 


- GNOKX+B 


MAD07- 


- 


1 r 




12 


- MAOCL-A 


MAD08- 


- 


13 




14 


- ONOX»*e 


MM02F- 


- 


15 




16 


I- MSTEN- 


MlSFF-f 


- 


17 




la 


- GNOXX^e 


MI4FF+ 


- 


19 




20 


- MA004- 


MMOIF- 


- 


21 




22 


- QNDx;<-fe 


MI6FF+ 


- 


23 




24 


- PAMEO- 


GNDXX*A- 


25 




26 


- MXYTM* 


WR 1 TE - 


- 


27 




26 


- GNOXX+A 


EPARe+ 


- 


29 




30 


- GNDXX->A 


PAGEO- 


- 


31 




32 


- GNOXX+A 


GND 


I 


35 




34 


- 




t 


B 7 
SPABE 


k 




C 7 




M0IFF+ 


01 




02 


- M02FF + 


MMI6F- 


~ 


03 




04 


- MMI5F- 


MAD09- 


- 


05 




06 


- MADIO- 


M03FF*- 


- 


07 




06 


- II104FF* 


MMI4F- 


- 


09 




10 


- MMI3F- 


MAOI 1- 


- 


1 1 




12 


- MA0I2- 


M07FF+ 


- 


1 3 






- M08FF+ 


MMI2F- 


- 


15 






~ MMIIF- 


MADI3- 


- 


17 






- MA0i4- 


M05FF + 


- 


19 






- M06FF+ 


MM 1 OF- 


- 


21 






- MM09F- 


Ml tFF4 


- 


23 






- MA0I5- 


MMOBF- 


- 


25 






- MADI6- 


BANKD- 


- 


27 






- MIOFF+ 


M09FF+ 


- 


29 






- MM07F- 


MM06F- 


~ 


31 






- BANKC- 


GND 


- 


33 






- 



MODULE D 
32K 



BANK SELECT WIRING A 

CSM'tSO MODULE B 




INTERMODULE 
CABLE 



50 BACKPLANE WIRES 



■^ BANKD- 
^ BANKC- 



MEMORY/MAINFRAME 
INTERFACE CABLE 



A 






INTERFACE WIRING IS IDENTICAL FOR ALL CSM- 150 MODULES BANKX-SIGNAL NAMES ARE 
SHOWN FOR MODULE A AND DIFFERENCES FOR MODULES 6,0, D SHOWN IN THE LOWER DIAGRAM 

BANKX- 15 WIRED FROM A702 TO A22T BACKPLANE WIRES SHOWN ALLOW THE PROPER BANK 
SELECT SIGNAL TO BE CONNECTED TO EACH CSM- 150 MODULE 



n 



rofm LK TirtO-ill 




HONEYWELL 



# 



COMFUTKR CONTROL DIVISION 



PH. R BOUOHOT 



tugs. OURVASULA 






<»f. 0. ROTMENBCRO 






tt;^. 



ISTTJ- 



ntOJCCT NO. H404-0I 



IITLt 

CSM -ISO MEMORY 

I X 3 CONNECTOR WIRINS 



Uf LMMNS. 

C . 70032(96 



. C 



PAC ALLOCATION VIEWED FROM PAC StDE 



MAINFRAME 
ROW 



A 



BOARD CONNECTOR 
MAINFRAME COLUMN 

A 



1 

2 

3 
4 
5 
6 

7 
















I/O A 


1 


SPARE 


1 I/O A 


r 








CM-866 


ADDRESS BOARD 










CSM-150 


CORE PLANE 










(t 




CM-86? 


DATA BOARD BITS 


1 THRU. 6 








CM-867 


DATA BOARD BITS 


9 THRU, 17 




o 




I/O 


A 1 


SPARE 


1 I/O A 


; 

















CM-866 COMPONENT SIDE 
CM-eeS ETCH SIDE 



/j\ CODING EXAMPLE 



A ^'^'^ 
A ZONE 

COLUMN 

(BOARD CONNECTOR! 

A "°* 

A ^^°'^ 

SLOT 



T 



- P70 032 899 



PARTS LIST 



4^ 



A 

A^LOT 7 ACCOMODATES TWO INPUT CABLES SLOT I IS FOR TWO INTERMODULE JUMPER CABLES. 

A CHARACTERS ARE OPTIONAL AT MEMORY MODULE LEVEL AND GENERALLY NOT USED, FOR 
EXAMPLE, A1CI0634 IS SHORTENED TO C634 TO INDICATE SLOT 6 CONNECTOR C PIN 34 

A SEE H3I6 CODING DWG. 70023412 FOR ADDITIONAL DETAILS. 

Form UBD F2;60-5/l 



CO 



i 



s*> 






HONEYWELL 



L COMPUTER CONTROL- 



R BOUDROT 



S.DURVASULA 



D ROTHENBERG 



DATE B/I0/7Z 



TITLE 

CSM-150 MEMORY 

PAC COMPLEMENT/ALLOCATION 



SIZE . DWG NO. 

^ 70032899 



4i- 



MADXX- 
( MAD 04- THRU. v 

MAO 16- ) /— 

ADDRESS INPUTS 



INPUT -^ 



WRITE - 
INPUT 



MXYTM + 
INPUT 



EPARB+ / 
OUTPUT N 



MSTEN- - 
INPUT ' 



MXXFF-+- 
[MOIFF + THRU 
M16FF+) 
DATA INPUTS 




PAGEO- 
OUTPUT 



(MM0IF-THRU.MMt6F- / 
DATA OUTPUTS V" 



OD 



BANK 

REGISTER 



ADDRESS 
REGISTER 



o>- 



PARITY 
GEN- 
ERATOR 



PARITY 

REGISTER 



ONE 
SHOT 




^Z. 6. 



Y SELE:CTION 
CIRCUITS 



DSiVEfi 

XFMR 

FLOATING 

SWITCH 

BITS l-lfi 



XFMA 

t^LO&riNG 
SWITCH 



X SELECTION 
CIRCUITS 



SK/IT CORE 
PLANE 





A 

A 
A 



/^MULTIPLE SIGNALS ARE INDICATED BT SLASHED LINES (E. S. ,'t'INDICATES 16 SIGNALS). 



M 






HONEYWELL 



L COMPUTER CONTROL DIVISION 



DR. R.BOUDROT 



ENG. S.DURVASULA 



APP. D.ROTHENBERG 



DATE BAyrg ■ 



iTreiTTr 



PROJECT NO. H 404-01 



CSM-150 MEMORY 
BLOCK DIAGRAM 



SIZE . DWG NO. 



C 



REV. 
B 



a LBD f2760-5n 



SECTION 10 
MEMORY PAC DESCRIPTIONS 



This section contains the following circuit descriptions and parts lists for the special 
Address Board, Model CM-866, and Data Board, Model CM-867, used in the CSM-150 Core 
Memory Module. For board locations, refer to the PAC complement, shown in LED 8113, 
Drawing No. 70032899. in Section 9. 

INTEGRATED CIRCUIT DESCRIPTIONS 

The majority of integrated circuits are standard devices listed in vendor catalogs. 
Reference information is also contained in System 700, Type 716, Integrated Circuits 
Manual, Doc. No. 70130072667, which may be ordered from Honeywell Inc. 

RECOMMENDED SPARE PARTS 

One CM-866 address board, one CM-867 data board, and one CSM-150 core plane are 
recommended as spares. 

ADDRESS BOARD, MODEL CM-866 

The Address Board, CM-866, contains circuitry to perform the following functions. 

a. Store bank enable and address inputs received from the processor. This is 
implemented with four 7475-quad latches. The latch circuit outputs in turn drive 

: the 25862 selection drivers. 

b. Provide selection and drive currents for an 8K matrix. This is implemented with 
twenty 25862-dual in-line packages, each of which includes two sink-switch pairs 
with decoding. 

c. Provide logic and timing circuitry to control matrix read-write timing, inhibit 
timing, register latch timing, sense amplifier strobe generation (pulse width 
control and leading edge adjustment), load parity register timing, and parity 
error strobe pulse. LBDs 8101, 8102, and 8103. Drawing No. C70032890, 
C70032891, and C70032892, respectively, in Section 9 illustrate the schematics 
for the CM-866 address board. Figure 3-10-1 is the assembly drawing for the 
CM-866 and Table 3-10-1 contains a listing of parts. 

Specifications are as follows: 

a. Input Loading -- One standard TTL unit load except for MXYTM+, WRITE- and 
MADCL-A, which are two unit loads each. 

b. Selection Output Characteristics -- Current: 480 mA, max. ; voltage: 17.5V, 
max. 

c. Timing -- Refer to LBDs 8110 and 8111, Drawing No. C70032895 and C70032897, 
respectively, in Section 9. 



3-51 









A 

TPX,, .SST 1 2 3 

I* X 



CM-BS6 






*-R29— « 



»/ ft # ft 4ft 1 // tt ' i *^ ^"K M3 7 




'" CR9R# |>j •! 

) "«> P 




• • Ti '^ /\l * '^CRaf • °= * * * ^ — * • / • f • ' — rO • 

" EjT CR9N*'" * » «!» I"(;R9P y j 5 I* "» ■ » »!• •■:» ' "I „ fl k i» »» » 



\ M35 



) M36 



jir 






iJiilMiif 






IT jpi*l»;i»»:«ii>jj''T cm 



T Uw >« «'« • 




2. INSTALL J2 OR J3 TEMPORARILY AT SYSTEM TEST IF REQUIRED FOR STROBE 
MARGIN CHECK PER LBD 8101. 

I.POWER RESISTORS RI2, 13, 16,17, 23,24. WILL BE MOUNTED OFF P.C. BD. NOT 
TO EXCEED THE COMPONENT HEIGHT SPEC. OF .?.30 MAX. 



Figure 3-10-1. Address Board, Model CM-866, Assembly 
{Drawing No. C70050523, Rev A) 



Table 3-10-1. 

Address Board, Model CM-866, Parts List 

{P70050523, Rev C) 



itew DOCUM ENT Descr iption oty 



001 



oo<» 



701 

" 06 '^ ?095bll8 010 INIE bKA T ED D E VtC I ooi 
74H00 

07 A 70950118 013 INTEGRATED DEVICE 001 

7<>H10 
„-^ M17 

08 « 7095010* 009 INlgbRATED "IJEVTCE"" 

9601 

09 A 7095Q118 Oil INTEGRATED DEVICE OO'. 

7<»H0<t 

^^, H13,W41,W18,M16 

T(rA 70950118 006 INTEGRATED DEVICE"" 
7<t75 
M«<»,M20fM<»2.M43 
11 A P0A0A0854-002 INTEGRATED DEVICE 020 
25862 
-„-^-_^._ M2 1 THRU M<>0 

u a: 7iJ9^3(rBrire3"i3TciUE SILICON 025 

CR7,CR8A THRU CR8H 
, ^ CR9A THRU CR9R 

13 C' 70032890 000 ELE SCHMaTIC REF DWG 9£F 
I* C 70032891 000 ELE SCHMATIC RE^ DW& ReF 
X5 C 70032892 000 ELE SCHMATIC RE^ DW(J REF 

16 A "70930eo^iyr CAPACI TOR s^ 

10 PF $/-5ll 

NOTES 

NOTE 1 ASSEMBLE PER C70050523 
^ _ 701 . CM-866 

NtrTrTTA L UE WA T chan<je at unal Test 

RANGE ^►.TK 709321U065 TO 12, OK 7093211*075 



Table 3-10-1, (Cont) 



ITgM POCUMgNT DESCRIPTION OTV 

NO, NOV "^01 

C19«C1V 
17 A 70932226 2S9 RESISTOR CIXEO W/W 004 
4»0,2 OHMS &i/>lK 3WNI 

Ri2«Ri3«R16«Rl7 

~mr"T59T200* 029 RESISTOR 001 

150 OHMS 1/2W 6/-5» 
R24 
19 A 709321 U 0<»9 RESISTOR 027 

I, OK OHM l/*W 6/-2» 

Rl5tRi8tR26 

___^j_^^^^^^j_^^^ 

R19A THRU Ra9R 
■20 R 0^420034 OOl DIOOe SI RECT 001 
CR5 
21 A 70939207 025 COIL RF 00<» 
lOOH &/.10» 



Ll«L2«t3«t.<» 



22 A 70930100 208 CAPACITOR 00<> 

,Ol«lFt) 6/-20* 
C2l.C24-.C20.C16 

23 A 7093000* 112 CAPACITOR 002 

62PF fr/«5K 

CTTTcH 

2* A 70930230 023 CAPACITOR 006 

6,8MFD &/-2» 25V 
C22.C23.Cl7tC18.Cl9 
C25 

25 A 70932U* 070 RESISTOR 001 

7,5K OHMS ImW 6/-i» ~ 

R22 NOTE 2 

26 A 70930004 106 CAPACITOR 001 

35 PF 6/-5» 
CIS 
27^ A 709J21U 047 RE SISTOR 



001 



B20 OHMS l74W &/-2» 
R28 

28 A 70932114 075 RESISTOR 001 

12, < OHMS 1/4W 6/-2» 
R29 

29 A 70937077 004 X^**'^'^*^--?^"^'' ??^- 

. T,P7)f^T.p.'r; 

T.P.A. 

T P fi T P C 

30 A 70937010 001 TERMINAL STUD 006 

SSTl THRU 5ST6 

31 A 04910040 00 * JUMP ER 001 

' Jl 

32 A 70932004 026 RESISTOR 001 

110 OHMS 1/2W 6/-5» 
R23 

33 B 70008913 866 PLATE IDENT, 001 



3-54 



DATA BOARD, MODEL, CM-867 

The CM-867 data board contains circuitry to implement the following functions: 

a. Amplify sense winding signals for 9 bits and adapt them for presentation to the 
central processor. 

b. Generate inhibit currents for 9 bits, depending upon the state of the data input 
lines to the board. 

c. Provide parity generation. Store the sense output of the parity bit in the parity 
data register. 

d. Reduce the +6V and -6V power supply levels to +5V and -5V, respectively, for 
use with TTL circuits. 

The schematics for the CM-867 data board are shown in LBDs 8104 and 8105, Drawing 
No. 70032893 and 70032894, respectively, in Section 9. The assembly drawing for the 
CM-867 data board is shown in Figure 3-10-2, and the associated parts list is presented in 
Table 3-10-2. 

Specifications are as follows: 

a. Sense Input -- ONE: 25 mV minimum for 30 ns; ZERO: 12 mV max. for the 
duration of strobe. 

b. Inhibit Output -- Max. current: 850 mA; max. voltage: 17V 

c. Timing -- See LBDs 8110 and 8111, Drawing No. 70032895 and C70032897, 
respectively, in Section 9. 

CSM-150 CORE PLANE 

The CSM-150 plug-in core plane is a conventional 3 -wire, 3D, coincident current 
configuration. Cores are switched by controlling currents in two orthogonal wires threaded 
through the cores, called X- and Y-lines. The sense and inhibit functions are shared by the 
third line that is parallel to the Y-line. A current through the sense-inhibit line during the 
write portion of a cycle prevents the core plane from switching and thus controls whether a 
ONE or ZERO is written into the core plane. The flux change during the read time is also 
sensed on the sense-inhibit wire during read-write cycles. There are 17 mats, each con- 
taining 8192 cores, for a total of 8192 words, each 17 bits long (parity is included). 

The core plane assemblies vary according to the manufacturer, but all have the same 
interface characteristics. Figures 3-10-3 and 3-10-4 illustrate the assembly. Figure 
3-10-3 is a simplified schematic diagram of the CSM-150 core plane, and Figure 3-10-4 
illustrates the interface connections of the CSM-150 core plane. 
Specifications are as follows: 
Core O.D. = 18 mils 

Core signals at nominal drive (400 mA) and inhibit (375 mA) currents: 
Min. ONE: 25 mV for 30 ns 
Max. ZERO: 12 mV 

Temperature Compensation: 0. 25 percent per °C 
Peaking Time: 180 ns typical 
Switching Time: 290 ns max. 



3-55 




Figure 3-10-2. Data Board, Model CM-867, Assembly 
(Drawing No. C70050524, Rev B) 



Table 3-10-2. 

Data Board, Model CM-867, Parts List 

(P70050524, Rev C) 



ITEM 


DOCUMENT DESCRIPTION 


UTY 




NO. 


NO^ 


701 


702 


06 A 


70950118 Oil INTEGRATED DEVICE 
7*H0* 
Mli«12 


002 


002 


07 A 


70950118 019 INTEGRATED DEVICE 
7*38 


003 


003 




M4tM5«M6 


005 




06 A 


70950100 ■i'*'* INTEGRATED DEVICE " 


"005 




752* 








M7 THRU Mil 






09 A 


7093802* 001 TKANSFORMER. DIP 
Tl THRU T5 


005 


005 


10 A 


709*3778 001 TRANSISTOR NPN 


009 


onq 




QlA THRU fillJ 






11 A 


709*3063 003 DIODE SILICON 


027 


027 



12 


C' 


13 


C 


15 


A 


16 


A 



CRlA THRU CRIJ 

CR2A THRU CR2J 

CR3A THRU CR3J 
70032893 000 EL E SCHMATIC REK DWG REP ref 

7503289*" 5M EtE 5CHHATIC RCF DWG R^F ^TTT 

70916*00 002 INSULATOR DISK 009 nno 
7093211* 029 RESISTOR 027 027 

150 OHMS l/*W 6/'-2» 

R2A THRU kzJ 

H5A THRU R5J _ 

R6A THRU R6*J" 

17 A 70932226 2*5 RESISTOR FIXED W/W 018 018 

NOTES 

ASSEMBLE PER C7005052* 

701 - CM-867 

702=CM-867A 



3-57 



Table 3-10-2. (Cont) 



I T E« POCUMFN T DESCRIP TION , 51^ 



'~m', " ' NO'. 



701 



28.7 OHMS &/-!« 3WNI 
R3A THRU R3J, RIGA 
THRU RIOJ 

18 A 70932U* 001 RESISTOR J[01_ ., 00 

— '^^'■'- 10 OHM t/-2% 1/<»W 

R9 

19 A 709321U 060 RESISTOR 001 Of 

3K OHM 6/-2« l/'tW 
R8 

20 A 70930230 023 CAPACITOR 014 .. C 

- 6.8 MFD 6/-20K 25V 

C3A THRU C3E.C5.C7. 

C9«Ci2.CU.Cl5. 

C16,C17,C19 „„ 

21 A 70930100 208 ^APACITOR 003 00- 

.OIWFP &/-20K 

C6«C10ft6 



002 00 2 



22 A 7093Q00* 0l9 CAPACITOR 005 00 5 

120PFb 6/-l0» C<»A 

THRU C<rE ... 

23 7093000* 012 CAPACITOR 009 009 

62 PF &/-10 * 

.. _ cilA THRCrCilJ _r,i 

2* A 0<>0*0«05 001 INTEGRATED DEVICE 001 001 

DM8220N 

M12 

25 A 70950118 032 INTEGRATED DEVICE 

7J.07 _ . - 

M13T*^<t 

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7<>H05 

M3»M15 c\r\'i 

■ 27 P 0*<>2O03<. 001 DIODE SI RECT 002 "UZ 

CR'>.CR6 . 

— Z8 T^ 75932TT<r'0a7 RESlSTOft 009 00 9 

1^1 OHM 1/4W t/-2% 

RIA THRU RlJ 
29 A 7093211* 056 RESISTOR 025 025 

2IC OHM 1/4W t/-2« 

R»A THRU R*J 

- PJ3 THRU R15 

R7A THRU R7J 

R16A-e R17» Rl2 

31 A 0*910040 004 JUMPER 003 00 3 

Jl.J2.J3 

_32 B 7000ftgil- lj>-! ''t- ^TE I DENT 

33 B 70025642867 PLATE IDENT 



001 



001 



34 70940001-020 WIRE ELEC TIN-24AWG A/R 



3-5J 





SENSE/ INHIBIT LINE 
Y LINE 



P C BOARD 



H<3 t-»XD09 

L-Ci-f- -•xoio 

tir, ~H5f4 ' 



TYPICAL WIRE LAY 



SIMPLIFIED XaY WIRING DIAGRAM ( TO SHOW CONCEPT ONLY) 
0.46 i 0.05 



.0 1 8 ± .002 




8K 
S 
T 
A 
C 
K 




R 

I 

D 


W 


X -DECODE 8K 

XB 




D 


W 
R 

T 
E 


Y- DECODE 8K 
YB 


WORST CASE RATTERN 8K 


CA CC 


01 


02|03 


04 


05 


06 


07 


08 


09 


to 


II 


12 


13 


14 


IS 


B 




CA CC 


0. 


02 


03 


04 


05 


06 


07 


08 




YO Y63 


XD 


oT 


0? 


n 


? 4 


6 


R 


10 


1? 


14 


16 


n 


?0 


?? 


?4 


?fi 


28 


30 


YD 


01 


02 





1 


4 


5 


8 


9 


12 


13 


xo 

W3 
X64 

1 
XI27 


1 1 1 t 
1 1 1 1 
1 1 1 1 
1 1 1 1 
1 1 1 1 
1 1 t 1 
P 1 1 1 1 
1 1 1 I 


OS 


04 


1 


3 9 


T 


9 


II 


13 


15 


17 


19 


?l 


?3 


25 


27 


29 


31 


03 


0* 


z 


3 


6 


7 


10 


II 


14 


15 


05 


06 


32 


34I36 


38 


40 


4? 


44 


46 


48 


50 


52 


54 


56 


5B 


6C 


62 


05 


06 


16 


17 


20 


21 


24 


25 


2B 


29 


07 


OB 


M 


35:37 


39 


41 


43 


45 


47 


49 


91 


53 


55 


57 


59 


61 


63 


07 


08 


18 


19 


2Z 


23 


26 


27 


30 


31 


09 


10 


64 


66 66 


70 


T? 


74 


76 


78 


80 


ft? 


84 


flfi 


Rfl 


90 


«> 


94 


09 


10 


32 


33 


36 


37 


40 


41 


44 


45 


II 


12 


es 


67 69 


71 


73 


75 


77 


T9 


81 


83 


86 


87 


9S 


91 


93 
124 


96 

les 


1 1 


12 


34 


35 


38 


39 


42 


43 


46 


47 


13 


14 


96 


9S 100 


102 


04 06 


we 


110 


112 


114 


lie 


lie 


120 


122 


13 


14 


48 


49 


52 


53 


56 


57 


60 


61 


15 


16 


97 


99 101 


KH 


05 


107 


IDE 


III 


113 


IIS 


117 


119 


IZI 


123 


125 


Z7 


15 


16 


50 


51 


54 


55 


38 


59 


62 


63 















A mote: 
CA DENOTES DIODE ANODE BUS 
CC DENOTES DIODE CATHODE BUS 

/\ INHIBIT PAIRS SHALL BE TWISTED TOGETHER WITH SENSE PAIRS 

— FOR A GIVEN BIT AS SHOWN, OR THE INHIBIT WIRES SHORTED AT 
THE CORE MAT AND A TWISTED TRIPLET USED FROM THE CORE 
MAT TO THE INTERFACE CONNECTOR. 

/^ ARTWORK PROVISIONS SHOULD BE MADE FOR 24 M4 WATT 

— RESISTORS FOR THE 8K H-716. THEY ARE NOT NEEDED FOR 
THE CSM-I50I8KH-TI6) AND MAY NOT BE NEEDED FOR THE 

SK H-716. 



SIMPLIFIED INHIBIT/SENSE WIRING DIAGRAM FOR TYPICAL BIT ( BIT 1 ) 



Figure 3-10-3. 



Simplified Schematic Diagram of the CSM-150 Core Plane 
(Drawing No. D70033040, Rev C) 






>AC "iLOT <^ 
PftC ■SLOT i 






1 2 B ¥ S 4, 7 



..I. 



PiM S^D6.VlE>J 




Figure 3-10-4, Interface Connections of the CSM-150 Core Plan 
(Drawing No. C70032758, Rev A) (Sheet 1 of 2) 



3-A' 



>>M 


loo. / 


siG>:iftL KiAne 


<^3- 1 






I 3 






5 


YCO\ 




7 


YD03 




•^ 


VD05 




11 


yDot 




ra 


YDO<:) 




15 


YD 1 1 




n 


YD IS 




19 


YD IS 




z\ 






a 






ZS 






27 






, 2"^ 






' SI 




A 


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Ci>JO dsts OOTB f) 


E 


>^- I 


SWOl-t- 




3 


i:2.0H- 




s 


SWOS.-)- 




7 


&W02rt- 




^ 


x:£05+ 




11 


s>wc>v+ 




\^ 


12 n -h 




15 






17 






19 


swn-v 




21 


■bwoai- 




Z?. 


X^EOTi- 




2S 


SWO-1+ 




27 


■~MtO(n+ 




1 ^'^ 


XitOS^ 




' 41 


fe^/o's-v- 


B 


3-S^ 


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C 


?=- 1 






S 
S 
7 






1 1 


XDN-S 




IS 


XDI3 




17 


XD I \ 




19 


XDO°) ' 




2.1 


XDOT 




Zh 


XCiOS 




2S 


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XDO\ 




Z.=» 




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C' 


5.-B3 


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V-RC suo-t/BJ2 4- 



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■S.WOS — 




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28 


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50 






32. 




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A4- I 
3 
5 
7 
9 
II 
13 
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17 
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27 
2=) 
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A4--53 

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21 
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51 
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3 

5 

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9 

II 

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(■S 

17 

19 

21 

25 

2S 

27 

29 

SI 



YBOV 
YB65 

VB07 



C»M& (SEE looT^ i) 



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KB 13 
XB U 

XBOS- 



A4--2- 
4 
U. 
& 
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It 
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22. 

24- 

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ZB 
SO 
2>2 

AtA--s4- 

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8 
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2D 
22 
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28 
♦ 50 
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S4-34- 



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VSO<V 
YBO& 
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S-'AJIO — 
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x^l■^-^ 



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XBI4> 




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XB12. 




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XBIO 




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KBi3<^ 




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XS04 




18 


XBO'S. 




20 






22 






24 






2(, 






28 






50 






52. 




C4— ^4- 





"•stack: s,md" shqolo njot b5" Ti-^b r,i rw-E's.e' 

P|M& BV VeioDoR.^ 



Figure 3-10-4. Interface Connections of the CSM-150 Core Plane 
(Drawing No. C70032758, Rev A) (Sheet 2 of 2) 




A 

MARK .12 HIGH 
BLACK VCRTICAL 
GOTHIC CHAPACTCR'i 
IN AREA SHOWN 
FAR SIDE 

A 



701,703,704,706 



SCALE - NONE 



701,702,703.706.70^ 



I. INSTALL TERMINAL LUO TROM (TEM 13 TO 
CEMTER B^RsLOC/^TiOU A,ICA.CI52, VJITw 

4E5 STACKUP 
7CI-T07 < 70'^ 

10 Z 



SECTION C-C 



Figure 3-10-5. Logic and Option Drawer 

Assembly (D70030064, Rev Z, 

Sheet 1 of 4) 



3-63 




I'S oPTior</ 
CONN PLN Rcr 



■IfJ 1 



PARTIAL 5€Cr/0// AA 

SCALC : NONC 



NORMAL POSITION 

A4-7OI,703, 70^, 706 
A 1 - 702 



TO INSTALL ITEM 
54- USE EXISTIN6 
5TACKUP 



NORMAL POSITION 
ABOVE E6- 
70Z ONLY 



4E5 





CKN 



3ECTIOND-D 
SHOWING ;NTf Pc: -/i.T' -i:-. c 

*6M i' OND BI-IS D-~A/CfN ADJACEtJT 
2 1 PLACES MAX 70/ <^704il0<^ 

30 Places max 702 



OPTIONS 



BUS 




•42i" 



-CONN 

SECTION E-E 
SHOWING TERMINATIOfJ OF +6 V < 6N0 
BfS WHEW NO niLER PNLS OR OPTIOhJ 
CONN PNLS ARE AOTACfWT 6 PiAffS 
MAX ?0/,?O2*704£7c4OPT(0W5 LOf-ATVOA/S /A/X6 ^XZ-irfi OiVty 
SCAif NONf 







GRD BUS 
-INSULATOR 
+6V BUS 



l>^3 CONN 



NOTE : ITEM 54- ONLY TO BE INSTALLCD 
TO SECURE UNTERIVWNATED 
POWER WIRING IF NO OPTION 
f AI/A4) OR MEMORY/OPTION (Efe) 

IS ifJSTALLED 



A 




SECTION! r-F 
LOCATIOM XIE& 

(MO MEMORv"3 





4t4 



LOCATION 
> XIAI 
-702 
OKJLV 



SECHON F-F 
SHOWING iNbT^LLKTIOM OF VOLTA^&E ^ <iND \WIRe«> 4 
A^b«i)V OFVERT^C^L fcV BU* WITH lM?>ULKTOR 
LOCKTION AIAv4- 7Ol,70^-7Ofe, yiA>l-702 

£>CA>\.E: WONE 



■4H3 



SECTION r-F 

SHO\WltO& IN<=.TA.UAT|OM OF VO^.T^ce 4 ^ND. \WIRE5 | 

4 \5>SV OF VERTICAL fi.V Bu?> WiTH INSULATOR 2 PLCES ! 

MAX.70I4702 4T04 4T04. LOCATIOM AIEX OKJLV -701 4fOE ^iTOS. 4704 



Figure 3-10-5. Logic and Option Drawer 

Assembly (D7003 0064, Rev Z, 

Sheet 2 of 4) 



3-64 




MARK .\2 HIGH 
BLACK \/Cf<TlfAl 
GOTH C CHARACTfRS 

■'U AREA 'jWOWN 
TA-" ? Dt 



VIEW V 

=>C^LK - NOME 



csn-iso ncno^y 

70s, TO! 



SECTION V-V 



SECTION \)-\^ 



Figure 3-10-5. Logic and Option Drawer 

Assembly (D7003 0064, Rev Z, 

Sheet 3 of 4) 



3-65 



H 



N N 5 




/x3 OPTION 
CONN PLN RCF 



UH 1 



PARTIAL 5€Cr/0^ K-K 

SCALC : NONC 



NORMAL POSITION 
A4 - TOS, 707 



JO INSTALL ITEM 
54- USE EXISTIN6 
STACKWP 




NOTE : ITEM 54 ONLY TO BE INSTALLED 
TO SECURE UNTERMIHATED 
POWER WIRING IF NO OPTION 
CAI/A4) OR MEMORY/ OPTION (Efc) 
IS INSTALLED 



A 




I') A 



&US 



S£ctionN-N 

SHOWIWe INTERCONNECTION Of 
y^M f OND BUS e£TWCfN AOJAC£i'''r OPTIONS 

/z Places ma/ 7os,7o7 

3cAi( : NOUS 



hUS 




SfCTION P-P 
5HOWIN6 TERMlNATtON OF ♦dV f 6ND 
BUS V^HEN NO flLLER PNlS OR OPTION 
CONN PNLS A«£ ADTACfWT Q PLACES 

bcKit none 



GRV ei/s 
INSULATOR 
+6V BUS 



/"a CONN 
PLANf HEf 





^H3 



TCTION R-R 

3MoytN& iNsJuwurfCM or yoLT/t^e ( cnd ^ines 

g ASSY or vemr/cM *v bos w/tm msuiatoa, z rtcs 

^.OCATION /t/£X 

SCAir ! NON£ 



RFFITE^7 iS 
-(iV FROM pS 

FHRTI/XL SECTION 5-S 

sl^ov/va MsmoRY mTG 4 1^3 option 

SCALE : FULL 




SE.CTIOW B.-'R 
SHOWING INSTA^LLATIOS OF VOLT^&E t.fiiRD 
^MmCS 4 A'WiV OF VEMC/kL 4V BUS ^WITH 
IM^ULAJOR 
LOCA>TION K\tsA 

«,CAO-E ■■ MONt 



CbM-lSO MtMORW 



Figure 3-10-5. Logic and Option Drawer 

Assembly {D7003 0064, Rev Z, 

Sheet 4 of 4) 

3-66 



CHAPTER IV 
MAINFRAME ILLUSTRATED PARTS BREAKDOWN 



This chapter contains the illustrated parts breakdown (IPB) for the three configura- 
tions of the H316 General Purpose Computer: table top, rack-mountable, and rack-mounted. 
Types 316-01, 316-0100, and 316-0110, including control panel, chassis assembly, and 
m.emory. Options are documented in separate manuals. 

GENERAL 

The mainfranne IPB is designed to aid logistical personnel in identification and pro- 
curem^ent of replaceable parts including assemblies and components. 

EQUIPMENT CODING 

Coding drawings have been provided for use as an aid to further identify equipment. 

METHODS OF USE 

Locating a part in this chapter can be done in several ways. The method used depends 
upon the availability of information initially. Once having knowledge of the name of the as- 
sembly on which the part is located, find the assembly name listed in Table 4-1. Having 
obtained the location of the part, refer to Figures 4-1 and 4-Z in the Group Assembly Parts 
List and proceed as follows: 

a. Identify on the illustration the equipnnent rack and locate the unit within the 
rack, indicated by a block leader line containing a number (Index). 

b. Refer to the parts lists immediately following the illustration. 

c. Read the information as it applies. 

d. Refer to another illustration (figure) that presents a detailed breakdown of 
that assembly. 

e. Immediately following the breakdown illustration, the parts list will contain the 
following information: 

1. Figure and Index Number: Each illustration is identified by a figure 

number. Each illustration contains leader lines and index numbers 
that key the order in which the parts are identified in the parts list. 
The only exceptions are the PACs, which are keyed in a different 
manner. 



4-1 



2. Designation: Honeywell coding designation (refer to coding explanation and 
coding drawings). 

3. Honeywell Part Number: Honeywell part numbers are given unless otherwise 
indicated by an asterisk. 

4. Indenture: The relationship of an item to its next higher assembly (NHA) is indi- 
cated in this column. The "B" level is an inherent part of the first preceding "A" 
level. The "C" levelis aninherentpart of the firstpreceding "B" level, etc. 

5. Description: This column may contain the following: 

(a) Data sufficient to identify parts for ordering purposes. 

(b) Instructions for locating a more detailed illustration for breakdown, 
i. e. , "(See Figure 4-6 for breakdown). " 

(c) Re-establishing how that particular figure was arrived at, i. e. , 
"(Refer to Figure 4-5-1 for NHA). " 

(d) Reference to the coding drawing for a better understanding of the 
coding technique used, i.e., "See Drawing Number 70023412, sheet 3 
for coding drawing." 

6. Quantity per Assembly: Each new figure is considered an assembly and the 
quantity indicated in the column is the unit quantity representing the total 
used common to that assembly. The appearance of "REF" indicates that 
the quantity was stated at its first appearance (NHA). 

PARTS PROCUREMENT GUIDE 

1. When ordering from this manual, always reference the model and serial number 
of the computer. 

2. Give the location of the assembly where the part is used. 

3. State the part number with the description given in this manual. 

4. Direct all inquiries to the following address; 

Honeywell Inc. 

Old Connecticut Path 

Framingham, Massachusetts 01701 

Telephone: 617-879-2600 
TWX: 710-380-6706 

Important: 

The illustrations shown are representative of all Honeywell Inc. H316 computers; 
therefore, the illustrations used may not show minor differences between industrial 
machines. If the differences are major, changes will be added to the illustration. 

As changes are made to the equipment, this publication will be updated. 



4-2 




UNIT D 



Coding Drawing No. 70023412, Rev P (Sheet 1 of 9) 



>t^ 



, 2 34567 b , ,0 .nz ,3,«,5 16 17 8,9 202 22 2324 25 26 



D2-XDXI__ 



02^0X6 



A2XDie02 











ALPW*.BeTlC-.Ae.C0EF&MlKLMNPaR5T0VWXYZ 

NUMERIC UL^flSfaT feO>« 

DltalT NO DtblCNATOR: O. ^ ^ ^ "?? IfJ 



..J 



1 L)WV 

i X OWE. 

3 ^Rtt^ 

A COLUMN - 

5,ib R.OW 



7 & TER»^\N^.T\ON- 



A^AFlOOfc ^' 

/\2 



Coding Drawing No, 70023412, Rev P (Sheet 2 of 9) 



D2Xee60» 



A 




<\'b 




£\\&A®»?]1-.^^/-.: 


l"^' 






c 




3^--^ 

^-^ 

^ 









DtfclT NO DE&\G.M^TO(e: U Z C R. ^S PP 





-J T ^ 


r "i 




p -y 


1 UMtT 








Z ILOME 


1 




























7 6 PIN^ 



MEMORY 



Coding Drawing No. 70023412, Rev P (Sheet 3 of 9) 



0^ 



/f£f TO ^MS-£T^a '^O/f COD/'U^ 



r 



J^ 



-^ 




a D^ C D,.^ c 



r^ 



./- 




/ 



'"','iijj^ ' 



-' 



-It 



1 



I Z 2. <1 5 (^ 



- M(i(rl9<^(i 



JAI00 3-i 



^ 



c 

OR. 



1 o o o 



5 



OPTION 



Coding Drawing No. 70023412, Rev P (Sheet 4 of 9) 



oooo 

A4A A3A A2A AIA 



J 



AiB2.BXOS-7 




Coding Drawing No, 70023412, Rev P (Sheet 5 of 9) 







ALPHABETIC -.AeCDEFGHiKLMNPaR ST 

NUMERIC M t'34-5fc7e'» e 

Ul&lT NO DESI&NATOR: U t A C RR "I 



UNIT 1 

ZONE- 
AREA ■ 



COLOMN- 



5,fo ROW 



7,B TERMINATVON 



Coding Drawing No. 70r\'>'' " 



i 34567 8 9 10 I 12 IJ i4is l6 1 7 ei9 «02l 22 23 i4 25 26 




- D2XG2 607 



Coding Drawing No. 70023412, Rev P (Sheet 7 of 9) 



I 

o 



A*XD0r<B-X 








\ 


<!>5 




XB 


^ 




— XA 


»» — 


■ ~ 




-*7 


26 1 




— »♦ 


83 i 


_ _ 


— 01 



AaXC<t79T- 



#7 






A_.. 




_4y&03(si 



(pb ^7 ita <ta Id 



^A4XDi}>a*5 



ALPHABET \C •, A B C DE FGHiKLMN PQ R. ST 

NVJMERlC:\i'3<V5 feT ft<i B 

0\&\T NO DE&I6NATOR: vi €. A C RR 1 



1 

Z. 

4 



UN\T 1 

7 OKIC 1 



ZONE 
AREA 



5,fo ROV^ 



7,B TERMINATION 



Coding Drawing No. 70023412, Rev P (Sheet 8 of 9) 



A,l AKai(H 








A\e.(o494l 



ALPHABETIC. A.OeDEF e,H3 xt.UfA NPaW^T 



A)R>^6a4 



1 UMlT 


-J T ' 




































?R pim'__ 



cvi-i^o , ncMOKY 



Coding Drawing No. 70023412, Rev P (Sheet 9 of 9) 



GROUP ASSEMBLY PARTS LIST 

Table 4-1 lists the figure number used to locate the Group Assembly Parts List for 
a particular subassembly 



Table 4-1 
Figure Number Cross Reference 



Fig. No. 



4 


-1 


4 


-2 


4 


-3 


4 


-4 


4 


-5 


4 


-6 


4- 


■7 


4- 


-8 


4- 


-9 


4- 


-10 


4- 


■ 11 


4- 


12 


4- 


13 


4- 


14 


4- 


15 


4- 


16 



4-17 

4-18 
4-19 

4-20 
4-21 

4-22 



Description 



H316 General Purpose Computer, Rack-Mounted 
Model, Type 316-01 

H316 General Purpose Computer, Rack-Mounted 
Model, Types 316-0100 and 316-0110 

H316 General Purpose Computer, Table Top 
Model, Type 316-01 

H316 General Purpose Computer, Table Top 
Model, Types 316-0100 and 316-0110 

Control Panel, Type 316-01 

Control Panel, Types 316-0100 and 316-0110 

Chassis Assennbly, Type 316-01 

Chassis Assembly, Types 316-0100 and 316-0110 

Mainframe Logic and Option Drawer Assembly, 
Type 316-01 

Mainframe Logic and Option Drawer Assembly, 
Types 316-0100 and 316-0110 

CSM-160 Core Memory Unit, Types 316-01, 
316-0100, and 316-0110 

CSM-150 Core Memory Unit, Types 316-01, 
316-0100, and 316-0110 

Logic Module Layout, Types 316-01, 316-0100, 
and 316-0110 

Cable Block Diagram 

Cable Assembly, Power, Electrical, Type 316-01 

Cable Assembly, Power, Electrical, Types 
316-0100 and 316-0110 

Cable Assembly, Power, Electrical, Types 316-01, 
316-0100, and 316-0110 

Cable Assembly, Special Purpose, Type 316-01 

Cable Assembly, Special Purpose, Types 
316-0100 and 316-0110 

Cable Assennbly, Special Purpose, Type 316-01 

Cable Assembly, Special Purpose, Types 
316-0100 and 316-0110 

Cable Assembly, Special Purpose, (x-PAC to 
(JL-PAC, Types 316-01, 316-0100, and 316-0110 



Part No. 



70023278501 

70030063701 

70023278703 

70030071703 

70023065 

70030065 

70023235 

70030054701 

70023232 

70030064701 

70023577 

70032935 

No number 

No number 

70023838701 

70030072701 

70023837701 

70024016701 
70029942701 

70024010701 
70029943701 

70013826701 



4-13 







5953 



Figure 4-1. H316 General Purpose Computer, 
Rack -Mounted Model, Type 316-01 



4-14 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-1- 


A 


70023278701 


A 


H316 GENERAL PURPOSE COMPUTER, 
RACK-MOUNTED MODEL, TYPE 316-01. 




-1 


A2 


70023065 


B 


CONTROL PANEL ASSEMBLY 

(see Figure 4-5 for breakdown and Coding 

Drawing No. 70023412, Sheet 2). 


1 


-2 


A4 


70023235 


B 


CHASSIS ASSEMBLY (see Figure 4-7 for 
breakdown and Coding Drawing No. 
70023412, Sheet 6). 


1 


-3 


Al 


70023232 


B 


MAINFRAME LOGIC AND MEMORY 
DRAWER (see Figure 4-9 for breakdown 
and Coding Drawing No. 70023412, 
Sheet 3). 


1 


-4 


A3 


70960061001 


B 


POWER SUPPLY (see Coding Drawing 
No. 70023412, Sheet 5). 





4-15 




Figure 4-2. H316 General Purpose Computer, Rack-Mounted 
Model, Types 316-0100 and 316-0110 



4-16 



Fig. & 
Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-2- 


A 


70030063701 


A 


H316 GENERAL PURPOSE COMPUTER, 
RACK-MOUNTED MODEL, TYPES 
316-0100 and 316-0110. 




-1 


A2 


70030065 


B 


CONTROL PANEL ASSEMBLY 
(see Figure 4-6 for breakdown and 
Coding Drawing No. 70023412, 
Sheet 7). 


1 


-2 


A4 


70030054 


B 


CHASSIS ASSEMBLY (see Figure 4-8 
for breakdown and Coding Drawing 
No. 70023412, Sheet 8). 


1 


-3 


Al 


70030064701 


B 


MAINFRAME LOGIC AND MEMORY 
DRAWER (see Figure 4-10 for break- 
down and Coding Drawing No. 
70023412, Sheet 3). 


1 


-4 


A3 


70023699 


B 


POWER SUPPLY (see Coding Drawing 
No. 70023412, Sheet 5). 


1 



4-17 




9961 



Figure 4-3. H316 General Purpose Computer, 
Table Top Model, Type 316-01 



4-U 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-3- 


A 


70023278703 


A 


H316 GENERAL PURPOSE COMPUTER 
TABLE TOP MODEL, TYPE 316-01. 




-1 




70023697701 


B 


s COVER TOP. 


1 


-2 


A2 


70023065 


B 


CONTROL PANEL ASSEMBLY (same as 
Rack-Mounted Model, see Figure 4-5 
for breakdown). 


1 


-3 


A4 


70023235701 


B 


CHASSIS ASSEMBLY (same as Rack- 
Mounted Model, see Figure 4-7 for 
breakdown). 


1 


-4 


Al 


70023232701 


B 


MAINFRAME LOGIC AND MEMORY 
DRAWER (same as Rack-Mounted Model; 
see Figure 4-9 for breakdown). 


1 


-5 


A3 


70023699701 


B 


POWER SUPPLY, MODIFIED (same as 
Rack Mounted Model except for mount- 
ing hardware). 


1 


-6 




912251001 


C 


LEVELING FOOT. 


4 


-7 




906320002 


C 


SNAPSLIDE FASTENER. 


2 



4-19 




7I-0033 



Figure 4-4 H316 General Purpose Computer, Table 
Top Model, Types 316-0100 and 316-0110 



4-20 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-4- 


A 


70030071703 


A 


H316 GENERAL PURPOSE COMPUTER, 
TABLE TOP MODEL, TYPES 316-0100 
and 316-0110. 




-1 




70023697701 


B 


COVER TOP. 


1 


-2 


A2 


70030065 


B 


CONTROL PANEL ASSEMBLY (same as 
Rack-Mounted Model, see Figure 4-6 
for breakdown). 


1 


-3 


A4 


70030054701 


B 


CHASSIS ASSEMBLY (same as Rack- 
Mounted Model, see Figure 4-8 for 
breakdown). 


1 


-4 


Al 


70030064 


B 


MAINFRAME LOGIC AND MEMORY 
DRAWER (same as Rack-Mounted Model, 
see Figure 4-10 for breakdown). 


1 


-5 


A3 


70023699701 


B 


POWER SUPPLY, MODIFIED (same as 
Rack-Mounted Model except for mounting 
hardware). 


1 


-6 




912251001 


C 


LEVELING FOOT. 


4 


-7 




906320002 


C 


SNAPSLIDE FASTENER. 


2 



4-21 




5960 



Figure 4-5. Control Panel, Type 316-01 



4-22 



Fig. &; 

Index 
No. 



Designation 



Part No. 



Inden- 
ture 



Description 



Qty 

per 

Ass'y 



4-5- 



-6 



A2 



A2E23 



A2E24, 22, 21, 
20, 18, 16, 15, 
13, 12, 11,09, 
08,07, 05,03, 
02,01 



A2D24, 22,21, 
20, 18, 16, 15, 
13, 12, 11,09, 
08.07,05, 03, 
02, 



A2F2 



70023065 



70960056001 



70934278001 



B 



70023068701 



70908281001 



A2F4 



A2F06, 08, 
17, 18, 19,20 

A2F07 



A2F10, 11, 12 
13, 14 



70935081203 



70935031002 

70910353001 
70934263001 
70945002002 

70934020003 

70934276001 

70934272001 



70934275001 



70910303001 



70943083002 



D 

D 
D 

D 



D 



D 



CONTROL PANEL ASSEMBLY 
(Refer to Figure 4-1-1 and 4-3-1, 
Type 316-01 for NHA) 

CIRCUIT BREAKER, DOUBLE POLE: 
1st pole series trip at 30A, 250 Vac 
50/60 Hz, curve 3; 2nd pole relay trip 
6 Vdc, 50 mA curve p. 

SWITCH PUSH-ROCKER DPDT: 60A ac; 

0. 5A dc. 



BUTTON, CAP -MOLDED LIGHT: grey 
plastic; 0.527 by 0.912 inch. 

HOUSING, LIGHT INDICATOR . 



LIGHT, INDICATOR: 28V at 0. 04A; 
yellow lens. 

PUSHBUTTON LIGHT INDICATOR 
ASSEMBLY CONSISTING OF: 

LAMPHOLDER ASSEMBLY: short flange 
type 

LENS SWITCH ACTUATOR. 

SWITCH, PUSH - SPDT: 5A at 250V. 

LAMP, INCANDESCENT: 0. 04 A at 28V 
7-1 3/4 bulb, midget flange base. 

SWITCH, LEVER LOCKING: 3 position, 
3A, 200 W. 

SWITCH, PUSH, ROCKER - SPDT: 6A 
at 125 Vac, 3A at 250 Vac; 1.0 A dc. 

SWITCH, PUSH, ROCKER - SPDT: 6A 
at 125 Vac; 3A at 250 Vac, 1. A dc . 

PUSHBUTTON ASSEMBLY CONSISTING 
OF: 

SWITCH, PUSH, INTERLOCK: 5 station 
interlock; 3A, 300W max; ac noninductive 
load • 

PUSHBUTTON: molded plastic, black/ 
white face. 

SEMICONDUCTOR DEVICE, DIODE: 
silicon type . 



Ref. 



17 



17 



16 



16 



4-23 




Figure 4-6. Control Panel, Types 316-0100 and 316-0110 



4-24 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


4-6- 


A2 


70030065 


B 


CONTROL PANEL ASSEMBLY 
(Refer to Figures 4-2-1 and 4-4-1, 
Types 316-0100 and 316-0110 for NHA) . 


Ref. 


-1 


A2E23 


70960058001 




CIRCUIT BREAKER, DOUBLE POLE: 
1st pole series trip at 30A, 250 Vac 
50/60 Hz, curve 3; 2nd pole relay trip 
6 Vdc, 50 mA curve p. 


1 


-2 
-3 


A2E24, 22, 
21,20, 18, 
16, 15, 13, 
12, 11,09, 
08.07,05, 
03,02,01 


70934284001 
70934283001 




SWITCH PUSH-ROCKER DPDT: 60A ac; 
0.5A dc. 

SWITCH PUSH SPDT . 


16 
1 


-4 


A2F2 


70934287001 




PUSHBUTTON LIGHT INDICATOR 
ASSEMBLY; 


1 


-5 


A2F4 


7093428801 




SWITCH, LEVER LOCKING: 3 position, 
3A, 200W 


1 


-6 


A2F06, 08, 
17,18, 19, 
20 


70934285001 




SWITCH, PUSH, ROCKER - SPDT; 6A 
at 125 Vac. 3A at 250 Vac; 1 . OA dc. 


6 


-7 


A2F07 


70934285002 




SWITCH, PUSH, ROCKER - SPDT: 6A 
at 125 Vac; 3A at 250 Vac; l.OA dc. 


1 


-8 


A2F10, 11, 
12, 13. 14 


70934286001 




PUSHBUTTON ASSEMBLY. 


1 



4-25 







5955 



Figure 4-7. Chassis Assembly, Type 316-01 



4-26 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No, 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


4-7- 


A4 


70023235701 


B 


CHASSIS ASSEMBLY, TYPE 316-01 
(Refer to Figures 4-1-2 and 4-2-2 for 
NHA). 


Ref 


-1 


A4E03 


70963015007 


C 


RELAY ARMATURE - DPDT: 1 sec delay 
contacts rated 5A, 125/250 Vac; coils 
24 Vdc, 2W continuous duty . 


1 


-2 


A4B03, 06, 
08 


70964007001 


C 


FAN AXIAL: 4. 13 in. square by 
1.970 in. thick. 


3 


-3 


A4C07 


70937502019 


C 


TERMINAL BOARD: barrier type; 19 
terminals; 20A rated, black molded 
bakelite . 


1 


-4 


A4D09 


7096002005 


C 


FUSE, CARTRIDGE: 0.5A;250V; 
1/4 in. diameter by 1-1/4 in. long 
instantaneous - Littelfuse 312.500. 


1 


-5 


A4D09 


70935008001 


c 


FUSEHOLDER: indicating types accom. 
1/4 in. by 1-1/4 diameter fuse, rated 
30 A at 90 to 250V. 


1 


-6 




70911003701 


c 


FILTER, AIR CONDITIONING. 


1 



4-27 




Figure 4-8. Chassis Assembly, Types 3 1 6-0 100 and 3 16-0 1 10 



4-26 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-8- 


A4 


70030054701 


B 


CHASSIS ASSEMBLY, TYPES 3 16-0100 
and 316-0110 (Refer to Figures 4-2-2 
and 4-4-2 for NHA). 


Ref. 


-1 




70960002005 


C 


FUSE, CARTRIDGE: 0.5A; 250V; l/4in. 
diameter by 1-1/4 in. long instantaneous 
Littelfuse 312.500. 


1 






70935011002 


C 


FUSEHOLDER, IN-LINE: indicating 
types accom. l/4 in. by 1-1/4 in. 
diameter fuse, rated 30A at 90 to 250V. 


1 


-2 




70911003009 


C 


FILTER, AIR CONDITIONING . 


1 


-3 


A4B03, 
06, 08 


70964008006 


C 




FAN, axial: 4. 13 in square by 
1.970 in. thick. 





4-29 



RESERVED RESERVED RESERVED 

RESERVED FOR FOR 4th FOR 3rd FOR 2nd 

OPTIONS CSM-160 MEMORY CSM- 160 MEMORY CSM -160 MEMORY 




6161 



4/5 6 

RESERVED FOR OPTIONS 



Figure 4-9- Mainframe Logic and Option Drawer Assembly, 

Type 316-01 



4-30 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-9- 


Al 


70023232701 


B 


LOGIC AND OPTION DRAWER 
ASSEMBLY, TYPE 316-01 (Refer to 
Figures 4-1-3 and 4-4-4 for NHA). 


Ref 


-1 




70023577704 


C 


CORE MEMORY UNIT (see Figures 
4-11 and 4-12 for breakdown). 


1 


-2 




No number 


C 


LOGIC PAC LAYOUT (see Figure 4-13 
for breakdown). 


1 



4-31 




7l-i302l 



Figure 4-10. Mainframe Logic and Option Drawer Assembly, 
Types 316-0100 and 316-0110 



4-32 



Fig. & 
Index 
No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass 'y 


4-10- 


Al 


70030064701 


B 


LOGIC AND OPTION DRAWER 
ASSEMBLY, TYPES 3 16-0100 and 
316-0110 (Refer to Figures 4-2-3 and 
4-4-4 for NHA). 


Ref 


-1 




70023577704 


C 


CORE MEMORY UNIT (see Figures 4-11 
and 4-12 for breakdown). 


1 


-2 




No number 


C 


LOGIC PAC LAYOUT (see Figure 4-13 
for breakdown). 


1 


-3 




70030069001 




PLATE FILLER. 


Ref 



4-33 




RESERVED 
FOR 

JUMPER 
PACS 
N 

MEMORY 
EXPANSION 



8 7 



3 2 I 



Figure 4-11. CSM- 160 Core Memory Unit, Types 316-01, 
316-0100, and 316-0110 



4-34 



Fig. & 
Index 


Desig- 




Inden- 




Qty 
per 


No. 


nation 


Part No. 


ture 


Description 


Ass 'y 


4-11- 


AIE-G 


70023577 


G 


GSM -160 CORE MEMORY UNIT (Refer 
to Figure 4-10-1 for NHA) . 


Ref 


-l 


A1G608 


CM- 384 


D 


RESISTOR PAG (see Chapter II, Section 
5 for breakdown). 


1 


-2 


A1G607, 
A1E603, 
A1G602, 
A1G603 


CM-306 


D 


SELECTOR PAG (see Chapter II, Section 
5 for breakdown). 


4 


-3 


A1F607, 08 


CM-305 


D 


INHIBIT PAG (see Chapter II, Section 5 
for breakdown) 


2 


-4 


A1F601, 03 


CM-363A 


D 


SENSE AMPLIFIER PAG (see Chapter II, 
Section 5 for breakdown). 


2 


-5 


A1G04 
A1G05 


70 


D 


CORE STACK: 4096 words, 16 bits 
per word. 


1 


-6 


A1G601 


Dl-375 


D 


NAND PAG (See Chapter II, Section 5. 
for breakdown). 


1 



4-35 




Figure 4-12. CSM-150 Core Memory Unit, Types 316-01, 
316-0100, and 316-0110 



4-36 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


4-12- 


AIE-G 


70032935 


C 


CSM-150 CORE MEMORY UNIT 
(Refer to Figure 4-10-1 for NHA). 


Ref 


-1 


A1E602 


CM-866 


D 


ADDRESS BOARD (see Chapter III, Sec- 
tion 10 for breakdown). 


1 


-2 


A1E603 
A1E604 


70 


D 


CORE STACK: 8192 words, 17 bits 
per word. 


1 


-3 


A1E605 

A1E606 


CM-867 


D 


DATA BOARD (See Chapter III, Section 
10 for breakdown). 


2 



4-37 



u 



10 II 12 13 14 15 16 17 




o 0) 00 r- 
<\j — — — 



m 



TM 



<D /m /•^r /to IcM I— lo joi a> r^ to lO •* m cm — 



19 18 6 5 4 3 2 1 



5966 



Figure 4-13. Logic Module Layout 



4-38 



Fig. & 

Index 

No. 



Designation 



Part No. 



Inden- 
ture 



Description 



Qty 

per 

Ass'y 



4-13- 



-7 



-10 



-12 



13 



• 14 



■15, -16 



•17 



■18 
•19 



AlBA 

A1AA09 
AlAAIO 
AlAAll 
A1AA12 
A1AAI3 
A1AA14 
A1BA17 

A1AA18 
A1AA17 
A1AA08 
A1AA07 
A1AA06 
A1AA05 
A1AA04 
A1AA02, 03 

AIAAOl 

A1AA16 
A1AA16 



No Number 



CC-372C 



CC-373 



CC-375 
CC-368 
CC-369B 



CC-344/ 
CC-696 



CC-080 
CC-681* 

CC-079 
CC-672* 

CC-367 



CC-366A 
CC-364A 
CC-371B 
CC-370A 
CC-365A 

CC-374A 

CC-510A 
CC-558 



D 
D 
D 
D 
D 
D 
D 

D 
D 
D 
D 
D 
D 
D 
D 

D 

D 
D 



LOGIC PAC LAYOUT - PAC SIDE VIEW 
(Refer to Figure 4-9-2 and 4-10-2 for 
NHA). 

REGULATOR COUNTER MODULE (See 
Chapter I, Section 2 for breakdown). 

MEMORY MODULE (See Chapter I, 
Section 2 for breakdown). 

T.TT/^'tJr Q'DTTT^r^ a TT ■NT _ O -yirr^T^Tn -r-y I r^ 

.i.xj.\jii oir'iL.JZjaJ .n.- u INO, o JVIOU U J-iJl, (see 

Chapter I, Section 2 for breakdown). 

HIGH SPEED A-U No. 1 MODULE (See 
Chapter I, Section 2 for breakdown). 

SHIFT REGISTOR MODULE (See Chapter 
I, Section 2 for breakdown). 

LAMP DRIVER MODULE (See Chapter I, 
Section 2 for breakdown). 

REAL TIME CLOCK PAC (See Real Time 
Clock Option Instruction Manual Doc. No. 
70130072179A for breakdown) . 

CABLE PAC (See Chapter I, Section 2 
for breakdown) . 

CABLE PAC (See Chapter I, Section 2 
for breakdown) . 

ADDRESS BUS MODULE (See Chapter I, 
Section 2 for breakdown) . 

COLUMNS 9-12 MODULE (See Chapter I, 
Section 2 for breakdown), 

COLUMNS 1-4 MODULE (See Chapter I, 
Section 2 for breakdown) . 

CLOCK MODULE (See Chapter I, Section 
2 for breakdown) . 

M REGISTOR MODULE (See Chapter I, 
Section 2 for breakdown) 

COLUMNS A-D MODULE (See Chapter I, 
Section 2 for breakdown) . 

ASR INTERFACE MODULE (See Chapter 
I, Section 2 for breakdown) 



Ref 



*Used in Type 316-0100 only 



4-39 



D- 



POWER 
SUPPLY 



CONTROL 
PANEL 



MEMORY 



LOGIC 



Figure 4-14. Cable Block Diagram 



Fig. & 

Index 

No. 



Type 



Part No. 



Inden- 
ture 



Description 



Qty 

per 

Ass'y 



4-14- 



-1 



-4 



-5 



-6 



316-01 



316-0100 



316-01 



316-0100 



Both types 



940252003 



940252002 



70023838701 



70030072703 



70023837705 



316-01 7024016701 



316-0100 



316-01 



316-0100 



Both types 



70029942701 



7024010701 



70029943701 



70032670703 



A 
B 

B 

B 

B 



B 



B 



CABLING BLOCK DIAGRAM. 



CABLE ASSEMBLY, POWER: 
12 ft overall length. 

CABLE ASSEMBLY, POWER: 
9 ft overall length. 

CABLE ASSEMBLY, POWER: 

Power Supply to Control Panel, 9 ft overall 

length (see Figure 4-15 for breakdown). 



Electrical, 
Electrical, 
Electrical 



Ref 
1 

1 

1 



CABLE ASSEMBLY, POWER: Electrical 
Power Supply to Control Panel; 9 ft overall 
length (see Figure 4-16 for breakdown). 

CABLE ASSEMBLY, POWER: Electrical 
Power Supply to Logic Drawer, 10 ft. 
overall length (see Figure 4-17 for 
breakdown) . 

CABLE ASSEMBLY, SPECIAL PURPOSE: 
Control Panel Cable No. 1 (see Figure 
4-18 for breakdown). 

CABLE ASSEMBLY, SPECIAL PURPOSE: 
Control Panel Cable No. 1 (see Figure 
4-19 for breakdown). 

CABLE ASSEMBLY, SPECIAL PURPOSE: 
Control Panel Cable No. 2 (see Figure 
4-20 for breakdown). 

CABLE ASSEMBLY, SPECIAL PURPOSE: 
Control Panel Cable No. 2 (see Figure 
4-21 for breakdown). 

CABLE ASSEMBLY, SPECIAL PURPOSE: 
IJL-PAC to M--PAC, 2 ft overall length 
(see Figure 4-22 for breakdown). 



4-40 



-7.5 FT. ±6 IN- 




I 2 




59G3 



Figure 4-15. Cable Assembly, Power, Electrical, Type 316-01 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


4-15- 




7023838701 


B 


CABLE ASSEMBLY, POWER: Electrical 
(Refer to Figure 4-14-2 for NHA). 


Ref 


-1 


B2A 


70941371001 


C 


CONNECTOR, PLUG, ELECTRICAL. 


1 


-2 




70941571001 


C 


PLUG TIP, MALE. 


15 


-3 


AXC 


70937058003 


c 


TERMINAL LUG. 


15 


-4 




70981002024 


c 


SLEEVING, ELECTRICAL. 


8 ft 



4-41 



-7.5 FT. +6 IN.- 





5963 



Figure 4-16. Cable Assembly, Power, Electrical, 
Types 316-0100 and 316-0110 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


4-16- 




70030072703 


B 


CABLE ASSEMBLY, POWER: Electrical 
(Refer to Figure 4-14-2 for NHA). 


Ref 


-1 


B2A 


70941341003 


C 


CONNECTOR, PLUG, ELECTRICAL. 


1 


-2 




70941571001 


C 


PLUG TIP, MALE. 


15 


-3 


AXC 


70937200001 


C 


TERMINAL. 


6 


-4 




70981002021 


C 


SLEEVING, ELECTRICAL. 


9 Ft 



4-42 



7FT ±6 IN 





5962 



Figure 4-17. Cable Assembly, Power, Electrical, 
Types 316-01, 316-0100 and 316-0110 



Fig. & 
Index 


Desig- 




Inden- 




Qty 
per 


No. 


nation 


Part No. 


ture 


Description 


Ass'y 


4-17- 




7023837705 


B 


CABLE ASSEMBLY, POWER: Electrical 
(Refer to Figure 4-14-3 for NHA) . 


Ref 


-1 


B2C 


70941341001 


C 


CONNECTOR, PLUG, ELECTRICAL. 


1 


-2 




70941571001 


C 


PLUG TIP, MALE. 


13 


-3 


AID 


70937200001 


c 


TERMINAL, QUICK DISCONNECT. 


11 


-4 




70981002023 


c 


SLEEVING, ELECTRICAL. 


8 Ft 



4-43 




5964 



Figure 4-18. Cable Assembly, Special Purpose, 
Control Panel Cable No. 1, Type 316-01 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-18- 




70024016701 


B 


CABLE ASSEMBLY, SPECIAL PURPOSE, 
CONTROL PANEL CABLE NO. 1, 
TYPE 316-01 (Refer to Figure 4-14-4 
for NHA). 


Ref 


-1 


A1AA17 


CC-079 


C. 


CABLE PAC (See Figure 4-13-9 for PAC 
location and Chapter I, Section 2 for 
breakdown). 


Ref 


-2 




70013624001 


C 


BRACKET, CLAMPING . 


1 


-3 




70013626001 


c 


PLATE. 


1 


-4 




70013623001 


c 


CLAMP. 


1 


-5 




70940359001 


c 


CABLE, SPECIAL, ELECTRICAL. 


4 Ft 



4-44 




5964 



Figure 4-19. Cable Assembly, Special Purpose, Control 
Panel Cable No. 1, Types 3 16-0100 and 316-0110 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-19- 




70029942701 


B 


CABLE ASSEMBLY SPECIAL PURPOSE, 
CONTROL PANEL CABLE NO. 1, 

TYPES 316-0100 and 316-01 10 (Refer to 
Figure 4-14-4 for NHA ) . 


Ref 


-1 


A1AA17 


CC-672 


C 


CABLE PAC (See Figure 4-13-9 for PAC 
location and Chapter 1, Section 2 for 
breakdown). 


Ref 


-2 




70013624001 


C 


BRACKET, CLAMPING. 


1 


-3 




70029335001 


C 


PLATE. 


1 


-4 




70029261001 


C 


CLAMP. 


1 


-5 




70940161001 


C 


CABLE, SPECIAL, ELECTRICAL. 


4 Ft 



4-45 




5965 



Figure 4-20. Cable Assembly, Special Purpose, 
Control Panel Cable No. 2, Type 316-01 



Fig. &L 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-20- 




70024010201 


B 


CABLE ASSEMBLY, SPECIAL PURPOSE, 
CONTROL PANEL CABLE NO. 2, 
TYPE 316-01 (Refer to Figure 4-14-5 
for NHA) . 


Ref 


-1 


A1AA18 


CC-080 


C 


CABLE PAC (See Figure 4-13-8 for PAC 
location and Chapter 1, Section 2 for 
breakdown). 


Ref 


-2 




70013624001 


C 


BRACKET, CLAMPING. 


1 


-3 




70013626001 


C 


PLATE. 


1 


-4 




70013623001 


C 


CLAMP. 


1 


-5 




70940359001 


C 


CABLE, SPECIAL, ELECTRICAL. 


4 Ft 



4-46 




5965 



Figure 4-21 Cable Assembly, Special Purpose, Control 
Panel Cable No. 2, Types 316-0100 and 316-0110 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-21- 




70029943701 


B 


CABLE ASSEMBLY, SPECIAL PURPOSE, 
CONTROL PANEL CABLE NO. 2. 
TYPES 316-0100 and 316-0110 (Refer to 
Figure 4-14-5 for NHA). 


Ref 


-1 


A1AA18 


CC-681 


C 


CABLE PAC (See Figure 4-13-8 for PAC 
location and Chapter I, Section 2 for 
breakdown). 


Ref 


-2 




70013624001 


C 


BRACKET, CLAMPING. 


1 


-3 




70029335001 


C 


PLATE. 


1 


-4 




70029261001 


C 


CLAMP. 


1 


-5 




70940159001 


C 


CABLE, SPECIAL, ELECTRICAL. 


4 Ft. 



4-47 



8,10,11 7,8,9 



PIN 33 




PIN 33 



Figure 4-22. Cable Assembly, Special Purpose, |jl-PAC to p.-PAC,for Types 



316-01, 316-0100, and 316-0110 (Drawing No. A70032670 Rev C) 



Fig. & 

Index 

No. 


Designation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-22- 




70032670703 


B 


CABLE ASSEMBLY, |j.-PAC to |jl-PAC 
(Refer to Figure 4-14-6 for NHA). 


Ref 


-1 




70013767701 


B 


PC CBL PAC . 


2 


-2 




70013626001 


B 


Plate . 


2 


-3 




70904109001 


C 


Screw, No. 2-56 x l/8 in. 


4 


-4 




70032671001 


C 


Clannp. 


2 


-6 




70013624001 


C 


Bar, Clamping. 


2 


-6 




70940377001 


C 


Cable, 32 Twisted Pair . 


a/r 


-7 




70902050001 


C 


Washer, Flat, No. 2 . 


4 


-8 




70902006039 


C 


Washer, Lock, Split, No. 2 . 


12 


-9 




70982152003 


C 


Cable Marker . 


2 


-10 




70904109002 


C 


Screw, No. 2-56 x 3/l6 in. 


8 


-11 




70902050002 




Washer, Flat, No. 2 . 


4 



4-48 



SECTION 2 
ILLUSTRATED PARTS BREAKDOWN 



This section contains the illustrated parts breakdown (IPB) of the power supply for 
both rack-mounted and table top models of the Ault Power Supply Model PR -130, used in the 
H316 General Purpose Computer. 




71 -0040 



Figure 4-23. Power Supply, Rack-Mounted Configuration 



4-53 



U1 




V^Jffiff, 



f ) 

,1 




115 VAC 
INPUT 



32 31 30 



Figure 4-24. Power Supply, Table Top Configuration 




PER S,R7725-O03fi 
ISSUED PER T>l»J »3B4 



i-f 



ti- . 



- D 



3. LOCATION OF UNIT TO 
BE IN ACCORDANCE 
WITH 70II0OII598 
SECTION 3X, 

2. BEFORE TIGHTENING 
OF ITEM 4- flSSETMBLE 
ITEM 2 TO ITEM 3 
TO ASSURE ALIGNMENT 
or ITEM 2 TO ITEM 4. 

l.flSSEMBLE ITEMS \43 
USING ITEMS 7, 8?9. 
701 



Figure A-2. Installation and Ac- 
cessories (Ref. Drawing 70033043, 
Rev. A) 



A-13 



REF 



DEL TAIL A 
SEE NOTE 70Z-t 






\)iiiiiTn )in miiiJ Tq r 
DETAIL B 



(^SEE NOTE 702H 



REF 




PER SR 664-4872 



AODCD ITEMS 33-32-3* 

f3f-«isa MMo/Ea zotzi 



trr CHG '3 pcn rco 

a.07S4- tJ.£. is-Je/hz 



PER. ECO 300^7 FPt 



^^. 



FSH. ECO 30 221 rpK 



7^ 



2S t.lZ 



--^d) 



R£F 



^ DETAIL C 



r^s: 



w 



^ 



I. MOKNTrNfG OF HABPWARE, TTEM5 [7,16.19 i28, 
5 PLCS MKD C- ITEW a7TaBr WST/ILUED 
iN ONE C LOCATION AS SHOlVN TN DETAIL A. 



■702 




Figure A-4. Chassis Assembly (Ref, 
Drawing 70031961, Rev. G) 



A-21 



XKAJS—JfIS 



XXB2)7_CB02 




HARACTER 


DESIGNATION 


POSITION 


FUNCTION 


1 


FRAME 


2 


GROUP 


3 


ZONE 


14.^ 


POSITION 


5 


LEVEL 


7,8 


COMPONENT 


9,10 


TERMINAL 



-XX/)(S iZ3 



Figure A-5. Coding Diagram (Ref. 
Drawing 70031976, Rev.D) 



A-22 



APPENDIX A 
AULT POWER SUPPLIES 



A-1 



CHAPTER IV 
AULT POWER SUPPLIES 



This chapter is divided into three parts. Each part contains illustrated parts break- 
down (IPB) for power supplies manufactured by Ault Inc. and used in the H316 General Purpose 
Computer. 

Part I contains operation instruction and for IPB Ault Model PR -100 manufactured per 
Honeywell specification control drawing (SCD) No. 950061001; Part II presents the operating 
instructions and IPB for Ault Model PR -130, manufactured per Honeywell SCD No. 
950061002; and Part III contains the IPB for Ault Model PR-136 and PR- 143, manufactured 
per SCDs 950 061 003 and 950 061 004. respectively. 

PART I 
AULT POWER SUPPLY, MODEL PR-100 

Part 1 contains two sections presenting the assembly description and illustrated parts 
breakdown for Ault Model PR-100. 

SECTION I 
ASSEMBLY DESCRIPTION 

This section presents the theory of operation, maintenance, troubleshooting procedure 
and adjustments for Ault Model PR-100. 

The H316 Power Supply is designed to provide operating voltages for the H316 
Computer as follows: 

24 Vac 1 ampere 

+ 6 Vdc 8-20 amperes 

-6 Vdc 1 ampere (max) 

+ 15. 5 Vdc 0. 2 - 5 amperes 

+ 24 Vdc 2 amperes (max) 

A multiple secondary constant voltage transformer is used to provide these required operat- 
ing potentials using an input line of 95 to 130 Vac at either 50 or 60 Hz. Logic circuitry is 
included in the power supply to control the turn on procedure. Circuit protection devices 
include fuses, a low line voltage sensing circuit, and a thermostat switch. 

PHYSICAL LAYOUT 

The Power Supply measures approximately 17 inches wide by 17 1/2 inches deep by 
5 inches high, and it is available for mounting with either the rack-mounted or table top 
computer configuration. The table top configuration uses the power supply as the computer 



4-1 



base, with the mainframe hinged to the top of the power supply. The rack-mounted con- 
figuration places the power supply below the mainframe and separately attached to the 
mounting rack. Cooling is provided by a built in fan and four connectors are used for inpiut 
and output voltages. 

THEORY OF OPERATION 

The Power Supply converts ac input power into four regulated dc outputs and one 
nonregulated 24 Vac output. A block diagram of the power supply is shown in Figure 4-1. 
Input ac power is supplied to a constant voltage transformer in the input power converter. 
Three secondaries of the constant voltage transformer provide the +6V, -6V and +24V 
output voltages. The +24V winding also provides bulk ac power to a series regulator which 
regulates the +15. 5V output voltage. A fourth secondary provides the 24 Vac output. The 
logic circuitry provides the required sequencing, line sensing and overvoltage protection. 
Reverse diodes are included across each output to prevent accidental reversal of polarity. 

Input Power Converter 

Input ac power is supplied to the primary of constant voltage transformer Tl. {Refer 
to Figure 4-2). Thermostat switch SI interrupts ac power if the ambient temperature 
reaches an unsafe operating level. A3A is the input ac fuse. The outputs of three secondaries 
of Tl are rectified and filtered to provide the ^6V and + 24V outputs as well as several other 
required bulk dc sources. A fourth secondary of Tl provides the unregulated 24 Vac output. 
Capacitor C17 is used in combination with a winding on Tl to resonate the transformer at 
the line frequency and provide the constant voltage characteristic. All the windings are 
tapped to allow change over between 50 and 60 Hz line operation. Transformer T2 is used 
by the line sense circuitry to monitor the input ac line. 

Reference Voltages 

Figure 4-3 shows the positive and negative reference sources required by the +15. 5V 
turn-on delay circuit and the +15. 5V overvoltage circuit. The rectified voltage from A2 is 
filtered by R2 and C2 and applied to zener diode CR6, which provides the positive reference 
voltage. Similarly, the rectified voltage from CR3 and CR4 is filtered by Rl and CI and 
applied to zener diode CR5, which provides the negative reference voltage. 

+ 15. 5V Series Regulator 

The +15. 5V series regulator and the turn-on control circuitry for the +15. 5V output is 
shown in Figure 4-4. 

Turn-on Control. -- The turn-on control circuitry is indicated by the dashed lines in 
Figure 4-4. Whenever Q6 is on, Q7 is on, which provides a drive current source for the 
+ 15. 5V series regulator. In this condition Q12 is also on, preventing CR12 from conducting. 
Whenever Q6 is turned off, however, Q7 is also turned off, removing the drive current to 
the +15. 5V series regulator, and turning it off. It also turns Q12 off, which causes CR12 to 



4-2 



INPUT 

A-C 

POWER 



INPUT 
POWER 
CONVERTER 



qA-C OUTLETS 
83B AND B4B 



SERIES 
REGULATOR 



• — ►• +6V®20A 



REVERSE 
DIODE 



REVERSE 
DIODE 



REVERSE 
DIODE 



REVERSE 
DIODE 



LOGIC 
CIRCUITRY 



-♦■ - 6V (JD I A 



24 VAC ® I A 



-*■ +24 V <a)2A 



+ 15.5V® 5A 



REMOTE TEMP. 
SENSE 



POWER STATUS 
INDICATOR 



FAULT 



SIGNAL 



5768A 



Figure 4-1. Power Supply Block Diagram 



4-3 



T2 



INPUT 
A-c 



A3A 
0—''\j- 



SI 




TB3 



:c6 



LL: 



C17 



vJ7 



u: 



CONNECTIONS SHOWN 
ON TB3 AND TB4 FOR 
60 HZ OPERATION 

DASHED LINES SHOW 
CONNECTIONS FOR 
50 HZ OPERATION 



J 



Tl 



LINE SENSE INPUT 



1 



TB4 



3 
O 
I 
O 



2 
O 
4 
O 



24 VAC OUTPUT 



■>l— t 



X 



^'^''^''^''^'-f ♦— O +6V OUTPUT 



CI8 



CI9 



•R68 



TB3 



10 

O h — 

8 
O 



9 
O 

II 
O 



CRI 



<7- 



CR2 



vX^C20 



COMMON 
-O -6V OUTPUT 



:R69 



TB4 



5 
O 



6 
O 
8 
O 



A2 



^ 



I I 



C2I, 



R70; 



A4A 



+24V OUTPUT 
-O a BULK DC 
FOR LOGIC 

BULK DC FOR 
415.5V REG. 



5772 



CR3 



CR4 



^ BULK DC FOR 
+ REFERENCE 
VOLTAGE 

-O BULK DC FOR 
- REFERENCE 
VOLTAGE 



^ 



Figure 4-2. Input Power Converter 



4-4 



A2 



o — ♦ 



>!- 



R2 R3 

f-AW f WV- 



C2" 




-O + REF. 



CR6( A"" 



CR3 



CR4 



Rl 



R4 



CI 



-WA/ » O-REF. 



CR6 



Q) 



Figure 4-3. Positive and Negative Reference Sources 



A4A 



R7I 
-AW- 



^11 R3I 



—Op" 



R24 <3I0_,^ R32 

' — WV |f > »AVN^^i 



R33 
R25 Q9 I WV- 



+ 15.5V 
■' f- O OUTPUT 



rrrC) 




Rie 



If 



>R35 



CIS 



TURN-ON CONTROL 



' CROWBAR 




> EXTERNAL 

> TEMP. 
SENSE 



R39< 



>R36 



-*<R37 



;R38 

-O COMMON 



Figure 4-4. +15.5-Volt Series Regulator 



4-5 



conduct. This fires the crowbar SCR in the +15. 5V overvoltage circuit, which shuts down the 
15. 5V output. During initial turn-on of the supply, this circuit attempts to fire the crowbar 
SCR, which would prevent turn-on. However, since no output voltage is present then, the 
crowbar SCR cannot turn on. 

Series Regulator Operation. - - The output voltage appears across a voltage divider 
consisting of R36, R37, R38 and R39, and an external temperature programming resistor. 
The wiper voltage of R37 is compared to the reference voltage across zener diode CRll by 
transistor Q8. Q8 controls the series regulator by shunting a portion of the base drive 
current for Q9 (provided by R23) awayfrom.Q9. (It is assumed that the turn-on control 
circuitry has already indicated turn-on). Q9 in turn controls the conductivity of QIO and the 
pass transistor, Qll, which controls the load current. 

Current limiting is provided by the circuit consisting of R31, R34, R35, and Q13, 
The current level is sensed by R31. The voltage across R31 is compared to a fixed voltage 
across R34 by transistor Q13. Whenever the maximum allowed current is reached, the 
voltage across R31 exceeds the voltage across R34. This causes Q13 to conduct, shunting 
away a portion of the base drive current for Q9, thus reducing the load current. The over- 
load characteristic is shown in Figure 4-5. 



OVERLOAD 




SHORT CIRCUIT 



Figure 4-5. Output Voltage/Current Overload Characteristic 



4-6 



Reverse Diodes 

Diodes CR32. CR33. CR34. and CR35 are connected across the +6V. -6V, +24V and 
+ 15. 5V outputs, respectively, to prevent accidental reversal of polarity in excess of two 
volts on any of these outputs. 

Logic Circuitry 

The logic circuitry consists of a line sense circuit, a +15. 5V turn-on delay circuit and 
an overvoltage circuit for the +15. 5V output. 

Line Sense Circuit. -- The line sense circuit (refer to Figure 4-6) initiates turn-off 
of the power supply if ac input voltage is below allowable limits. 

The ac input voltage is sensed by transformer T2. The secondary voltage is full-wave 
rectified by CR15 and CR16 to provide an unfiltered dc voltage across R46, R47 and R48. 
R47 is adjusted so that, when the peak ac input voltage rises above the low line limit, CR17 
will conduct, turning on Q17 until the ac input voltage drops below this level again. 

At the beginning of each half-cycle, C12 begins to charge at a rate determined by C12, 
R55 and the fixed reference voltage across zener diode CR19. Whenever C12 charges to 
the predetermined level, CR20 conducts, which causes SCR CR22, to fire. The charge rate 
is determined so that, if the ac input voltage is at low line or above, Q17 will be turned on 
due to the line sense voltage before C 12 has charged to the level which causes CRZO to 
conduct. Transistor Q16 is held on by the full-wave rectified voltage at all times except for 
a short period as the ac input voltage passes through zero volts. At this time, Q16 turns on 
and discharges C12 to reset the line sense circuit. 

Under normal ac input voltage conditions, Q17 clamps the gate of CR22 before it is 
fired (Figure 4-7 shows waveforms of the cathodes CR17 and CRZO). However, if the ac 
input voltage fails to reach the low line level for one half- cycle, CR22 is fired, and the 
following sequence occurs; 

a. Coupling diode CR21 conducts, turning Q5 on, which activates the relay trip coil 
on the external input circuit breaker. 

b. Coupling diode CR23 also conducts, drawing current through R57 away from zener 
diode CR24. This turns CR24 off, which then turns Q18 off. After a short period, C14 charges 
sufficiently to cause zener diode CR25 to conduct and fire crowbar SCR CR14 in the +15. 5V 
overvoltage circuit. 

c. Coupling diode CR26 also conducts, drawing current through R61 away from zener 
diode CR27, turning CR27 off, which then turns Q19 off. Relay Kl becomes deenergized and 
grounds the power status terminal. It also prevents CR29 from conducting, which turns 
CR30 and Q20 on. This causes the fault signal to appear (drop to ground). 

In summary, whenever the ac input voltage fails to reach the low line limit for one 
half-cycle, the fault signal appears, the external input breaker is opened, the power status 
terminal is grounded, and, after a short time delay period, the +15. 5V output is crowbarred. 



4-7 




RI2? 

CR2I Rll I 

-M ^AA/ * * 



C4 






TO RELAY TRIP 
-O COIL ON INPUT 
BREAKER 



>R57 



CR23 

-K— 



.R60 

CR25 
R59 /' r ^ T0+15.5V 

-O OVERVOLTAGE 
CR24 I ^— ^ CROWBAR GATE 

lQI8 



R54< 



R555 



017 R53 /7^ 



1 lCRIS 



CR20 



^ 




CR26 



CR22 



"CI2 



\CRI9 



7p;ci3 

-4 i 1' 



. CI4 



-O COMMON 



-O POWER STATUS SIGNAL 



R63 <R65 



CR30 /V^Q20 

-H- 



:R64 



-O FAULT SIGNAL 



© 



CR3I 



-O COMMON 



Figure 4-6. Line Sense Circuit 



4-8 



CRI7 CATHODE 



CR20 CATHODE 



5844 




Figure 4-7. Line Sense Circuit Waveform 



+ 15. 5V Turn- on Delay Circuit. -- The +15. 5V turn- on delay circuit (Refer to Figure 
4-8) ensures that the +15. 5V output is not allowed to turn on until the i6V output voltages 
have both reached 90% of nominal. 



+ 6V 

OUTPUT 

Q 



-6V 
OUTPUT 
O 



+ REE 
Q 



:r6 



d 



R7 



■R8 



R5 
-REFO — ^A/V— ♦ 1 



CR7 



Ql '^ 



R9 



Q2 



.C3 



:rio 



:ri7 



• — » 



RI5 



RI3! 



.RI4 



b 



RI6 

Q4 



■o 



fxC) 

I C5 
• i • i O 



C23 CR9 

e 



to +I5.5V 
■O REGULATOR 



COMMON 



5774 



Figure 4-8. +15.5-Volt Turn-On Delay Circuit 



4-9 



INPUT FROM 
+ I5.5V REG. a 
a LINE SENSE 




^+I5.5V 
^ OUTPUT 



O COMMON 



5773 

Figure 4-9. +15. 5- Volt Overvoltage Circuit 

The +6V output determines the current through resistors R6 and R7. This current is 
compared to the current through R5, which is determined by the negative reference voltage. 
Whenever the +6V output reaches its minimum allowed level, the current through R6 and R7 
exceeds the current through R5, turning Ql on, clamping Q2 off and allowing zener diode CR9 
to conduct. 

Similarly, the -6V output determines the current through R14 and R15. This current is 
compared with the current through R13, which is determined by the positive reference 
voltage. Whenever the -6V output reaches its minimum allowed level, the current through 
R14 and R15 exceeds the current through R13, turning Q3 off, turning Q4off, and allowing 
zener diode CR9 to conduct. 

Whenever both the +6V and -6V outputs are above their minimum allowed levels, Q2 
and Q4 are both off, and zener diode CR9 conducts to provide a turn- on signal for the +15. 5V 
regulator. However, if either the +6V or -6V output is belo-w its minimum allowed level, 
CR9 does not conduct. This removes the turn-on signal for the +15. 5V regulator, which 
turns off the regulator and crowbars the +15. 5V output. 

+ 15. 5V Overvoltage Circuit. -- The +15. 5V overvoltage circuit (Refer to Figure 4-9) 
crowbars the +15. 5V output via SCR CR14 whenever the +15. 5V output exceeds its maximum 
allowed level or whenever a shut-down signal is received from the +15. 5V regulator or the 
line sense circuit. 



4-10 



The +15, 5V output determines the current through R40 and R41. This current is 
compared with the current through R66, which is determined by the negative reference 
voltage. Whenever the +15. 5V output exceeds its maximum allowed level, the current 
through R40 and R41 exceeds the current through R66. This turns Q14 on, which turns Q15 
on. This fires crowbar SCR CR14, which clamps the +15. 5V output voltage to a low level. 
This circuit is also activated in the same manner whenever the +15. 5V regulator or the line 
sense circuit provides a positive signal at the base of Q14. 

MAINTENANCE 

The only routine maintenance required for the power supply is periodic cleaning or 
replacement of the air filter. Adjustment procedures, a trouble shooting chart and interface 
connection data are described in the following paragraphs. 

Replacement Parts 

Replacement parts can be purchased directly fronn Honeywell Inc. , Framingham, 
Mass. However, most of the components are standard electrical parts and might be 
obtained locally in less time. 

Recommended Test Instruments 



The following test instruments will be helpful in testing and adjusting the power supply: 

Voltmeter, ac/dc 
Ammeter, ac/dc 
Card Extender 



Troubleshooting Procedure 

Use every safety precaution when troubleshooting the power supply. The supply should 
be visibly examined for broken, loose or damaged parts, or wire and foreign objects. In 
the event of an audibly or visually apparent malfunction, proceed directly to the affected area 
and perform the necessary repairs. Apparent circuit board failure may be caused by im- 
properly adjusted potentiometers. This should be kept in mind when troubleshooting the 
power supply. 

WARNING 

The input transformer produces voltage in excess of 
600 volts. Exercise extreme caution whenever the 
power supply cover is off. Remove any rings, watches 
or other metallic objects before installation or testing. 
Avoid contact with heat sinks or the input transformer, 
which operate at high temperatures. 



4-11 



+ 24 VDC 
OUTPUTS -i COMMON 

[ * 6vDC 

1 



?- 



I 



1 






1 



EJITERNAL WiRtNG 



,J 



e2A 

BURNOT 
MS20PM-5e 



JT 



^ 



MUe8LE Jf T4M 



A 



RftS tS iNbT»LLtD UN^T inriEN REQUIRED 



^- SCHEMATIC DRAWN FOR 50hZ DOTTED UrNES AT TB3 a TB4 

REPRESENTS 60 NZ HOOK-UP 
*- Al:. resistances ARE I/ZW 5% IN OHMS ft ALL CAPACfTANCES 

t-ff 'Nu* UNLESS OTHERWISE SPECIFIED 



SLO- 
BLO 



ovq^ r- 



.1^ 

rtC'T-' 



A?a 

(OA 

S. 



1, 






CR56 



5o^-:^E 
' Imhy 



O- 



. CR32 
INI34I 



t!!:^ 



A 



H69 

'5.5W i.CR3^ 

WW. 10% f INM- 



+E4V0C 

2 , 25 W 



-AAAr- 



A. 



50> 25 W 



>Rro -T-V 

>620,2W 



TO SO TO EO DO FO CO BO AO HO UO 



0.5. 50 W 

IO%W.W, 



CR4 
— H— 



RS 
68. IW 

.02 
■ 300 
I5V 



e?:. 



820,1* 
MF5% 



2002W 
R4 

ea, IW 



I IK IW 
MF 9% 



^300- Ci^ 
+T^I5V \-/ 



7 ■•00 



-Co, 



!69_ 



RI4 

620, IW 
MF5% 



<) 



5 IK 
C4 

j 00I/500V 




RIT 
300 



o 



es 



R24 

5,5 W WW, 10% 
— vw 



220 > 001 /500V 






V! 



<> 



4 :^-»* v\^^ ,. 



C25 
'50/50V 






R26 

510 

— WA. 



— T 

eCR2! 
IN7( 



(g)IN82:IA g:J< 



Cfl2l 

'0005 CR23 

10 DOS 

■H ^ 



)CR22 
•'ClOCfl 



^ 



-^ 



-^ 



I 



24 VAC (^ I A 



POWER STATUS 
FAULT SIGNAL 




Figure 4- 10. 
Power Supply Schematic Diagram 



4-13 



Perform the following preliminary checks before troubleshooting the unit: 

a. Remove any foreign objects from the power supply. 

b. Since the power status signal is provided by a mercury relay, the power supply 
must be placed in an upright position to ensure proper operation. 

c. Check all input and output connections. 

d. Check the remote temperature sensing device connection. 

e. Check for proper connections for 50 or 60 Hz operation 



Table 4-1 . 
Troubleshooting Guide 



SYMPTOM 


POSSIBLE CAUSE 


SUGGESTED ACTION 


Power supply 


a. 


No input ac power. 


a. 


Check for input power. 


will not turn on. 


b. 


Open thermostat SI. 


b. 


Check for proper cooling. 




c. 


Blown fuse AlA or A3A 


c. 


Check fuses. 




d. 


Low ac line voltage. 


d. 


Check for faulty signal. 




e. 


Faulty or misadjusted 
line sense circuit 
under low ac line 
condition. 


e. 


Check ac line level and 
line sense circuit 
adjustment. 


No +15. 5V out- 


a. 


Undervoltage on +6V 


a. 


Check i6V levels. 


put voltage. 




or -6V output. 








b. 


Shorted output. 


b. 


Check with external loads 
removed. 




c. 


Faulty or misadjusted 
turn-on delay circuit. 


c. 


Check turn-on delay circuit. 


Low +15. 5 V out- 


a. 


Improper adjustment. 


a. 


Check output adjustment. 


put voltage. 


b. 


Blown fuse A4A 


b. 


Check fuse. 




c. 


Overloaded output. 


c. 


Check with external load 
removed. 




d. 


Misadjusted over- 
current limit. 


d. 


Check adjustment. 


Overvoltage 


a. 


Misadjusted output. 


a. 


Check adjustment. 


occurs on +15. 5V 


b. 


Shorted pass transistor 


b. 


Check Qll. 


output. 




Qll. 








c. 


Misadjusted overvoltage 
circuit. 


c. 


Check adjustment of over- 
voltage circuit: Overvoltage 
may not be actually occuring. 


False indication 


a. 


Power supply not in up- 


a. 


Check position of supply. 


at power status 




right position. 






terminal. 











4-15 



iz 



ADJUSTMENTS 

50 or 60 Hz Operation Adjustment 

Several tap changes are required on transformer Tl to convert from 60 Hz to 50 Hz 
operation. Figure 4-2 shovv^s the correct wiring for 60 Hz operation. The dashed lines 
show the changes required for 50 Hz operation. Changing frequency operation also requires 
readjustment of the line sense circuit. 

Output Voltage Adjustments 

The +15. 5V output is the only adjustable output. This voltage is controlled by 
potentiometer R37 where Clockwise rotation will increase the output voltage level. 

+ 15. 5V Overvoltage Adjustment 

The +15. 5V overvoltage adjustment is controlled by potentiometer R41. Proceed as 

follows: 

a. Turn R41 (maximunn overvoltage setting) fully clockwise. 

b. Apply input ac power. 

c. Adjust the +15. 5V output voltage to the desired overvoltage setting (18V) with 

the output voltage adjustment potentiometer R37. It may be necessary to replace the external 
thermistor with a decade box to reach this level. 

d. Slowly turn R41 counterclockwise until the +15. 5V output voltage drops to zero. 

e. Remove input ac power. 

f. Replace the external thermistor if it had been removed. 

g. Turn R37 fully counterclockwise, 
h. Apply input ac power. 

i. Set the +15. 5V output voltage to the desired operating level. 

+ 15. 5V Overcurrent Adjustment 

Adjust the overload bendback point with potentiometer R34 using the following procedure: 

a. Turn R34 fully clockwise. 

b. Apply a load to the +15. 5V output equal to the desired overcurrent setting. 

c. Apply input ac power. 

d. Slowly turn R34 counterclockwise until the +15. 5V output voltage starts to drop. 

e. Remove input ac power and remove the load. 

Line Sense Circuit Adjustment 

The line sense circuit is adjusted by potentiometer R47. This adjustment is required 



4-16 



whenever a change is made between 50 Hz and 60 Hz opera on. Proceed as follows: 

a. Turn R47 fully clockwise. 

b. Apply 95 Vac (low line) to the input power terminals. 

c. Slowly turn R47 counterclockwise until the fault signal appears. 

d. Remove input ac power. 

^6V Undervoltage Adjustment 

The +15. 5V turn-on delay circuit contains *6V undervoltage sensors. These sensors 
have been adjusted at the factory and should normally require no adjustment. However, if 
adjustment should become necessary, proceed as follows: 

+ 6V Output Adjustnrtent Procedure 

a. Turn R7 fully counterclockwise. 

b. Disconnect the lead from connector Jl-H to capacitor C18 (positive terminal) 
at the capacitor. 

c. Connect the disconnected lead to a positive voltage source of the desired under- 
voltage level. 

d. Apply input ac power. 

e. Slowly turn R7 clockwise until the +15. 5V output drops to zero. 

f. Remove input ac power. 

g. Remove the external voltage source and reconnect the lead to CI 8. 

-6V Output Adjustment Procedure 

a. Turn R15 fully counterclockwise. 

b. Disconnect the lead from connector Jl-J to capacitor C20 (negative terminal) at 
the capacitor. 

c. Connect the disconnected lead to a negative voltage source of the desired under- 
voltage level. 

d. Apply input ac power. 

e. Slowly turn R15 clockwise until the +15. 5V output drops to zero. 

f. Remove input ac power. 

g. Remove the external voltage source and reconnect the lead to C20. 

CONNECTOR INTERFACE DATA 

All inputs and outputs are made via the four connectors on the power supply. The pin 
connections are tabulated below. The connector number precedes the pin number; for example, 



4-17 



BZA-A refers to pin A or connector B2A. 



Terminal 

BIB 

B2A-A 

B2A-D 

B2A-F 

B2A-H 

B2A-J 

B2A-M 

B2A-N 

B2A-P 

B2A-S 

B2A-R 

B2A-U 

B2A-T 

B2A-V 

B2A-W 

B2A-X 

B2B-YEL 

B2B-RED 

B2B-BLK 

B2B-WHT 

B3B 

B4B 

B2C-A 

B2C-B 

B2C-C 

B2C-D 

B2C-E 

B2C-F 

B2C-H 

B2C-M 

B2C-N 

B2C-P 

B2C-R 

B2C-S 



Identification 

AC Input Power 

+24 Vdc Output 

Common 

To relay trip coil on circuit breaker 

To relay trip coil on circuit breaker 

+6V Output 

From input circuit breaker 

From input circuit breaker 

From input circuit breaker 

From input circuit breaker 

To Fan 

To Fan 

To input circuit breaker 

To input circuit breaker 

To input circuit breaker 

To input circuit breaker 

24 Vac Output 

+ 6 Vdc Output 

-6 Vdc Output 

Common 

Ac outlet, non*-fused 

Ac outlet, fused 

+ 24 Vdc Output 

+ 15. 5 Vdc Output 

Common 

Common 

Common 

Line fault signal 

+6 Vdc Output 

Temperature sense element 

Temperature sense element 

-6 Vdc Output 

Power status terminal 

+ 6 Vdc output 



SPECIFICATIONS 

Input Power 

95-130 VRMS, 50 or 60 Hz ±1 Hz, single phase. 



4-11 



Output Power 



Output 
Voltage 


Current 
Range 

- 2A 


Regulation 
Band 


Set 
Current 

1. 5A 


Ripple 
(P-P) 


+ 24 Vdc 


i5%* 


5% 


+ 15. 5 Vdc 


-. 2 - 5A 


±5% 





2% 


+ 6Vdc 


8 - 20A 


i6%* 


15A 


2% 


-6 Vdc 


- lA 


±6%* 


0. 5A 


2% 


24Vac 


- lA 





. . — « 


_ 



*Regulation of +24V, +6V and -6V includes static line voltage changes (at set 
current) and ripple only. 

Adjustment Range 

The +15. 5V output is adjustable to nominal. 

Temperature Compensation 

The +15. 5V output is remotely controlled by a temperature sensing device (Honeywell 
P/N 70 932 305 001) at a nominal rate of -0.5% per °C from 0-60°C. The bandwidth allowed 
is ±4% deviation from linearity below 25°C and ±2% deviation from linearity above 25°C. 

Overvoltage Protection 



Turn-on and turn-off will not cause the +15. 5V output to exceed 18V nor the ^6V out- 
puts to exceed nominal by more than 20%. 

An overvoltage crowbar circuit prevents the +15. 5V output from exceeding 18V in the 
event of a regulator component failure. 

Overcurrent Protection 



Fuses are provided for input ac power, the internal fan, bulk dc power for the +15. 5V 
regulator and two ac auxiliary outjJuts. Current limiting circuitry is incorporated in the 
+ 15, 5V regulator. 

Output Voltage Reversal 

Reverse diodes are included across each dc output to prevent any voltage from reversing 
polarity by more than 2. volts. 

Thermal Cutout 



A thermal cutout is included to remove input ac power to the power supply if unsafe 
temperature is exceeded. 

Operating Temperature 
- 60°C. 



4-19 



Efficiency 

50% or greater when fully loaded. 

Turn- on Turn-off Sequencing 

The following turn-on and turn-off sequencing is provided under all rated load condi- 
tions: 

1. During turn- on, the +15. 5V output will not rise above 20% of nominal until the 
i6V outputs are above 90% of nominal. The i6V outputs are energized when power 
is applied. 

2. During turn-off, the ±6V outputs shall remain above 90% of nominal until the +15. 5V 
output drops below 20% of nominal. 

3. A +5 to +6 volt fault signal rated at 10 mA is provided whenever input ac power is 
within acceptable limits. The +15. 5V output will remain within regulation for a 
minimum of 1. ms after loss of this signal, and the i6V outputs will remain in 
regulation xor at least 2 ms. 

4. The fault signal will fall to ground level within 1/2 cycle of the loss of input ac 
power. Removing the fault signal also trips the input ac circuit breaker. 



4-20 



SECTION 2 
ILLUSTRATED PARTS BREAKDOWN 



This section contains the illustrated parts breakdown (IPB) of the power supply for 
both rack- mounted and table top models of the H316 General Purpose Computer. 




26 2S Z4 



Figure 4-11. Power Supply, Rack-Mounted Configuration (Part 1 of 2) 



4-21 




^ 







i i il m rSi r-i-C llLtl 



FUSED 

(10 A) NON- FUSED 



Id 




27 31 30 



5960 



Figure 4-11. Power Supply, Table Top Configuration (Part 2 of 2) 



4-22 



Fig. & 

Index 

No, 


Designation 


AULT 
Mfg. Co. 
Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


4-11 


A3 


950061001* 


C 


POWER SUPPLY - AULT Mfg; No. 
PR 100-Al 2 (Refer to Figure 3-1-4 
and 3-2-5 for NHA). 


Ref 


-1 


AlA 


6221293 


D 


FUSE, CARTRIDGE - 3A, Slo-Blo 


1 


-2 


A2A 


6221294 


D 


FUSE, CARTRIDGE - lOA, Slo-BIo 


2 


-3 


A3A 


6221294 


D 


FUSE, CARTRIDGE - Same as A2A 


Ref 


-4 


A4A 


62211002 


D 


FUSE, CARTRIDGE - 7.5A 


1 


-5 


C22 


4001540 


D 


CAPACITOR, FXD, ELECTROLYTIC - 
175 ,uF, 25V 


1 


-6 


TB4 


6201601 


D 


TERMINAL BOARD - barrier type 


2 


-7 


LI 


3021285 


D 


CHOKE 


1 


-8 


C19 


4001278 


D 


CAPACITOR, ELECTROLYTIC - 
100, 000 |iF, lOV 


3 


-9 


C20 


4001278 


D 


CAPACITOR, ELECTROLYTIC - 
same as C19 


Ref 


-10 


C18 


4001278 


D 


CAPACITOR, ELECTROLYTIC - 
same as C 19 


Ref 


-11 


R69 


5804601 


D 


RESISTOR, FXD, WIREWOUND - 
15 ohms, 5W ±10% 




-12 


C21 


4001283 


D 


CAPACITOR, FXD, ELECTROLYTIC - 
50, 000 (xF, 32V 




-13 


R70 


5003083 


D 


RESISTOR, FXD, FILM - 620 ohms, 
2W, ±5% 




-14 


R68 


5003054 


D 


RESISTOR, FXD, FILM - 39 ohms, 
2W, ±5% 




-15 


TB2 


6201601 


D 


TERMINAL BOARD - same as TB4 




-16 


C17 


4061414 


D 


CAPACITOR, FXD - 6 |jiF, 660V 




-17 


CR32 


6031033 


D 


SEMICONDUCTOR DEVICE, DIODE - 
type IN 1341 


4 


-18 


CR33 


6031033 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR32 


Ref 


-19 


CR34 


6031033 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR32 


Ref 


-20 


CR35 


6031033 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR32 


Ref 


-21 


A3 


0802583 


D 


CIRCUIT CARD ASSEMBLY (See Figure 
4-12 for breakdown) 


1 


-22 


T2 


3011428A 


D 


TRANSFORMER 




-23 


TB3 


6201158 


D 


TERMINAL BOARD - barrier type 




-24 


Bl 


6281011 


D 


FAN, AXIAL 




-25 


Tl 


3011471B 


D 


TRANSFORMER, CONSTANT VOLTAGE 




-26 


TBI 


6201132 


D 


TERMINAL BOARD - barrier type; C-J 
type 2-140 





!=CCD part number assignment 



4-23 



Fig. & 
Index 

No. 



Designation 



AULT 
Mfg. Co. 
Part No. 



Inden- 
ture 



Description 



Qty 

per 

Ass'y 



4-11 



-27| 

-28 
-2 = 
-30 
-31 



CR36, CR37 
(not shown) 

A2 

(not shown) 

C16 

(not shown) 

R71 

(not shown) 

B3B, B4B 



B2C 
BIB 
B2A 
B2B 



6031 1881 

6061092 

4061102 

5808201 

62015502 

62012402 
62012402 



D 

D 
D 
D 
D 

D 
D 
D 
D 



SEMICONDUCTOR DEVICE, DIODE - 
type 40HF5 

RECTIFIER 

CAPACITOR, FXD, ELECTROLYTIC - 
0. 1 [xF, 600V 

RESISTOR, FXD, WW - 0.5 ohm, 50W 

10% 

CONNECTOR, RECEPTACLE, ELEC - 
2 section w/2 female parallel contact 
and 1 gnd pin contact, Hubbell type 5262 

CONNECTOR, RECEPTACLE, ELEC - 
Burndy type, MS20RM58 

CONNECTOR, AC, PWR-Hubbel p/n 
7486 

CONNECTOR, RECEPTACLE, ELEC - 
same as B2C 

CONNECTOR RECEPTACLE - consisting 
of 5 contacts; two DC 2025 yellow; one 
DC2025 red; one DC2025 black; one 
DC2025 white, Heyco type 



1 
1 
2 

2 

1 
Ref 

1 



4-24 



I? 20 




5946 



Figure 4-lZ. Printed Circuit Card (Part 1 of 2) 



4-25 



90 91 92 93 »4 95 




5945 



Figure 4-12. Printed Circuit Card (Part 2 of 2) 



4-26 



Fig, & 

Index 

No. 



4-12- 



-1 



-3 
-4 
-5 

-6 
-7 
-8 
-9 

-10 
-11 

-12 

-13 



-23 



Designation 



A3 

CR23 

CR22 

C13 

CR21 

CR20 

Cll 
C14 
C12 
CR25 

C9 
C8 
CR14 

CR13 



14 


C6 


15 


CR12 


16 


SI 


17 


C15 


18 


CR5 


19 


C5 


20 


CR8 


21 


C3 


22 


CR7 



CRd 



24 


C2 


25 


CI 


26 


CR4 


27 


CR3 


28 


CR2 



AULT 
Mfg. Co. 
Part No. 



0802583 

6031300 

6001072 

4061239 
6031300 
60511002 

4001069 
4041018 
4041010 
60511002 

4061138 
4061239 
6001038 

6051300 

4001542 
6031300 

62610945 

4061239 

6051215 

4061239 
6031300 

4061239 
6031300 

6051215 

4001539 
400153? 
6031290 

6031290 

6031301 



Inden- 
ture 



D 

E 

E 

E 
E 
E 

E 

E 
E 
E 

E 
E 
E 

E 

E 

■7—' 

E 
E 
E 

E 
E 

E 
E 



E 
E 
E 

E 

E 



Description 



CIRCUIT CARD ASSEMBLY (Refer to 
Figure 4-11-21 for NHA) 

SEMICONDUCTOR DEVICE, DIODE - 
type 10D05 

SEMICONDUCTOR DEVICE, DIODE - 
SCR type C106F1 

CAPACITOR - 0. 002|j.F, 500V 6 

SAME AS CR23 1 

SEMICONDUCTOR DEVICE, DIODE - 2 

type 1N753A 

CAPACITOR - 2 p.F, 50V I 

CAPACITOR - 1.0 |jlF, 50V 2 

CAPACITOR - same as C14 Ref 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR20 

CAPACITOR - 0.047 p,F, 200V 1 

CAPACITOR - same as C13 Ref 

SEMICONDUCTOR DEVICE, DIODE ~ 1 

SCR type C20U 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

CAPACITOR - 10 )iF, 35V 1 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

THERMOSTAT 1 

CAPACITOR - same as C13 Ref 

SEMICONDUCTOR DEVICE, DIODE - 2 

type 1N4733A 

CAPACITOR - same as C!3 Ref 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

CAPACITOR - same as C13 Ref 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR5 

CAPACITOR - 300 ^iF, 15V 2 

CAPACITOR - same as C2 Ref 

SEMICONDUCTOR DEVICE, DIODE - 2 

type lODl 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR4 

SEMICONDUCTOR DEVICE, DIODE - 2 

type 1N4816 



4-27 



Fig, &t 

Index 

No. 



Designation 



AULT 
Mfg . Co . 
Part No. 



Inden- 
ture 



Description 



Qty 
per 

Ass'y 



-29 

-30 

-31 
-32 

-33 

-34 

-35 

-36 

-37 

-38 

-39 
-40 

-41 

-42 
-43 

-44 

-45 

-46 

-47 

-48 

-49 

-50 

-61 

-52 

-53 



CRl 

CRll 

C7 
CRIO 

CR9 

CRl 5 

CR16 

CR18 

CR17 

CRl 9 

CIO 

C4 

CR31 

Kl 
CR30 

CR29 

CR28 

CR24 

CR27 

CR26 

R62 

R58 

R53 

R60 

R56 



6031301 

605110037 

4061132 
6031300 

605110030 

6031172 

6031172 

6031300 

605110020 

605110028 

4061142 
4061239 
605110020 

6241104 
6031300 

6031300 

6031300 

605110030 

605110030 

605110030 

5001129 

5001105 

5001040 

5001095 

5001088 



E 

E 

E 
E 

E 

E 

E 

E 

E 

E 

E 
E 
E 

E 
E 

E 

E 

E 

E 

E 

E 

E 

E 

E 

E 



SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR2 

SEMICONDUCTOR DEVICE, DIODE - 1 

type 1N751A 

CAPACITOR - 0.001 |a.F, 200V 1 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - 4 

type 1N746A 

SEMICONDUCTOR DEVICE, DIODE - 1 

type 1N645 

SEMICONDUCTOR DEVICE, DIODE - 1 

type 1N645 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - 2 

type 1N752A 

SEMICONDUCTOR DEVICE, DIODE - 1 

type 1N964B 

CAPACITOR - 0.068 |j.F, 200V 1 

CAPACITOR - same as C13 Ref 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR17 

RELAY, MERCURY WETTED 1 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR9 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR9 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR9 

RESISTOR, FXD, COMP - 5 IK ohms, 3 

1/2W, 5% 

RESISTOR, FXD, COMP - 5. IK ohms, 
1/2W, 5% 

RESISTOR, FXD, COMP - 10 ohms, 2 

1/2W, 5% 

RESISTOR, FXD, COMP - 2K ohms, 1 

1/2W, 5% 

RESISTOR, FXD, COMP - IK ohms, 3 

1/2W, 5% 



4-2{ 



Fig. & 

Index 

No. 


Designation 


AULT 
Mfg. Co. 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


-54 


R59 


5001040 


E 


RESISTOR, FXD, COMP - same as R5 3 


Ref 


-55 


Q18 


6011075 


E 


TRANSISTOR, type 2N3569 


14 


-56 


R52 


5001119 


E 


RESISTOR, FXD, COMP - 20K ohms, 

1/2W, 5% 


2 


-57 


Q16 


6011075 


E 


TRANSISTOR - same as 018 


Ref 


-58 


R67 


5001092 


E 


RESISTOR, FXD, COMP - 1.5 ohms, 
1/2W, ±5% 


1 


-59 


R49 


5001105 


E 


RESISTOR, FXD, COMP - same as R58 


Ref 


-60 


R45 


5001071 


E 


RESISTOR, FXD, COMP - 200 ohms. 
1/2W, 5% 


1 


-61 


R44 


5001073 


E 


RESISTOR, FXD, COMP - 240 ohms, 
1/2W, 5% 


1 


-62 


Q15 


6011151 


E 


TRANSISTOR - type 2N3638 


2 


-63 


R42 


5001099 


E 


RESISTOR, FXD, COMP - 3K ohms, 
1/2W, 5% 


1 


-64 


Q6 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-65 


Q14 


6011075 


E 


TRANSISTOR - same as 018 


Ref 


-66 


R43 


5001105 


E 


RESISTOR, FXD, COMP - same as R58 


Ref 


-67 


R40 


5303099 


E 


RESISTOR, FXD, FILM - 3K ohms, 
IW, 5% 


1 


-68 


R41 


59013526 


E 


RESISTOR, VARIABLE - IK ohm 


2 


-69 


R27 


5001088 


E 


RESISTOR, FXD, COMP - same as R56 


Ref 


-70 


Q8 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-71 


R26 


5001081 


E 


RESISTOR, FXD, COMP - 510 ohms, 
1/2W, 5% 


2 


-72 


R28 


5001105 


E 


RESISTOR. FXD. COMP - same as R58 


Ref 


-73 


R29 


5001116 


E 


RESISTOR, FXD, COMP - 15K ohms, 
1/2W, 5% 


2 


-74 


R30 


5001096 


E 


RESISTOR, FXD, COMP - 2. 2K ohms, 
1/2W, 5% 


3 


-75 


R22 


5001081 


E 


RESISTOR, FXD, COMP - same as R26 


Ref 


-76 


012 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-77 


R35 


5001100 


E 


RESISTOR, FXD, COMP - 3. 3K ohms, 
1/2W, 5% 


1 


-78 


Qll 


6011133 


E 


TRANSISTOR - type MJ2801 _^ 


2 


-79 


R33 


5001077 


E 


RESISTOR, FXD, COMP - 360 ohms, 
1/2W, 5% 


1 


-80 


QIC 


6011133 


E 


TRANSISTOR - same as Qll 


Ref 


-81 


R14 


5303086 


E 


RESISTOR, FXD, FILM - 820 ohms, 
IW, 5% 


3 


-82 


R18 


5001072 


E 


RESISTOR, FXD, COMP - 220 ohms, 
1/2W. 5% 


1 


-83 


Q9 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 



4-29 



Fig. & 

Index 

No. 


Designation 


AULT 
Mfg. Co. 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


-84 


R25 


5001057 


E 


RESISTOR, FXD, COMP - 51 ohnns, 
1/2W, 5% 


1 


-85 


R66 


5303089 


E 


RESISTOR, FXD, FILM - 1. IK ohms, 
IW, 5% 


2 


-86 


R15 


5901128 


E 


RESISTOR, VARIABLE - 400 ohms 


3 


-87 


Q4 


6011151 


E 


TRANSISTOR - same as Q15 


Ref 


-88 


Q3 


6011075 


E 


TRANSISTOR - same as Q18 


1 


-89 


R37 


5901132 


E 


RESISTOR, VARIABLE - 500 ohms 


1 


-90 


R16 


5001116 


E 


RESISTOR. FXD, COMP - same as R29 


Ref 


-91 


Q2 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-92 


RIO 


5001129 


E 


RESISTOR, FXD, COMP - same as R62 




-93 


Ql 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-94 


R9 


5001096 


E 


RESISTOR, FXD, COMP - same as R30 


Ref 


-95 


R8 


5001096 


E 


RESISTOR, FXD, COMP - same as R30 


Ref 


-96 


R7 


5901128 


E 


RESISTOR, VARIABLE - same as R15 


Ref 


-97 


R17 


6001075 


E 


RESISTOR, FXD, COMP - 300 ohms, 

1/2W, 5% 


1 


-98 


R13 


5303086 


E 


RESISTOR, FXD, FILM - same as R14 


Ref 


-99 


R6 


5303086 


E 


RESISTOR, FXD, FILM - same as R14 


Ref 


-99A 


R5 


5303089 


E 


RESISTOR, FXD, FILM - same as R66 


Ref 


-100 


R2 


5003071 


E 


RESISTOR, FXD, COMP - 200 ohms, 
2W, ±5% 


2 


-101 


R3 


5002060 


E 


RESISTOR, FXD, COMP - 68 ohms, 

IW, ±5% 


1 


-102 


Rl 


5003071 


E 


RESISTOR. FXD, COMP - same as R2 


Ref 


-103 


R4 


5002060 


E 


RESISTOR, FXD, COMP - same as R3 


Ref 


-104 


R24 


5804602 


E 


RESISTOR, FXD, WW - 5 ohms, 5W, 
±10% 


1 


-105 


R31 


5804455 


E 


RESISTOR, FXD. WW - 0. 1 ohm, 5W, 

±5% 


1 


-106 


R32 


5001070 


E 


RESISTOR. FXD, COMP - 180 ohms, 
1/2W, ±5% 


1 


-107 


R34 


5901128 


E 


RESISTOR, VARIABLE - same as R15 


Ref 


-108 


Q13 


6011075 


E 


TRANSISTOR - same as 018 


Ref 


-109 


R38 


5303092 


E 


RESISTOR, FXD, FILM - 1 . 5K ohms, 
IW, ±5% 


2 


-110 


R36 


5303086 


E 


RESISTOR, FXD. FILM - 820 ohms, 
IW. ±5% 


1 


-111 


R23 


5001088 


E 


RESISTOR, FXD, COMP - same as R56 


Ref 


-112 


R39 


5303097 


E 


RESISTOR, FXD, FILM - 2.4Kohms, 

IW, ±5% 


1 


-113 


R20 


5001105 


E 


RESISTOR, FXD. FILM - same as R58 


Ref 



4-30 



Fig. & 




AULT 






Qty 


Index 




Mfg. Co. 


Inden- 




per 


No. 


Designation 


Part No. 


ture 


Description 


Ass'y 


-114 


Q7 


6011153 


E 


TRANSISTOR - type 2N3644 


2 


-115 


R19 


5001105 


E 


RESISTOR, FXD, COMP - same as R58 


Ref 


-116 


R21 


5001112 


E 


RESISTOR, FXD, COMP - 1 OK ohms, 
1/2W, ±5% 


3 


-117 


R51 


5001112 


E 


RESISTOR, FXD, COMP - same as R21 


Ref 


-118 


R12 


5001105 


E 


RESISTOR, FXD, COMP - same as R58 


Ref 


-119 


R50 


5001119 


E 


RESISTOR, FXD, COMP - same as R52 


Ref 


-120 


R46 


5303092 


E 


RESISTOR, FXD, FILM - same as R38 


Ref 


-121 


R48 


5303087 


E 


RESISTOR, FXD, FILM - 910 ohms, 
IW, ±5% 


1 


-122 


Q17 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-123 


05 


6011153 


E 


TRANSISTOR - same as Q7 


Ref 


-124 


R47 


59013526 


E 


RESISTOR, VARIABLE - same as R41 


Ref 


-125 


RU 


5001105 


E 


RESISTOR, FXD, COMP - same as R58 


Ref 


-126 


Q20 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-127 


R55 


5001097 


E 


RESISTOR. FXD, COMP - 2. 4K ohms, 

1/2W, 5% 


1 


-128 


R65 


5003083 


E 


RESISTOR, FXD, FILM - 620 ohms, 
2W. ±5% 


1 


-129 


R64 


5001129 


E 


RESISTOR, FXD, COMP - same as R62 


Ref 


-130 


R63 


5001101 


E 


RESISTOR, FXD, COMP -3.6 ohms, 
1/2W, ±5% 


1 


-131 


R54 


5002081 


E 


RESISTOR, FXD, COMP - 510 ohms, 

IW, ±5% 


1 


-132 


R57 


5001112 


E 


RESISTOR, FXD, COMP - same as R21 


Ref 


-133 


Q19 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 


-134 


R61 


5001102 


E 


RESISTOR, FXD. COMP - 3.9Kohms, 
1/2W, ±5% 


1 




C23 


4001061 


E 




CAPACITOR, FXD - 50 |jlF, 50V 
Sprague type TE 


1 



4-31 



PART II 
AULT POWER SUPPLY, MODEL PR-130 



Part II contains two sections presenting the assennbly description and illustrated 
parts breakdown for Ault Model PR-130. Two versions of this power supply were manu- 
factured per Honeywell SCD No. 950 061 002; Serial No. through 570, and 571 through 
589. Component differences are presented in Figure 4-22 and listed in Table 4-3. 

SECTION I 
ASSEMBLY DESCRIPTION 

This section presents the theory of operation, maintenance, troubleshooting procedure 
and adjustments for Model PR-130 Power Supply. 

Model PR-130 Power Supply is designed to provide operating voltages for the H316 
computer as follows: 

24 Vac 1 annpere 

+ 6.5 Vdc 8-20 amperes 

-6 Vdc 1 ampere (max) 

+ 15.5 Vdc 0.2-5 amperes 

+ 24 Vdc 2 amperes (max) 

A multiple secondary constant voltage transformer is used to provide these required operat- 
ing potentials using an input line of 95 to 130 Vac at either 60 or 60 Hz. Logic circuitry is 
included in the power supply to control the turn on procedure. Circuit protection devices 
include fuses, a low line voltage sensing circuit, and a thermostat switch. 

PHYSICAL LAYOUT 

The Power Supply measures approximately 17 inches wide by 17 1/2 inches deep by 
5 inches high, and it is available for mounting with either the rack-mounted or table top 
computer configuration. The table top configuration uses the power supply as the computer 
base, with the mainframe hinged to the top of the power supply. The rack-mounted con- 
figuration places the power supply below the mainframe and separately attached to the 
mounting rack. Cooling is provided by a built in fan and four connectors are used for input 
and outpit voltages. 



4-33 



THEORY OF OPERATION 

The Power Supply converts ac input power into four regulated dc outputs and one 
nonregulated 24 Vac output. A block diagram of the power supply is shown in Figure 4-13. 
Input ac power is supplied to a constant voltage transformer in the input power converter. 
Three secondaries of the constant voltage transformer provide the +6.5V, -6V and +24V 
output voltages. The +24V winding also provides bulk ac power to a series regulator which 
regulates the +15. 5V output voltage. A fourth secondary provides the 24 Vac output. The 
logic circuitry provides the required sequencing, line sensing and overvoltage protection. 
Reverse diodes are included across each output to prevent accidental reversal of polarity. 

Input Power Converter 

Input ac power is supplied to the primary of constant voltage transformer Tl. (Refer 
to Figure 4-14). Thermostat switch SI interrupts ac power if the ambient temperature 
reaches an unsafe operating level. A3A is the input ac fuse. The outputs of three secondaries 
of Tl are rectified and filtered to provide the +6.5V, -6V, and +24V outputs as well as 
several other required bulk dc sources. A fourth secondary of Tl provides the unregulated 
24 Vac output. Capacitor C17 is used in combination with a winding of T 1 to resonate the 
transformer at the line frequency and provide the constant voltage characteristic. All the 
windings are tapped to allow change over between 50 and 60 Hz line operation. Transformer 
T2 is used by the line sense circuitry to monitor the input ac line. 

Reference Voltages 

Figure 4-15 shows the positive and negative reference sources required by the +15. 5V 
turn-on delay circuit and the +15. 5V overvoltage circuit. The rectified voltage from A2 is 
filtered by R2 and C2 and applied to zener diode CR6, which provides the positive reference 
voltage. Similarly, the rectified voltage from CR3 and CR4 is filtered by Rl and CI and 
applied to zener diode CR5, which provides the negative reference voltage. 

+ 15. 5V Series Regulator 

The +15. 5V series regulator and the turn- on control circuitry for the +15. 5V output is 
shown in Figure 4-16. 

Turn-on Control. -- The turn-on control circuitry is indicated by the dashed lines in 
Figure 4-16. Whenever Q6 is on, Q7 is on, which provides a drive current source for the 
+ 15. 5V series regulator. In this condition Q12 is also on, preventing CR12 from conducting. 
Whenever Q6 is turned off, however, Q7 is also turned off, removing the drive current to 
the +15. 5V series regulator, and turning it off. It also turns Q12 off, which causes CR12 to 
conduct. This fires the crowbar SCR in the +15. 5 V overvoltage circuit, which shuts down the 
15. 5V output. During initial turn- on of the supply, this circuit attempts to fire the crowbar 
SCR, which would prevent turn-on. However, since no output voltage is present then, the 
crowbar SCR cannot turn on. 



4-34 



INPUT 

A-C 

POWER 



INPUT 
POWER 
CONVERTER 



qA-c outlets 

B38 AND B4B 



SERIES 
REGULATOR 



LOGIC 
CIRCUITRY 



♦-♦•+6.5V® 20A 



REVERSE 
DIODE 



REVERSE 
DIODE 



REVERSE 
DIODE 



REVERSE 
DIODE 



-6V@ lA 

24 VAC (5) I A 
+ 24V©2A 



+ 15.5V (5) 5A 



REMOTE TEMP. 
SENSE 



POWER STATUS 
INDICATOR 



FAULT 
SIGNAL 



5768 



Figure 4-13. Power Supply Block Diagram 



4-35 



E SENSE INPUT 




CONNECTIONS SHOWN 
ON TB3 AND TB4 FOR 
60 HZ OPERATION 

DASHED LINES SHOW 
CONNECTIONS FOR 
50 HZ OPERATION 



t— O +6.5V OUTPUT 



COMMON 
O -6V OUTPUT 



+24V OUTPUT 
a BULK DC 
FOR LOGIC 

BULK DC FOR 
+ 15.5V REG. 



+ REFERENCE 
VOLTAGE 

<5 BULK DC FOR 
- REFERENCE 
VOLTAGE 



5772 



CR4 



Figure 4-14. Input Power Converter 



4-36 



_A2_ 



O — f 



*i 



-vw 




0+ REF. 



CR3 Rl 

-H f-VVAr 



CR4 






R4 



« O-REF. 



CR5 



@ 



^ 



Figure 4-15. Positive and Negative Reference Sources 



+ 24V 



R7I ^M R3I 



Qrn 



RZ4 QIO. 



+ 15. 5V 
-' »— O OUTPUT 




FROM +I5.SV 
TURN-ON 
CIRCUIT 



Figure 4-16. +15. 5-Volt Series Regulator 



4-37 



Series Regulator Operation. - - The output voltage appears across a voltage divider 
consisting of R36, R37, R38 and R39. and an external temperature programming resistor. 
The wiper voltage of R37 is compared to the reference voltage across zener diode CRll by 
transistor Q8. Q8 controls the series regulator by shunting a portion of the base drive 
current for Q9 (provided by R23) away from Q9. (It is assumed that the turn-on control 
circuitry has already indicated turn-on). Q9 in turn controls the conductivity of QIO and the 
pass transistor, Qll, which controls the load current. 

Current limiting is provided by the circuit consisting of R31, R34, R35, and Q13. 
The current level is sensed by R31. The voltage across R31 is compared to a fixed voltage 
across R34 by transistor Q13. Whenever the maximum allowed current is reached, the 
voltage across R31 exceeds the voltage across R34. This causes Q13 to conduct, shunting 
away a portion of the base drive current for Q9, thus reducing the load current. The over- 
load characteristic is shown in Figure 4-17. 



OUTPUT 
VOLTAGE 



OVERLOAD 



REGULATION 
BAND 




LOAD 
CURRENT 



5769 



SHORT CIRCUIT 



Figure 4-17. Output Voltage/Current Overload Characteristic 



4-3J 



Reverse Diodes 

Diode assembly SCDA-1 (A4) is connected across the +6.5V and -6V line: while SCNA-1 
(A5) is connected across the +24V and +15. 5V outputs respectively, to prevent accidental 
reversal of polarity in excess of two volts on any of these outputs. 

Logic Circuitry 

The logic circuitry consists of a line sense circuit, a + 15.5V turn-on delay circuit 
and an overvoltage circuit for the +15. 5V output. 

Line Sense Circuit. -- The line sense circuit (refer to Figure 4-18) initiates turn-off 
of the power supply if ac input voltage is below allowable limits. 

The ac input voltage is sensed by transformer T2. The secondary voltage is full-wave 
rectified by CR15 and CR 1 6 to provide an unfiltered dc voltage across R46, R47 and R48. 
R47 is adjusted so that, when the peak ac input voltage rises above the low line limit, Q17 
will be turned on until the ac input drops to normal again. 

At the beginning of each half-cycle, C12 begins to charge at a rate determined by G12, 
R55 and the fixed reference voltage across zener diode CR19. Whenever C12 charges to 
the predetermined level, CR20 conducts, which causes SCR CR22, to fire. The charge rate 
is determined so that, if the ac input voltage is at low line or above, Q17 will be turned on 
due to the line sense voltage before C12 has charged to the level which causes CR20 to 
conduct. Transistor Q16 is held on by the full-wave rectified voltage at all times except for 
a short period as the ac input voltage passes through zero volts. At this time, Q16 turns on 
and discharges C12 to reset the line sense circuit. 

Under normal ac input voltage conditions, Q17 clamps the gate of CR22 before it is 
fired (Figure 4- 19 shows waveforms of the cathodes CR 17* and CR20). However, if the ac 
input voltage fails to reach the low line level for one half-cycle, CR22 is fired, and the 
following sequence occurs: 

a. Coupling diode CR21 conducts, turning Q5 on, which activates the relay trip coil 
on the external input circuit breaker. 

b. Coupling diode CR23 also conducts, drawing current through R57 away from zener 
diode CR24. This turns CR24 off, which then turns Q18 off. After a short period, C14 charges 
sufficiently to cause zener diode CR25 to conduct and fire crowbar SCR CR14 in the +15. 5V 
overvoltage circuit. 

c. Coupling diode CR26 also conducts, drawing current through R61 away from zener 
diode CR27, turning CR27 off, which then turns Q19 off. Relay Kl becomes deenergized and 
grounds the power status terminal. It also prevents CR29 from conducting, which turns 
CR30 and Q20 on. This causes the fault signal to appear (drop to ground). 

In summary, whenever the ac input voltage fails to reach the low line limit for one 
half-cycle, the fault signal appears, the external input breaker is opened, the power status 
terminal is grounded, and, after a short time delay period, the +15. 5V output is crowbarred. 



*For Serial No. through 570 operation only. 

4-39 



+24V 
O 



T2 



CRI5 



j: m 



CRI6 



1 



>R67 



:cii 



.R52 



R5 



CIO 



QI6_ 



R46> ?R49 



R475-*- 
R48< 



CRI7 * 



RI2< 



R54; 



CR2I Rll 

— M V^V- 



:c4 



€L 



TO RELAY TRtP 
-O COIL ON INPUT 
BREAKER 



>R57 



CR23 



R5S: 



017 R53 



^^O^' 



CRI8 



CR20 



^n 



>RS6 



:ci2 



.CI3 



>^R60 



CR24 



R59 
PI8 




1 /— >P''25 



CR22 



$ 



CR26 



/^ ~^CRI9 



^:_y 



T0+I5.5V 
-O OVERVOLTAGE 
CROWBAR GATE 



:ci4 



Kl 



^ 



-O POWER STATUS SIGNAL 



>R6I 



CR27 



^ 




CR28 



CR29 



>R6Z 



CR30 



^ N * H 



QI9 



:R62 




R65 



020 



-O FAULT SIGNAL 



0CR31 



* * * O COMMON 



-O COMMON 



*CR17 is replaced with resistor R76 for Serial No. 570 and beyond. 
**R51 is omitted for Serial No. 570 and beyond. 



Figure 4-18. Line Sense Circuit 



4-40 



CRI7 CATHODE 



CR20 CATHODE 



5844 




Figure 4-19. Line Sense Circuit Waveform 



+ 15. 5V Tu rn- on Delay Circuit. -- The +15. 5V turn-on delay circuit (Refer to Figure 
4-20) ensures that the +15. 5V output is not allowed to turn on until the ±6V output voltages 
have both reached 90% of nominal. 



+ 6.5V 
OUTPUT 
O 



-6V 
OUTPUT 
Q 



+ REF 
O 



:r6 



A 



R7 



R5 
-REFO — VW — ♦ 1 



Ql 



■R8 



R9 



Q2 



CR7 





:rio 



.C3 



* * * ^ 



•Ri7 



« f- 



.RI4 



RI3: 



CR8 



p 



Q3 



RI6 

Q4 



o 




« •■ 



023 CR9 

e 



TO +I5.5V 
" O REGULATOR 



•R9 



♦ * *' • O COMMON 



5774 



Figure 4-20. +15.5-Volt Turn-On Delay Circuit 



4-41 



The +6.5V output determines the current through resistors R6 and R7. This current is 
compared to the current through R5, which is determined by the negative reference voltage. 
Whenever the +6. 5V output reaches its minimum allowed level, the current through R6 and R7 
exceeds the current through R5, turning Ql on, clamping Q2 off and allowing zener diode CR9 
to conduct. 

Similarly, the -6V output determines the current through R14 and R15. This current is 
compared with the current through R13, which is determined by the positive reference 
voltage. Whenever the -6V output reaches its minimum allowed level, the current through 
R14 and R15 exceeds the current through R13, turning Q3 off, turning Q4 off, and allowing 
zener diode CR9 to conduct. 

Whenever both the +6.5V and -6V outputs are above their minimum allowed levels, Q2 
and Q4 are both off, and zener diode CR9 conducts to provide a turn-on signal for the +15. 5V 
regulator. However, if either the +6.5V or -6V output is below its minimum allowed level, 
CR9 does not conduct. This removes the turn-on signal for the +16. 5V regulator, which 
turns off the regulator and crowbars the +15. 5V output. 

+ 15. 5V Overvoltage Circuit. -- The +15. 5V overvoltage circuit (refer to Figure 4-21) 
crowbars the + 15.5V output via SCR CR14 whenever the + 15.5V output exceeds its maximum 
allowed level or whenever a shut-down signal is received from the +15. 5V regulator or the 
line sense circuit. 



INPUT FROM 
+ I5.5V REG. O- 
a LINE SENSE 




4-I5.5V 
^ OUTPUT 



O COMMON 



5773 



Figure 4-21. + 1 5. 5-Volt Overvoltage Circuit 



4-42 



The +15. 5V output determines the current through R40 and R41. This current is 
compared with the current through R66, which is determined by the negative reference 
voltage. Whenever the +15. 5V output exceeds its maximum allowed level, the current 
through R40 and R41 exceeds the current through R66. This turns Q14 on, which turns Q15 
on. This fires crowbar SCR CR14, which clamps the +15. 5V output voltage to a low level. 
This circuit is also activated in the same manner whenever the +15. 5V regulator or the line 
sense circuit provides a positive signal at the base of Q14. 

MAINTENANCE 

The only routine maintenance required for the power supply is periodic cleaning or 
replacement of the air filter. Adjustment procedures, a trouble shooting chart and interface 
connection data are described in the following paragraphs. 

R eplacement Parts 

Replacement parts can be purchased directly from Honeywell Inc., Framingham, 
Mass. However, most of the components are standard electrical parts and might be 
obtained locally in less time. 

Recommended Test Instruments 



The following test instruments will be helpful in testing and adjusting the power supply: 

Voltmeter, ac/dc 
Ammeter, ac/dc 
Card Extender 



Troubleshooting Procedure 

Use every safety precaution when troubleshooting the power supply. The supply should 
be visibly examined for broken, loose or damaged parts, or wire and foreign objects. In 
the event of an audibly or visually apparent malfunction, proceed directly to the affected area 
and perform the necessary repairs. Apparent circuit board failure may be caused by im- 
properly adjusted potentiometers. This should be kept in mind when troubleshooting the 
power supply. 

WARNING 

The input transformer produces voltage in excess of 
600 volts. Exercise extreme caution whenever the 
power supply cover is off. Remove any rings, watches 
or other metallic objects before installation or testing. 
Avoid contact with heat sinks or the input transformer, 
which operate at high temperatures. 



4-43 






r 



1~-; 



Xt 



^ 



I ^x s 



m 



r^ 



1 



; \Ji 



A" 

A- 
A" 

A- 




'." 



M* A •-■>•••« 



— "^ 1— 






— *— WVi— 



i: :l I SCI 



CO 10 »« H« I. 



tI? O-^ 



t™ O 



A 




d^' 



^ 



^" iv 



^~ 



I— u 



[^ 



Figure 4-22. Power Supply 
Schematic Diagram 



4-45 



Perform the following preliminary checks before troubleshooting the unit: 

a. Remove any foreign objects from the power supply. 

b. Since the power status signal is provided by a mercury relay, the power supply 
must be placed in an upright position to ensure proper operation. 

c. Check all input and output connections. 

d. Check the remote temperature sensing device connection. 

e. Check for proper connections for 50 or 60 Hz operation 



Table 4-2. 
Troubleshooting Guide 



SYMPTOM 



Power supply 
will not turn on. 



No +15. 5V out- 
put voltage. 



POSSIBLE CAUSE 



Low +15. 5V out- 
put voltage. 



Overvoltage 
occurs on +15. 5V 
output. 



False indication 
at power status 
terminal. 



a. No input ac power. 

b. Open thermostat SI. 

c. Blown fuse AlA or A3A 



SUGGESTED ACTION 



Low ac line voltage. 
Faulty or misadjusted 
line sense circuit 
under low ac line 
condition. 

Undervoltage on +6. 5V 
or -6V output. 
Shorted output. 

Faulty or misadjusted 
turn-on delay circuit. 

Improper adjustment. 
Blown fuse A4A 
Overloaded output. 

Misadjusted over- 
current limit. 

Misadjusted output. 

Shorted pass transistor 

Oil. 

Misadjusted overvoltage 

circuit. 



Power supply not in up- 
right position. 



a. Check for input power. 

b. Check for proper cooling. 

c. Check fuses. 



d. 
e. 



Check for faulty signal. 
Check ac line level and 
line sense circuit 
adjustment. 



Check +6. 5V or -6V levels. 

Check with external loads 

removed. 

Check turn-on delay circuit. 



Check output adjustment. 

Check fuse. 

Check with external load 

removed. 

Check adjustment. 



Check adjustment. 
Check Qll. 

Check adjustment of over- 
voltage circuit: Overvoltage 
may not be actually occuring. 



a. Check position of supply. 



4-47 



ADJUSTMENTS 

50 or 60 Hz Operation Adjustment 

Several tap changes are required on transformer Tl to convert from 60 Hz to 50 Hz 
operation. Figure 4- 14 shows the correct wiring for 60 Hz operation. The dashed lines 
show the changes required for 50 Hz operation. Changing frequency oper ation also requires 
readjustmen t of the line sense circuit. 

Output Voltage Adjustments. 

The +15. 5V output is controlled by potentiometer R37 (clockwise rotation increases the 
output voltage level). The +6. 5V output is controlled by potentiometers R72 and R74. The 
-6V output is adjusted by wirewound resistor R80 or R81. The Power Supply is normally 
delivered with R81 connected as the -6V adjustment. However, R80 must be used if the -6V 
cannot be adjusted using R81. In this case, the lead at point A, R81, must be moved to point 
B, R80. (See Figure 4-29.) 

+ 15. 5V Overvoltage Adjustment 

The +15. 5V overvoltage adjustment is controlled by potentiometer R41. Proceed as 

follows: 

a. Turn R41 (maximum overvoltage setting) fully clockwise. 

b. Apply input ac power. 

c. Adjust the +15. 5V output voltage to the desired overvoltage setting (18V) with 

the output voltage adjustment potentiometer R37. It may be necessary to replace the external 
thermistor with a decade box to reach this level. 

d. Slowly turn R41 counterclockwise until the +15. 5V output voltage drops to zero. 

e. Remove input ac power. 

f. Replace the external thermistor if it had been removed. 

g. Turn R37 fully counterclockwise. 
h. Apply input ac power. 

i. Set the +15. 5V output voltage to the desired operating level. 

+ 15. 5V Overcurrent Adjustment 

Adjust the overload bendback point with potentiometer R34 using the following procedure: 

a. Turn R34 fully clockwise. 

b. Apply a load to the +15. 5V output equal to the desired overcurrent setting. 

c. Apply input ac power. 

d. Slowly turn R34 counterclockwise until the +15. 5V output voltage starts to drop. 

e. Remove input ac power and remove the load. 



4-4^ 



Line Sense Circuit Adjustment 

The line sense circuit is adjusted by potentiometer R47. This adjustment is required 
whenever a change is made between 50 Hz and 60 Hz operation. Proceed as follows: 

a. Turn R47 fully clockwise. 

b. Apply 95 Vac (low line) to the input power term^inals. 

c. Slowly turn R47 counterclockwise until the fault signal appears. 

d. Remove input ac power. 

+ 6. 5V or -6V Undervoltage Adjustment 

The +15. 5V turn-on delay circuit contains +6.5V or -6V undervoltage sensors. 
These sensors have been adjusted at the factory and should normally require no adjust- 
ment. However, if adjustment should become necessary, proceed as follows: 

+ 6. 5V Output Adjustment Procedur e 

a. Turn R7 fully counterclockwise. 

b. Disconnect the lead from connector Jl-H to capacitor C18 (positive terminal) 
at the capacitor. 

c. Connect the disconnected lead to a positive voltage source of the desired under- 
voltage level. 

d. Apply input ac power. 

e. Slowly turn R7 clockwise until the +15. 5V output drops to zero. 

f. Remove input ac power. 

g. Remove the external voltage source and reconnect the lead to C18. 

-6V Output Adjustment Procedu re 

a. Turn R15 fully counterclockwise. 

b. Disconnect the lead from connector Jl-J to capacitor C20 (negative terminal) at 
the capacitor. 

c. Connect the disconnected lead to a negative voltage source of the desired under- 
voltage level, 

d. Apply input ac power. 

e. Slowly turn R15 clockwise until the +15. 5V output drops to zero. 

f. Remove input ac power. 

g. Remove the external voltage source and reconnect the lead to C20. 



4-49 



CONNECTOR INTERFACE DATA 

All inputs and outputs are made via the four connectors on the power supply. The pin 
connections are tabulated below. The connector number precedes the pin number; for 
example, B2A-A refers to pin A or connector B2A. 

Terminal Identification 

BIB AC Input Powe r 

B2A-A +24 Vdc Output 

B2A-D Common 

B2A-F To relay trip coil on circuit breaker 

B2A-H To relay trip coil on circuit breaker 

B2A-J +6. 5 V Output 

B2A-M From input circuit breaker 

B2A-N From input circuit breaker 

B2A-P From input circuit breaker 

B2A-S From input circuit breaker 

B2A-R To Fan 

B2A-U To Fan 

B2A-T To input circuit breaker 

B2A-V To input circuit breaker 

B2A-W To input circuit breaker 

B2A-X To input circuit breaker 

B2B-YEL 24 Vac Output 

B2B-RED +6-6 Vdc Output 

B2B-BLK -6 Vdc Output 

B2B-WHT Common 

B3B Ac outlet, non^used 

B4B Ac outlet, fused 

B2C-A +24 Vdc Output 

B2C-B +15. 5 Vdc Output 

B2C-C Comnaon 

B2C-D Common 

B2C-E Common 

B2C-F Line fault signal 

B2C-H +^-5 Vdc Output 

B2C-J B2C-J 

B2C-K B2C-K 

B2C-M Temperature sense element 

B2C-N Temperature sense element 

B2C-P "^ Vdc Output 

B2C-R Power status terminal 

B2C-S +6.5 Vdc output 



4-50 



SPECIFICATIONS 

Input Power 

95-130 VRMS, 50 or 60 Hz ± 1 Hz, single phase. 

Output Power 



Output 
Voltage 


Current 
Range 

- 2A 


Regulation 
Band 


Set 
Current 

1. 5A 


Ripple 

(p-p) 


+ 24 Vdc 


±5%* 


5% 


+ 15. 5 Vdc 


-.2 - 5A 


±5% 





2% 


+ 6.5 Vdc 


8 - 20A 


±6%* 


15A 


2% 


-6 Vdc 


- lA 


±6%* 


0. 5A 


2% 


24Vac 


- lA 





- _ — - 






--Regulation of +24V, +6.5V and -6V includes static line voltage changes (at set 
current) and ripple only. 

Adjustment Range 

The +15. 5V output is adjustable to nominal. 

Temperature Compensation 

The +15. 5V output is remotely controlled by a temperature sensing device (Honeywell 
P/N 70 932 305 001) at a nominal rate of -0.5% per °C from 0-60''C. The bandwidth allowed 
is ±4% deviation from linearity below 25 °C and ±2% deviation from linearity above 25 °C. 

Overvoltage Protection 



Turn-on and turn-off will not cause the + 15.5V output to exceed 18V nor the +6.5V and 
-6V outputs to exceed nominal by more than 20%. 

An overvoltage crowbar circuit prevents the +15. 5V output from exceeding 18V in the 
event of a regulator component failure. 

Overcurrent Protection 



Fuses are provided for input ac power, the internal fan, bulk dc power for the +15, 5V 
regulator and two ac auxiliary outputs. Current limiting circuitry is incorporated in the 
+ 15. 5V regulator. 

Output Voltage Reversal 

Reverse diodes are included across each dc output to prevent any voltage from reversing 
polarity by more than 2. volts. 



4-51 



The rmal Cutout 

A thermal cutout is included to remove input ac power to the power supply if unsafe 
temperature is exceeded. 

Operating Temperature 
- 60°C. 

Efficiency 

50% or greater when fully loaded. 

Turn-on Turn-off Sequencing 

The following turn-on and turn-off sequencing is provided under all rated load 

conditions: 

1. During turn-on, the +15. 5V output will not rise above 20% of nominal until the 

+ 6.5V and -6V outputs are above 90% of nominal. The +6. 5V and -6V outputs are 
energized when power is applied. 

2. During turn-off, the +6.5V and -6V outputs shall remain above 90% of nominal 
until the + 15.5V output drops below 20% of nominal. 

3. A +5 to +6 volt fault signal rated at 10 mA is provided whenever input ac power 

is within acceptable limits. The + 15. 5V output will remain within regulation for a 
minimum of 1.0 ms after loss of this signal, and the +6.5V and -6V outputs will 
remain in regulation for at least 2 ms. 

4. The fault signal will fall to ground level within l/2 cycle of the loss of input ac 
power. Removing the fault signal also trips the input ac circuit breaker. 



4-52 



Fig. & 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-24- 


A3 


950061002 


C 


POWER SUPPLY - AULT Mfg. No. 
PR -130 


Ref 


-1 


A5A 


6221082 


D 


FUSE, CARTRIDGE - 3 A 


1 


-2 


AlA 


6221293 


D 


FUSE, CARTRIDGE - 3 A, Slo-BIo 


1 


-3 


A2A 


6221294 


D 


FUSE, CARTRIDGE - lOA, Sio-Blo 


2 


-4 


A3A 


6221294 


D 


FUSE, CARTRIDGE - Same as A2A 


Ref 


-5 


A4A 


62211002 


D 


FUSE, CARTRIDGE - 7 . 5A 


1 


-6 


R74 


580-84001 


D 


RESISTOR, VARIABLE, WIREWOUND - 
0. 11 ohms, 50W ±10% 


2 


-7 


R72 


580-84001 


D 


RESISTOR, VARIABLE, WIREWOUND - 
Same as R74 


Ref 


-8 


C17 


4061414 


D 


CAPACITOR, FXD: 6 |j.F, 660V 


2 


-9 


TB4 


6201601 


D 


TERMINAL BOARD - barrier type 


2 


-10 


LI 


3021285 


D 


CHOKE 


1 


-11 


C19 


4001278 


D 


CAPACITOR, ELECTROLYTIC - 
100, 000 |jiF, lOV 


3 


-12 


C21 


4001283 


D 


CAPACITOR, ELECTROLYTIC - 
50, 000 fiF, 32V 


1 


-13 


C18 


4001278 


D 


CAPACITOR, ELECTROLYTIC - 
Same as C19 


Ref 


-14 


R69 


6804601 


D 


RESISTOR, FXD, WIREWOUND - 
15 ohms, 5W±10% 


1 


-15 


C20 


4001278 


D 


CAPACITOR, ELECTROLYTIC - 
Same as C19 


Ref 


-16 


R68 


5003054 


D 


RESISTOR, FXD, FILM - 39 ohms, 
2W, ±5% 


1 


-17 


R70 


5003083 


D 


RESISTOR, FXD, FILM - 620 ohms, 
2W, ±5% 


1 


-18 


TB2 


6201601 


D 


TERMINAL BOARD - same as TB4 


1 


-19 


C22 


4001540 


D 


CAPACITOR, FXD, ELECTROLYTIC - 
125 hlF, 25V 


1 


-20 


A4 


60611601 


D 


DIODE ASSEMBLY - Type SCDAl 


1 


-21 


A5 


60610971 


D 


DIODE ASSEMBLY - Type SCNAl 


1 


-22 


A3 


0802583 


D 


CIRCUIT CARD ASSEMBLY (See Figure 
4-12 for breakdown) 


1 


-23 


T2 


3011428 


D 


TRANSFORMER 


1 


-24 


TB3 


6201158 


D 


TERMINAL BOARD - barrier type 


1 1 


-25 


Bl 


6281011 


D 


FAN, AXIAL 


1 


-26 


Tl 


3011522 


D 


TRANSFORMER, CONSTANT VOLTAGE 


1 


-27 


TBI 


6201132 


D 


TERMINAL BOARD - barrier type; C-J 
type 2-140 


1 



4-55 



Fig. h 

Index 

No. 



Desig- 
nation 



Part No. 



Inden- 
ture 



Description 



Oty 

per 

Ass 'y 



4-24 



-28 
-29 
-30 
-31 

-32 



CR36, 
CR37* 

A2* 

CI 6* 

R71* 

BIB 

B2C 

B2A 

B2B 

B3B. B4B 



60311881 

6061001 
4061171 

58078805 



62012401 

62012401 



62015502 



D 
D 

D 

D 

D 

D 

D 

D 



SEMICONDUCTOR DEVICE, DIODE - 
type 40HF5 

DIODE - Assembly type SCPAl 

CAPACITOR, FXD, ELECTROLYTIC - 
0. 1 fjLF, 600V 

RESISTOR, FXD, WIREWOUND - 
0.5 ohm, 50W 10% 

CONNECTOR, AC, PWR - Hubbell P/N 
8486 

CONNECTOR, RECEPTACLE, ELEC - 
Burndy type, MS20RM58 

CONNECTOR, RECEPTACLE, ELEC - 
Same as B2C 

CONNECTOR, RECEPTACLE - consisting 
of 5 contacts: two DC2025 yellow; one 
DC2025 red; one DC2025 black; one 
DC2025 white, Heyco type 

CONNECTOR, RECEPTACLE, ELEC - 
2 section w/2 female parallel contact 
and 1 gnd pin contact, Hubbell type 5262 



Ref 



*Not shown 



4-56 



20 21 



22 23 24 25 




49 48 47 46 45 44 43 



Figure 4-25. Printed Circuit Card (Part 1 of 2) 



4-57 



91 92 93 94 95 96 



71-0042 




138/ 136 135 134 133 



137 



Figure 4-25. Printed Circuit Card (Part 2 of 2) 



4-5! 



Fig. k 

Index 

No. 



4-25 



-1 
-2 

-3 

-4 

-5 

-6 
-7 



-10 
-11 
-12 

-13 

-14 
-15 

-16 
-17 
-18 

-19 

-20 
-21 

-22 
-23 

-24 

-25 
-26 
-27 



Desig- 
nation 



AULT 
Mfg. Co. 
Part No. 



A3 

CR23 

CR22 

C13 
CR21 

CR20 

CU 
C14 
C12 
CR25 

C9 
C8 
CR14 

CR13 

C6 
CR12 

SI 

C15 

C23 

CR5 

C5 
CR8 

C3 
CR7 

CR6 

C2 
CI 
CR4 



0802583 

6032201 

6001072 

4061239 
60312201 

60511002 

4001069 
4041018 
4041018 
60511002 

4061138 
4061239 
6001038 

6052201 

4001542 
6032201 

62610945 

4061239 

4001961 

6051215 

4061239 
60312201 

4061239 
60312201 

6051215 

4001539 
4001539 
60312201 



Inden- 
ture 



D 

E 

E 

E 
E 



E 
E 
E 
E 

E 
E 

E 

E 

E 

E 

E 

E 
E 



E 

E 

E 

E 



E 
E 
E 



Description 



Qty 

per 

Ass 'y 



CIRCUIT CARD ASSEMBLY (Refer to 
Figure 4-24-22 for NHA) 

SEMICONDUCTOR DEVICE, DIODE - 
type lODl 

SEMICONDUCTOR DEVICE, DIODE - 
SCR type C106F1 

CAPACITOR - 0.001 fxF, 500V 

SEMICONDUCTOR DEVICE. DIODE - 
same as CR23 

SEMICONDUCTOR DEVICE, DIODE - 
type 1N753A 

CAPACITOR - 2 fxF, 50V 

CAPACITOR - 1.0 fiF. 50V 

CAPACITOR - same as C14 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR20 

CAPACITOR - 0.047 |j,F, 200V 

CAPACITOR - same as C13 

SEMICONDUCTOR DEVICE, DIODE - 
SCR type C20U 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR23 

CAPACITOR - 10 laF, 35V 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR23 

THERMOSTAT 

CAPACITOR - same as C13 

CAPACITOR, FXD - 50 \xF, 50V 
Sprague Type TE 

SEMICONDUCTOR DEVICE, DIODE - 
type 1N4733A 

CAPACITOR - same as C13 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR23 

CAPACITOR - same as CI 3 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR23 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR5 

CAPACITOR - 300 m.F, 15V 

CAPACITOR - same as C2 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR23 



Ref 

12 

1 

6 
1 



1 

2 

Ref 

Ref 

1 

Ref 

1 

Ref 

1 
Ref 

1 

Ref 

1 



Ref 
Ref 

Ref 
Ref 

Ref 

2 

Ref 

Ref 



4-59 



Fig. k 
Index 

No. 



Desig- 
nation 



-28 

-29 

-30 

-31 

-32 
-33 

-34 

-35 

-36 

-37 

-38 

-39 

-40 
-41 
-42 

-43 

-44 

-45 

-46 

-47 

-48 

-49 

-60 

-51 
-52 



CR3 

CR2 

CRl 

CRll 

C7 
CRIO 

CR9 

CR15 

CRl 6 

CR18 

CR17 

CR19 

CIO 

C4 

CR31 

Kl 
CR30 

CR29 

CR28 

CR24 

CR27 

CR26 

R62 

R58 
R53 



AULT 
Mfg. Co. 
Part No. 



60312201 

6031301 

6031301 

605110037 

4061132 
6032201 

605110030 

6031171 

6031171 

60312201 

605110020 

60611028 

4061142 
4061239 
605110020 

6241104 
60312201 

60312201 

60312201 

606110030 

605110030 

60312201 

5001105 

5001105 
6001061 



Inden- 
ture 



E 

E 

E 

E 

E 
E 

E 

E 

E 

E 

E 

E 

E 
E 
E 

E 
E 

E 

E 

E 

E 

E 

E 

E 
E 



Description 



Qty 

per 

Ass'y 



SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE 2 

type 1N4816 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR2 

SEMICONDUCTOR DEVICE, DIODE - 1 

type 1N751A 

CAPACITOR - 0.001 h-F, 200V 1 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - 4 

type 1N746A 

SEMICONDUCTOR DEVICE, DIODE - 2 

type IN 64 5 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR 16 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - 2 

type 1N7 52A 

SEMICONDUCTOR DEVICE, DIODE - 1 

type 1N964B 

CAPACITOR - 0.068 \xF , 200V 1 

CAPACITOR - same as CI 3 Ref 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR 17 

RELAY, MERCURY WETTED 1 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR9 

SEMICONDUCTOR DEVICE, DIODE - Ref 

sanne as CR9 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CR23 

RESISTOR, FXD, COMP - 5. IK ohms, 11 

l/2W, 6% 

RESISTOR, FXD, COMP - same as R62 Ref 

RESISTOR, FXD, COMP - 30 ohms, 2 

1/2W, 6% 



J^See Table 4-3 at end of this section. 



4-60 



Fig. k 

Index 

No. 



Desig- 
nation 



-63 
-54 
-55 

-56 

-57 

-58 
-59 

-60 
-61 

-62 

-63 
-64 

-65 
-66 
-67 
-68 

-69 
-70 
-7 1 
-72 

-73 

-74 

-75 

-76 
-77 
-78 

-79 
-80 

-81 



R60 

R56 

R59 

QI8 
R52 

Q16 
R67 

R49 
R45 

R44 

Q15 
R42 

Q6 
Q14 
R43 
R40 

R41 
R27 

Q8 
R26 

R28 
R29 

R30 

R22 
Q12. 
R35 

Qll 
R33 

QIO 



AULT 
Mfg. Co. 
Part No. 



5001095 

5001088 

5001040 

6011075 
5001119 

6011075 
5001092 

5001105 
5001071 

5001073 

6011151 
5001099 

6011075 



16011075 
5001105 
6403099 

59013526 
5001088 
6011075 
5001081 

5001105 
5001116 

5001096 

5001081 
6011075 
5001100 

6011133 
5001077 

6011133 



Inden- 
ture 



E 

E 

E 

E 
E 

E 
E 

E 
E 

E 

E 
E 

E 

E 
E 
E 

E 

E 
E 
E 

E 
E 

E 

E 
E 
E 

E 
E 



Description 



RESISTOR, FXD, COMP - 2K ohms, 

1/2W, 5% 

RESISTOR, FXD, COMP - IK ohms, 

1/2W, 5% 

RESISTOR, FXD, COMP - 10 ohms, 

1/2W, 5% 

TRANSISTOR - type 2N3569 

RESISTOR, FXD, COMP - 20K ohms, 
1/2W, 5% 

TRANSISTOR - same as Q18 

RESISTOR, FXD, COMP - 1.5Kohms, 

1/2W, ±5% 

RESISTOR, FXD, COMP - same as R58 

RESISTOR, FXD, COMP - 200 ohms, 

1/2W, 5% 

RESISTOR, FXD, COMP - 240 ohms, 

1/2W, 5% 

TRANSISTOR - type 2N3638 

RESISTOR, FXD, COMP - 3K ohms, 

1/2W, 5% 

TRANSISTOR - same as Q18 

TRANSISTOR - same as Q18 

RESISTOR, FXD, COMP - same as R58 

RESISTOR, FXD, FILM - 3K ohms, 
IW, 5% 

RESISTOR, VARIABLE - IK ohm 

RESISTOR, FXD, COMP - same as R56 

TRANSISTOR - same as Q18 

RESISTOR, FXD, COMP - 510 ohms, 
1/2W, 5% 

RESISTOR, FXD, COMP - same as R58 

RESISTOR, FXD, COMP - 15K ohms, 
1/2W, 5% 

RESISTOR, FXD, COMP - 2.2Kohms, 

1/2W, 5% 

RESISTOR, FXD, COMP - same as R26 
TRANSISTOR - same as Q18 

RESISTOR, FXD, COMP - 3. 3K ohms, 

1/2W, 5% 

TRANSISTOR - type MJ2801 

RESISTOR, FXD, COMP - 360 ohms, 

1/2W, 5% 

TRANSISTOR - same as Qll 



Qty 

per 

Ass 'y 



14 
2 

Ref 
1 

Ref 

1 

1 

2 
1 

Ref 

Ref 

Ref 

1 

2 
Ref 
Ref 

2 

Ref 
2 



Ref 
Ref 

1 

2 

1 

Ref 



4-61 



Fig. 8.- 

Index 

No. 



-84 
-85 



Desig- 
nation 



R14 

R18 

Q9 
R25 

Rb6 



57 R15 
18 |Q4 



-103 

-104 
-105 
-106 

-107 

-108 

-109 
-110 
-111 



-89 


Q3 


-90 


R37 


-91 


R16 


-92 


Q2 


-93 


RIO 


-94 


Ql 


-95 


R9 


-96 


R8 


-97 


R7 


-98 


R17 


-99 


R13 


■100 


R6 


■ 101 


R5 


■ 102 


R2 



R3 

Rl 
R4 
R24 

R31 

R32 

R34 
Q13 
R38 



AULT 
Mfg. Co. 
Part No. 



5303086 

5001072 

6011075 
5001057 

5303089 

59013524 

6011151 

6011075 

59013546 

5001116 

6011075 

5001129 

6011075 

5001096 

6001096 

59013524 

5001075 

5303086 
5303086 
5303089 
5003071 

6002060 

5003071 
5002060 
5804602 

5804455 

5001070 

59013524 

6011075 

5303091 



Inden- 
ture 



E 
E 



E 
E 
E 

E 
E 

E 

E 

E 
E 
E 
E 
E 

E 
E 
E 
E 

E 

E 
E 
E 

E 

E 

E 
E 
E 



Description 



RESISTOR, FXD, FILM 
IW, 5% 



820 ohms, 



220 ohms. 



Qty 
per 

Ass 'y 



RESISTOR, FXD, COMP 
1/2W, 5% 

TRANSISTOR - same as Q18 

RESISTOR, FXD, COMP - 51 ohms, 
1/2W, 5% 

RESISTOR, FXD, FILM- 1. IK ohms. 
IW, 5% 

RESISTOR, VARIABLE - 400 ohms 

TRANSISTOR - same as Q15 

TRANSISTOR - same as Q18 

RESISTOR, VARIABLE - IK ohms 

RESISTOR, FXD, COMP - same as R29 

TRANSISTOR - same as Q 1 8 

RESISTOR, FXD, COMP - 51 ohms, 
1/2W ±5% 

TRANSISTOR - same as Q18 

RESISTOR, FXD, COMP - same as R30 

RESISTOR, FXD, COMP - same as R30 

RESISTOR, VARIABLE - same as R15 

RESISTOR, FXD, COMP - 300 ohms, 
1/2W, 5% 

RESISTOR, FXD, FILM - same as R14 

RESISTOR, FXD, FILM - same as R14 

RESISTOR, FXD, FILM - same as R66 

RESISTOR, FXD, COMP - 200 ohms, 
2W, ±5% 

RESISTOR, FXD, COMP - 68 ohms, 
IW, ±6% 

RESISTOR, FXD, COMP - same as R2 

RESISTOR, FXD, COMP - same as R3 

RESISTOR, FXD, WIREWOUND - 5 ohms, 

5W, ±10% 

RESISTOR, FXD, WIREWOUND - 0. 1 ohm 

5W, ±5% 

RESISTOR, FXD, COMP - 180 ohms, 
1/2W, ±5% 

RESISTOR, VARIABLE - same as R15 

TRANSISTOR - same as Q18 



RESISTOR, FXD, FILM 
IW, ±5% 



1 . 3K ohms. 



3 
1 

Ref 

1 



3 
Ref 

1 

1 
Ref 
Ref 

1 

Ref 
Ref 
Ref 
Ref 

1 

Ref 

Ref 

Ref 

2 

1 

Ref 

Ref 

1 

1 

1 

Ref 

Ref 
2 



4-62 





Fig. h 

Iniiex 

No. 


Desig- 
nation 


AULT 
Mfg. Co. 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 




-IIZ 


R36 


5303081 


E 


RESISTOR, FXD, FILM - 510 ohms. 
IW, ±5% 


1 




-113 


R23 


5001088 


E 


RESISTOR, FXD, COMP - same as R56 


Ref 




-114 


R39 


5303097 


E 


RESISTOR, FXD, FILM - 2. 4K ohms. 

IW, ±5% 


1 




-115 


R20 


5001105 


E 


RESISTOR. FXD, FILM - same as R58 


Ref 




-116 


Q7 


6011153 


E 


TRANSISTOR - type 2N3644 


2 




-117 


R19 


5001105 


E 


RESISTOR. FXD, COMP - same as R58 


Ref 




-118 


R21 


5001112 


E 


RESISTOR, FXD, COMP - lOK ohms, 
1/2W, ±5% 


3 


▲ 


-119 


R51 


5001112 


E 


RESISTOR. FXD. COMP - same as R21 


Ref 




-120 


R12 


5001105 


E 


RESISTOR. FXD, COMP - same as R58 


Ref 




-121 


R50 


5001119 


E 


RESISTOR, FXD. COMP - same as R52 


Ref 


A 


-122 


R46 


5303092 


E 


RESISTOR, FXD, FILM- 1.5Kohms, 
1/2 W ±5% 


1 




-123 


CR38 


60312201 


E 


SEMICONDUCTOR DEVICE DIODE - 
Same as CR23 


Ref 


A 


-124 


R48 


5303087 


E 


RESISTOR. FXD. FILM - 910 ohms, 
IW, ±5% 


1 




-125 


Q17 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 




-126 


Q5 


6011153 


E 


TRANSISTOR - same as Q7 


Ref 


A 


-127 


R47 


5901125 


E 


RESISTOR, VARIABLE - IK ohms 


1 




-128 


Rll 


5001105 


E 


RESISTOR, FXD, COMP - sameasR58 


Ref 




-129 


Q20 


6011075 


E 


TRANSISTOR - same as Q18 


Ref 




-130 


R55 


5001097 


E 


RESISTOR, FXD, COMP - 2.4Kohms, 
1/2W, 5% 


1 




-131 


R65 


5003083 


E 


RESISTOR, FXD, FILM - 620 ohms, 
2W, ±5% 


1 




-132 


R64 


5001105 


E 


RESISTOR, FXD, COMP - same as R62 


Ref 




-133 


R63 


5001101 


E 


RESISTOR, FXD, COMP - 3. 6K ohms, 
1/2W. ±5% 


1 




-134 


R54 


5002081 


E 


RESISTOR. FXD. COMP - 510 ohms, 
IW. ±5% 


1 




-135 


R57 


5001112 


E 


RESISTOR, FXD, COMP - same as R21 


Ref 




-136 


Q19 


6011076 


E 


TRANSISTOR - same as Q18 


Ref 




-137 


R61 


5001102 


E 


RESISTOR, FXD, COMP - 3.9Kohms. 

1/2W, ±5% 


1 




-138 


R75 


5001064 


E 


RESISTOR, FXD, COMP - 100 ohms, 

1/2W ±5% 


1 



, See Table 4-3 at end of this section. 



4-63 



0-- 



Table 4-3. 
Component Changes Per Serial Num.ber 



Fig & 

Index 

No. 


Serial No. through 570 




Serial No. 571 through 589 




Desig 


Description 


Part No. 


Desig 


Description 


Part No. 


4-25 














-38 


CR17 


SEMICONDUCTOR DEVICE, 
DIODE - Type 1N752A 


605110020 


R76 


RESISTOR, FXD, COMP - 
100 ohms 1/2W ±5% 


5001064 


-119 


R61 


RESISTOR, FXD, FILM - 
lOK, 1/2W ±5% 


5001112 




Not Used 




-122 


R46 


RESISTOR, FXD, FILM - 
1.5K, 1/2W ±5% 


5303092 


R46 


RESISTOR, FXD, FILM - 
2.4K, IW ±5% 


5303097 


-124 


' R48 


RESISTOR. FXD, FILM - 
910 ohms IW ±5% 


8303087 


R48 


RESISTOR, FXD, FILM - 
1. IK, IW ±5% 


5303089 


-127 


R47 


RESISTOR, VARIABLE - 
IK 


5901125 


R47 


RESISTOR, VARIABLE - 
500 ohms 


59013525 



PART III 
AULT POWER SUPPLY, MODELS PR- 136/PR- 143 



Part III contains one section presenting the illustrated parts breakdown and schematic 
diagram for Models PR-136 and PR-143 Power Supplies, manufactured by Ault Inc. per 
Honeywell SCDs 950 061 003 and 950 061 004, respectively. The operation of both models 
(PR-136 and PR-143) is similar to Ault Model PR-130, Therefore, refer to Part II, Section 1, 
for the physical layout, theory of operation, maintenance, troubleshooting procedure, and 
adjustments for Models PR-136 and PR-143 Power Supplies, 




* SCD 950 061 004-REVF 



Figure 4-26. Power Supply, Rack-Mounted Configuration (Part 1 of 2) 



4-65 




mi 

mi 



36 35 34 33 



71-0028 



I 




Figure 4-26. Power Supply, Table Top Configuration (Part 2 of 2) 



4-66 



Fig. h 

Index 

No. 


Desig- 
nation 


AULT 
Mfg. Co. 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-26 




950061003* 


C 


POWER SUPPLY - AULT Mfg No. 
PR136-A1 


Ref 


-1 


ABA 


6221082 


D 


FUSE, CARTRIDGE - 3A 


1 


-2 


AlA 


6221203 


D 


FUSE, CARTRIDGE - 3 A, SIo-Blo 


1 


-3 


A2A 


6221294 


D 


FUSE, CARTRIDGE - lOA, Slo-BIo 


2 


-4 


A3A 


6221294 


D 


FUSE, CARTRIDGE - Same as A2A 


Ref 


-5 


A4A 


62211002 


D 


FUSE, CARTRIDGE - 7.5A 


1 


-6 


C17 


4061414 


D 


CAPACITOR - 6 fiF, 660V 


1 


-7 


R74 


580-84001 


D 


RESISTOR, VARIABLE, WIREWOUND - 
0. 11 ohms 50W ±10% 


2 


-8 


R72 


580-84001 


D 


RESISTOR, VARIABLE, WIREWOUND - 
same as R74 


Ref 


-9 


TB4 


6201601 


D 


TERMINAL BOARD - Barrier Type 


2 


-10 


LI 


3021285 


D 


CHOKE 


1 


-11 


CR36, 
CR37 


60311881 


D 


RECTIFIER - 40 HF5 


2 


-12 


R70 
(Hidden) 


5003083 


D 


RESISTOR, FIXED, COMPOSITION - 
620 ohms, 2W, 5% 


1 


-13 


C18 


4001278 


D 


CAPACITOR - 100,000 jxF, lOV 


3 


-14 


A2 


60610981 


D 


DIODE ASSEMBLY - SCPAl 


1 


-15 


R68 


5003054 


D 


RESISTOR, FIXED, COMPOSITION - 
39 ohms, 2W, 5% 


1 


-16 


C19 


4001278 


D 


CAPACITOR - Same as C18 


Ref 


-17 


R79 


580842023 


D 


RESISTOR, WIREWOUND - 200 ohms, 
low, 10% 


1 


-18 


C20 


4001278 


D 


CAPACITOR - Same as C18 


Ref 


-19 


R69 
(Hidden) 


5804601 


D 


RESISTOR, WIREWOUND - 15 ohms, 5W, 

10% 


1 


-20 


R78 


5003056 


D 


RESISTOR, FIXED, COMPOSITION - 
47 ohms, 2W, 5% 


1 


-21 


C21 


4001283 


D 


CAPACITOR - 50, 000 fxF, 32V 


1 


-22 


TB2 


6201158 


D 


TERMINAL BOARD - Barrier Type 


1 


-23 


C22 


4001540 


D 


CAPACITOR - 175 |jlF, 25V 


1 


-24 


A4 


60611601 


D 


DIODE ASSEMBLY - SCDAl 


1 


-25 


A5 


60610971 


D 


DIODE ASSEMBLY - SCNAl 


1 


-26 


A3 


080253 


D 


CIRCUIT CARD ASSEMBLY 


1 


-27 


T2 


3011428 


D 


TRANSFORMER 


1 


-28 


TB3 


6201158 


D 


TERMINAL BOARD - Barrier Type 


1 


-29 


Bl 


1018418 


D 


FAN ASSEMBLY - Modified 


1 


-30 


Tl 


3011522 


D 


TRANSFORMER 


1 


-31 


TBI 


6201132 


D 


TERMINAL BOARD - Barrier Type 


1 



4-67 



Fig. h 

Index 

No. 


Desig- 
nation 


AULT 
Mfg. No. 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


-32 


BIB 


62015503 


D 


INLET, ELECTRICAL - Hubbell 
Type 5240 


1 


-33 


B2C 


62012401 


D 


CONNECTOR, RECEPTACLE, 
ELECTRICAL - Same as B2A 


Ref 


-34 


B2A 


62012401 


D 


CONNECTOR, RECEPTACLE, 
ELECTRICAL - Burndy Type MS20RM58 


2 


-35 


B2B 


620-1643 (Elk 
620-l644(YeI) 
620-l645(Red) 


D 


CONNECTOR, RECEPTACLE, 
ELECTRICAL - Heyco Type DC202-1 


1 


-36 


B3B, 
B4B 


62015502 


D 


CONNECTOR, RECEPTACLE, 
ELECTRICAL - Hubbell Type 5262 


2 


*-37 


R80 
(not shown) 


580-6553 


D 


RESISTOR, VARIABLE, WIREWOUND 
5 ohms, 25W 


1 


* -38 


RBI 
(not shown] 


580-6557 


D 


RESISTOR, VARIABLE, WIREWOUND 
50 ohms, 25W 


1 


=:= -39 


DSl 
(not shown] 


62S-1033-041 


D 


LIGHT, MINIATURE, HM 550 


1 



*SCD 950 061 004, Rev. F 



4-68 



19 20 21 22 23 24 




48 47 46 45 44 43 42 



71-0041 



Figure 4-27. Printed Circuit Card (Part 1 of 2) 



4-69 



91 92 93 94 95 96 97 




71-0041 



13S 135 134 133 



Figure 4-27. Printed Circuit Card (Part 2 of 2) 



4-70 



Fig. & 

Index 

No. 


Desig- 
nation 


AULT 
Mfg. Co. 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


4-27 


A3 


1802584 


D 


CIRCUIT CARD ASSEMBLY (Refer to 
Figure 4-27 for NHA) 


Ref 


-1 


CR23 


60312201 


E 


SEMICONDUCTOR DEVICE, DIODE - 
Type lODOl 


15* 


-2 


CR22 


6001072 


E 


SEMICONDUCTOR DEVICE, DIODE - 
Type SCR C106F1 


1 


-3 


C13 


406-1239 


E 


CAPACITOR - 0.001 |j.F, 500V 


6 


-4 


CR21 


60312201 


E 


Same as CR-23 


Ref 


-5 


CR20 


60511002 


E 


SEMICONDUCTOR DEVICE, DIODE - 
Zener - Type 1N753A 


2 


-6 


Cll 


4001069 


E 


CAPACITOR - 2 (jlF, 50V 


1 


-7 


C14 


4041018 


E 


CAPACITOR - 1.0 ijlF, 50V 


2 


-8 


C12 


4041018 


E 


CAPACITOR - same as C14 


Ref 


-9 


CR25 


60511002 


E 


Same as CR20 


Ref 


-10 


C9 


4061138 


E 


CAPACITOR - 0.047 |jlF, 200V 


1 


-11 


C8 


4061239 


E 


CAPACITOR - same as C13 


Ref 


-12 


CR14 


6001038 


E 


SEMICONDUCTOR DEVICE, DIODE - 
Type C20U 


1 


-13 


CR13 


60312201 


E 


SEMICONDUCTOR DEVICE - same as 
CR23 


Ref 


-14 


C6 


4001542 


E 


CAPACITOR - 10 H-F, 35V 


1 


-15 


CR12 


4041018 


E 


CAPACITOR - 1.0 M.F, 50V 


2 


-16 

i 


SI 


62610945 


E 


THERMOSTAT 


1 


-17 


C15 


4061239 


E 


CAPACITOR - same as C13 


Ref 


-18 


CR5 


6051215 


E 


SEMICONDUCTOR DEVICE, DIODE - 
Type 1N4733A 


2 


-19 


C5 


4061239 


E 


CAPACITOR - same as C13 


Ref 


-20 


CR8 


60312201 


E 


SEMICONDUCTOR DEVICE - same as 
CR23 


Ref 


-21 


C3 


4061239 


E 


CAPACITOR - Same as C13 


Ref 


-22 


CR7 


60312201 


E 


SEMICONDUCTOR DEVICE - same as 
CR23 


Ref 


-23 


CR6 


6051215 


E 


SEMICONDUCTOR DEVICE - same as 
CR5 


Ref 


-24 


C2 


4001539 


E 


CAPACITOR - 300 |jlF, 15V 


2 


-25 


CI 


4001539 


E 


CAPACITOR - same as C2 


Ref 


-26 


CR4 


60312201 


E 


SEMICONDUCTOR DEVICE - same as 
CR23 


Ref 


-27 


CR3 


60312201 


E 


SEMICONDUCTOR DEVICE - same as 
CR23 


Ref 


-28 
-29 


CR2 
CRl 


6031301 
6031301 


E 
E 


RECTIFIER - 1N4816 
RECTIFIER - same as CR2 


2 

Ref 



*SCD 950 061 004--Change qty 15 to 16. 



4-71 



Fig. & 

Index 

No. 



■ 30 

■ 31 
-32 

■33 

-34 

-35 



Desig- 
nation 



CRll 

C7 
CRIO 

CR9 

CR15 

CR16 



-36 CRli 



*-37 f R76 



CR19 



-39 CIO 



-40 

-41 



C4 
CR31 



-42 ] Kl 
-43 CR30 

-44 

-45 

-46 



CR29 



CR28 



CR24 

( 
t 

-47 I CR27 
-48 I CR26 
-49 R62 



-50 
-51 

-52 

-53 

-54 



R58 
R53 

R60 

R56 

R59 



Part No. 



605110037 

4061132 
60312201 

605110030 

6031171 

6031171 

60312201 

5001064 

605110028 

4061239 
4061239 
605110020 

i 6241104 
! 60312201 

60312201 

60312201 

605110030 

605110030 

60312201 

5001105 

5001105 
5001051 

5001096 

5001088 

5001040 



Inden- 
ture 



E 
E 

E 

E 

E 

E 

E 

E 

E 
E 
E 

E 
E 

E 

E 

E 

E 

E 

E 

E 
E 

E 

E 

E 



Description 



Qty 

per 

Ass'y 



SEMICONDUCTOR DEVICE, DIODE - 1 

Type 1N751A 

CAPACITOR - 0.001 nF, 200V 1 

SEMICONDUCTOR DEVICE - same as Ref 

CR23 

SEMICONDUCTOR DEVICE, DIODE - 3 

Type 1N746A 

SEMICONDUCTOR DEVICE, DIODE - 2 

Type 1N645 

SEMICONDUCTOR DEVICE - same as Ref 

CR15 

SEMICONDUCTOR DEVICE - same as Ref 

CR23 

RESISTOR, FIXED, COMPOSITION - 2 

100 ohms, 1/2W, 5% 

SEMICONDUCTOR DEVICE, DIODE - 1 

Type 1N964B 

CAPACITOR - 0.068 |jiF, 200V 1 

CAPACITOR - same as C13 Ref 

SEMICONDUCTOR DEVICE, DIODE - 1 

Type 1N752A 

RELAY 1 

SEMICONDUCTOR DEVICE - same as Ref 

CR23 

SEMICONDUCTOR DEVICE - same as Ref 

CR23 

SEMICONDUCTOR DEVICE - same as Ref 

CR23 

SEMICONDUCTOR DEVICE - same as Ref 

CR9 

SEMICONDUCTOR DEVICE - same as Ref 

CR9 

SEMICONDUCTOR DEVICE - same as Ref 

CR23 

RESISTOR, FIXED, COMPOSITION - 10 

5. IK ohms, 1/2W, 5% 

RESISTOR - same as R62 Ref 

RESISTOR, FIXED, COMPOSITION - 1 

30 ohms, 1/2W, 5% 

RESISTOR, FIXED, COMPOSITION - 1 

2K ohms, 1/2W, 5% 

RESISTOR, FIXED, COMPOSITION - 3 

IK ohms, 1/2W, 5% 

RESISTOR, FIXED, COMPOSITION - 1 

10 ohms, 1/2W, 5% 



*SCD 950 061 004--Replace R76 with CR39, Part No. 60312201, same as CR23. 



4-72 



Fig. h 

Index 

No. 



Desig- 
nation 



-55 

-56 

-57 

-58 

-59 
-60 

-61 

-62 

-63 

-64 

-65 

-66 
-67 

-68 
-69 
-70 

-71 

-72 
-73 

-74 

-75 
-76 

-77 

-78 

-79 



Q18 

R52 

Q16 

R67 

R49 
R45 

R44 

Q15 

R42 

Q6 

Q14 

R43 
R40 

R41 
R27 
Q8 

R26 

R28 
R29 

R30 

R22 
Q12 

R35 

QU 

R33 



Part No. 



6011075 

5001119 

6011075 

5001092 

5001105 
5001071 

5001073 

6011151 

5001099 

6011075 

6011075 

5001105 
5303099 

59013526 

5001080 

6011075 

5001081 

5001105 
6001116 

5001096 

5001081 
6011075 

5001100 

6011133 

5001077 



Inden- 
ture 



E 
E 



E 

E 

E 

E 

E 

E 

E 

E 
E 

E 
E 
E 

E 

E 
E 



E 
E 

E 

E 



Description 



SEMICONDUCTOR DEVICE, TRANSISTOR 
Type 2N3569 

RESISTOR, FIXED, COMPOSITION - 
20K ohms, l/2W, 5% 

SEMICONDUCTOR DEVICE, TRANSISTOR 
same as Q18 

RESISTOR, FIXED, COMPOSITION - 
1.5K ohms, 1/2W, 5% 

RESISTOR - same as R62 

RESISTOR, FIXED, COMPOSITION - 
200 ohms, 1/2W, 5% 

RESISTOR, FIXED, COMPOSITION - 
240 ohms, l/2W, 5% 

SEMICONDUCTOR DEVICE, TRANSISTOR 
Type 2N3638 

RESISTOR, FIXED, COMPOSITION - 
3K ohms, 1/2W, 5% 

SEMICONDUCTOR DEVICE 
Q18 



same as 



SEMICONDUCTOR DEVICE - same as 
Q18 

RESISTOR - same as R62 

RESISTOR, FIXED, FILM - 3K ohms, 

IW, 5% 

POTENTIOMETER - IK ohm 

RESISTOR - same as R56 

SEMICONDUCTOR DEVICE - same as 
Q18 

RESISTOR, FIXED, COMPOSITION - 
510 ohms, 1/2W, 5% 

RESISTOR - same as R62 

RESISTOR, FIXED, COMPOSITION - 
15K ohms, 1/2W, 5% 

RESISTOR, FIXED, COMPOSITION - 
2.2K ohms, l/2W, 5% 

RESISTOR - same as R26 



Qty 

per 

Ass'y 



SEMICONDUCTOR DEVICE 
Q18 



sanne as 



RESISTOR, FIXED, COMPOSITION - 
3.3K 1/2W, 5% 

SEMICONDUCTOR DEVICE, TRANSISTOR 
Type MJ2801 

RESISTOR, FIXED, COMPOSITION - 
360 ohms, 1/2W, 5% 



14 

2 

Ref 

1 

Ref 
1 

1 

2 

1 

Ref 

Ref 

Ref 
1 

1 
Ref 
Ref 



Ref 
2 



Ref 
Ref 

1 

2 

1 



4-73 



Fig. &. 

Index 

No. 


Desig- 
nation 


Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass 'y 


-80 


QIO 


6011133 


E 


SEMICONDUCTOR DEVICE - same as 
Qll 


Ref 


-81 


R14 


5303086 


E 


RESISTOR, FIXED, FILM - 820 ohms, 
IW, 5% 


3 


-82 


R18 


5001072 


E 


RESISTOR, FIXED, COMPOSITION - 
220 ohms, 1/2W, 5% 


1 


-83 


Q9 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q18 


Ref 


-84 


R25 


5001057 


E 


RESISTOR, FIXED, COMPOSITION - 
51 ohms, 1/2W, 5% 


1 


-85 


R66 


5303089 


C 


RESISTOR, FIXED, FILM - 1. IK ohms, 
IW, 5% 


3 


-86 


C23 


4001061 


E 


CAPACITOR - 50 laF, 50V 


1 


-87 


R15 


59013524 


E 


POTENTIOMETER - 400 ohms 


3 


-88 


Q4 


6011151 


E 


SEMICONDUCTOR DEVICE - same as 
Q15 


Ref 


-89 


Q3 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Ref 


-90 


R37 


59013546 


E 


POTENTIOMETER - IK ohms 


1 


-91 


R16 


5001116 


E 


RESISTOR - same as R29 


Ref 


-92 


Q2 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Ref 


-93 


RIO 


5001129 


E 


RESISTOR, FIXED, COMPOSITION - 
5 IK ohms, 1/2W, 5% 


1 


-94 


Ql 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Ref 


-95 


R9 


5001096 


E 


RESISTOR - same as R30 


Ref 


-96 


R8 


5001096 


E 


RESISTOR - same as R30 


Ref 


-97 


R7 


59013524 


E 


POTENTIOMETER - same as R15 


Ref 


-98 


R17 


5001075 


E 


RESISTOR, FIXED, COMPOSITION - 
300 ohms, 1/2W, 5% 


1 


-99 


R13 


5303086 


E 


RESISTOR - same as R14 


Ref 


-100 


R6 


5303086 


E 


RESISTOR - same as R 1 3 


Ref 


-101 


R5 


5303089 


E 


RESISTOR - same as R66 


Ref 


-102 


R2 


600307 1 


E 


RESISTOR, FIXED, COMPOSITION - 
200 ohms, 2W, 5% 


2 


-103 


R3 


5002060 


E 


RESISTOR, FIXED, COMPOSITION - 
68 ohms, IW, 5% 


2 


-104 


Rl 


5003071 


E 


RESISTOR - same as R2 


Ref 


-105 


R4 


5002060 


E 


RESISTOR - same as R3 


Ref 


-106 


R24 


5804602 


E 


RESISTOR, WIRE WOUND - 5 ohms, 

6W, 10% 


1 


-107 


R31 


5804455 


E 


RESISTOR, WIRE WOUND -0.1 ohm, 
5W, 5% 


1 



4-74 



Fig. k 










Oty 


Index 


Desig- 




Inden- 




per 


No. 


nation 


Part No. 


ture 


Description 


Ass'y 


-108 


R32 


5001070 


E 


RESISTOR, FIXED, COMPOSITION - 
180 ohms, 1/2W, 5% 


1 


-109 


R34 


59013524 


E 


POTENTIOMETER - same as R15 


Ref 


-110 


Q13 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Re£ 


-111 


R38 


5303091 


E 


RESISTOR, FIXED, FILM - 1.3Kohms, 
IW, 5% 


1 


-112 


R36 


5303081 


E 


RESISTOR, FIXED, FILM - 510 ohms. 
IW, 5% 


1 


-113 


R23 


501088 


E 


RESISTOR - same as R56 


Ref 


-114 


R39 


5303097 


E 


RESISTOR, FIXED, COMPOSITION - 
2.40K, IW, 5% 


2 


-115 


R20 


5001105 


E 


RESISTOR - same as R62 


Ref 


-116 


Q7 


6011153 


E 


SEMICONDUCTOR DEVICE, TRANSISTOR 
Type 2N3644 


2 


-117 


R19 


5001105 


E 


RESISTOR - same as R62 


Ref 


-118 


R21 


5001112 


E 


RESISTOR, FIXED, COMPOSITION - 
lOK ohms, 1/2W, 5% 


2 


-119 


R12 


5001105 


E 


RESISTOR - same as R62 


Ref 


-120 


R50 


5001119 


E 


RESISTOR - same as R52 


Ref 


-121 


R46 


5305097 


E 


RESISTOR - same as R39 


Ref 


-122 


R48 


5303089 


E 


RESISTOR - same as R66 


Ref 


-123 


Q17 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Ref 


-124 


Q5 


6011153 


E 


SEMICONDUCTOR DEVICE - same as 
Q7 


Ref 


-125 


R47 


59013525 


E 


POTENTIOMETER, 500 ohms 


1 


-126 


RU 


5001105 


E 


RESISTOR - same as R62 


Ref 


-127 


Q20 


6011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Ref 


-128 


R55 


5001097 


E 


RESISTOR. FIXED, COMPOSITION - 
2.4K ohms, l/2W, 5% 


1 


-129 


R65 


5003083 


E 


RESISTOR. FIXED, COMPOSITION - 
620 ohms, 2W, 5% 


1 


-130 


R64 


5001105 


E 


RESISTOR - same as R62 


Ref 


-131 


R63 


5001101 


E 


RESISTOR, FIXED, COMPOSITION - 
3.6K ohms, l/2W, 5% 


1 


-132 


R54 


5002081 


E 


RESISTOR, FIXED, COMPOSITION - 
510 ohms, IW, 5% 


1 


-133 


R57 


5001112 


E 


RESISTOR - same as R21 


Ref 


-134 


Q19 


5011075 


E 


SEMICONDUCTOR DEVICE - same as 
Q8 


Ref 


-135 


C23 


4001061 


E 


CAPACITOR - 50 m-F, 50V 


1 



4-75 




2 - SC^tt^HT-C Cf^AAfJ FOR 

1- ALL RESISTANCES ARt V2*5% 
ALL CAPACITANCES AS£ i^ UF 

^uSf. «e: CR F 



Figure 4-28. Model PR-136 Power Supply, 
Schematic Diagram (SCD 950 061 003) 



4-77 




Figure 4-29, Model PR-143-A1 Power 

Supply, Schematic Diagram 

(SCD 950 061 004, Rev F) 



4-79 



APPENDIX B 
ACME POWER SUPPLIES 



B-1 



CHAPTER V 
ACME POWER SUPPLIES 

This chapter is divided into two parts. Each part contains information for the power 
supplies manufactured by Acme Electric Corporation, and used in the H316 General Purpose 
Computer. 

Part I contains operating instructions and illustrated parts breakdown (IPB) for Acme 
Model PS- 1-59307, manufactured per Honeywell Specification Control Drawing (SCD) No. 
950061001. 

Part II contains the IPB and schematic diagram for Acme Model PS- 2 -5 9307, manu- 
factured per Honeywell SCD No. 950061003, 



PART I 
ACME POWER SUPPLY, MODEL PS- 1-59307 



SECTION 1 
ASSEMBLY DESCRIPTION 

The H316 Power Supply is designed to provide operating voltages for the H316 computer 
as follows: 

24 Vac 1 ampere (max) 

+ 6 Vdc 8-20 amperes 

+ 6.5 Vdc* 8-20 amperes 

-6 Vdc 1 ampere (max) 

+ 15.5 Vdc 0.2-5 amperes 

+ 24 Vdc 2 amperes (max) 

A multiple secondary constant voltage transformer is used to provide these required 
operating potential using an input line of 95 to 130 Vac at either 50 or 60 Hz. Logic circuitry 
is included in the power supply to control the turn on procedure. Circuit protection devices 
include fuses, a low line voltage sensing circuit, and a thermostat switch. 

PHYSICAL LAYOUT 

The power supply measures 17.28 inches wide by 17. 19 inches deep by 5. 15 inches 
high, and it is available for mounting with either the rack-mounted or table top computer 
configuration. The table top configuration uses the power supply as the computer base, 
with the mainframe hinged to the top of the supply. The rack-mounted configuration places 
the power supply below the mainframe and separately attached to the mounting rack. Cooling 
is provided by a built in fan and three connectors are used for input and output voltages. This 
power supply consists of the basic power unit Figure 5-1, + 15. 5 Vdc circuit (printed circuit 
board) Figure 5-2, and a line sensing circuit (printed circuit board) Figure 5-3. 
*For Model PS-2-59307 only 



5-1 




Figure 5-1. Basic Power Supply Schematic 




REF. PC CARD A-84702-A 



Figure 5-2, Power Supply +15. 5 Vdc Circuit Schematic 
(Printed Circuit Card A-84702-A) 



I 




PC CARD A-87243 



Figure 5-3. Line Sensing Circuit Schennatic 
(Printed Circuit Card A-87249) 



THEORY OF OPERATION 

The power supply converts ac input power into four regulated dc outputs and one 
nonregulated 24 Vac output. A block diagram of the power supply is shown in Figure 5-4. 
Input ac power is supplied to a constant voltage transformer in the input power converter. 
Three secondaries of the constant voltage transformer provide the +6V, -6V, and +24V 
output voltages. The +24V winding also provides bulk ac power to a series regulator which 
regulates the +15.5 output voltage. A fourth secondary provides the 24 Vac output. The 
logic circuitry provides the required sequencing, line sensing, and overvoltage protection. 
Reverse diodes are included across each output to prevent accidental reversal of polarity. 



INPUT 

A-C 

POWER 

O 



INPUT 

POWER 

CONVERTER 



^^ A-C OUTLETS 
^^ B3BANDB4B 



SERIES 
REGULATOR 



REVERSE 
DIODE 



REVERSE 
DIODE 



REVERSE 
DIODE 



REVERSE 
DIODE 



+6V @ 20A 



-•■ -6V@1A 



24 VAC@1A 
+24V @ 2A 



-••+15.5V@5A 




. REMOTE TEMP. 
SENSE 



POWER STATUS 
INDICATOR 



Figure 5-4. Power Supply Block Diagram 



5-5 



Input Power Converter 

Input ac power is supplied to the primary of constant voltage transformer Tl. (Refer 
to Figure 5-5.) A line voltage sensing circuit provides a 'ifault signal" to indicate whether 
the ac line voltage is above or below line limits, A3A is the input ac fuse. The outputs of 
three secondaries of T 1 are rectified and filtered to provide the ± 6V and +24V outputs as well 
as several other required bulk dc sources. A fourth secondary of T 1 provides the unregulated 
24 Vac output. A capacitor is used in combination with a winding on T 1 to resonate the trans- 
former at the line frequency and provide the constant voltage characteristic. All the windings 
are tapped to allow change over between 50 and 60 Hz line operation. Transformer T2 is used 
by the line sense circuitry to monitor the input ac line. 




LINE SENSE INPUT 




CONNECTIONS SHOWN 
ON TBI AND TB2 FOB 
60 Hz OPERATION 



DASHED LINES SHOW 
CONNECTIONS FOR 
50 H2 OPERATION 



S5S TBI-6 




[^^ 



-J?*— ♦*- 



+ 24VAC 
"OUTPUT 



A4A 



TO 
^ +15.5 VDC 
NPUT 



. 6VDC 
■ OUTPUT 



-6VDC 
OUTPUT 



-o J 



+ 24 VDC 

'output 



Figure 5-5. Input Power Converter Diagram 



5-6 



+ 15. 5 Vdc Supply Circuit 

The +15. 5 Vdc supply is controlled by a remote temperature sensing device. This 
supply is a basic series regulator containing a temperature sensitive voltage adjustment, an 
overvoltage circuit, and a current limit circuit. 

The basic series regulator, Figures 5-6 and 5-7, consists of a comparison element 
which compares a portion of the output voltage with the reference voltage, and generates an 
error signal. This signal is amplified and applied to the base of a series pass element which 
increases or decreases the output in response to the error signal. 



AC 

input" 



RECTIFIER 
AND FILTER 
ELEMENT 




SERIES 




OUTPUT 

VOLTAGE 

ELEMENT 




ELEMENT 








1 








AMPLIFIER 
ELEMENT 










1 
ERROR SIG 


NAL 


REFERENCE 
VOLTAGE 

ELEMENT 




COMPARISON 






ELEMENT 





7390 



Figure 5-6. Series Regulator Circuit Block Diagram 



5-7 



I 1 



' A.C. 
I INPUT 
VOLTAGE 




VOLTAGE 
OUT 



~] GROUND 



Figure 5-7, Series Regulator Circuit Schematic 



The basic schematic of the regulator for the +15. 5 Vdc power supply is presented in 
Figure 5-8. This unit contains the temperature sensitive voltage circuit, the overvoltage 
firing circuit, and the current limit circuit. 

The remote temperature sensing device (Honeywell P/N 70 932 305 001) is a thermistor 
that provides a nominal temperature coefficient of -0. 5%/°C. This device is included in the 
output voltage circuit that changes the output as the resistance of the device changes. The 
overvoltage circuit is designed to limit the output voltage to less than +18 Vdc. The current 
cutback circuit limits the output current to less than 6 amperes. 

Turn-on, Turn-off Sequence . -- The turn-on sequence of the +15. 5 Vdc supply provides 
a delay (see Figure 5-8 relay Kl) so that the +6V and -6V supplies exceeds 90% of nominal 
before the +15. 5V supply exceeds Z0% of normal. The turn-off sequence of this supply starts 
to crowbar at 1 ms after the "fault signal" goes to common. The +15. 5V supply will be reduced 
to 20% of normal before the +6V or -6V supplies have changed by 10%. 

Line Voltage Sensing Circuit 

The line voltage sensing circuit provides a "fault signal" to indicate whether the ac 
line voltage is above the low line limit. The comparison element, Figures 5-9 and 5-10, 
compares a portion of a voltage that is directly proportional to the line voltage with a 
reference voltage. If the line voltage falls below the specified low line limit, the "fault 
signal" (5 to 6 Vdc) is reduced to zero. Thus, the power status is shorted to common 
through a set of relay contacts and a signal (approximately 30 Vdc) is applied to the input 
circuit breaker relay trip coil that shuts down the input power (see Figure 5-11). 

MAINTENANCE 

The only routine maintenance required for the power supply is periodic cleansing or 
replacement of the air filter. Adjustment procedures, a trouble shooting chart and interface 
connection data are described in the following paragraphs. 

Replacement Parts 

Replacement parts can be purchased directly from Honeywell Inc. , Framingham, Mass. 
However, most of the components are standard electrical parts and might be obtained 
locally in less time. 

Recommended Test Instruments 



The following test instruments will be helpful in testing and adjusting the power supply: 
Voltmeter, ac/dc 
Ammeter, ac/dc 
Card Extender 



5-9 



CRI 
384H (2) 



■«^-^ 



CR2 



<^. 



<^s 



«i 



«s 



Rl 
200 

« WSr- 



Cl 

-J- 150/jt 
'^ 35V 



Ql 
^2N3053 



^RIO 
>I.2K 



C2 
IKV 



Q 



04 

2 N 3053 



■R4 



CURRENT LIM I T CIRC U IT 
eilB 



Rll 
270 



,RI2 
>3.3K 



HI3 
&2K 



► 75K SI8K 



_1_C5 
lOOV 



I TURN-ON SEQUENCING RELAY CONTACT kI-I 



RI9 
2.2 K 



400MW 
9.0 V 



*' 



^ 



COM ' "^ na; 



>R2 
>33K 



;r3 

>Z.2K 



03 
2N4248 



t 05 06 / 

2N3053 

(2) 



RI6< 
4.99K 5 



C3/ 
.Ol/lf 
lOOV 



^ R6 
79PR 



R22 

1.3 K 



R23 

500 
79PR 



RZO 
3K 



R7< I R24^ 

4.22K < ' 'i^Ji ^T-N 




^" 



~l 



T»l 



^H 



I REMOTE TEMP 
I SENSE DEVICE 



06 
l.0/if 
-25V ■ 



C7 . 
.OIM-1 



OVERVOLTAGE 
FIRING CIRCUIT 



_Vk. 



C4 
.Ol^f 
lOOV 



& 



RM 
100 K 



SUSI 
2N4989 



■^>-r 



REF PC CARD A-B4702-A 



1 



Figure 5-8. Schematic of +15. 5 Vdc Power Supply Regulator 



INPUT »■ 



RECTIFIER 



REFERENCE 

VOLTAGE 

ELEMENT 



COMPARISON 
ELEMENT 



ERROR SIGNAL 



AMPLIFIER 
ELEMENT 



LINE 

VOLTAGE 

ELEMENT 



POWER STATUS 
ELEMENT 



CROWBAR 

FIRING 

ELEMENT 



FAULT 
SIGNAL 
ELEMENT 



INPUT CIRCUIT 
BREAKER RELAY 
TRIPCOIL 
SIGNAL ELEMENT 



Figure 5-9. Line Voltage Sensing Circuit Block Diagram 



5-11 



I 

ro 




Figure 5-10. Line Voltage Sensing Circuit Schematic 




REf PC CARD A -87243 



Figure 5-11. Line Sensing Circuit 



on 
I 



Troubleshooting Procedure 

Use every safety precaution when troubleshooting the power supply. The supply should 
be visibly examined for broken, loose or damaged parts, or wire and foreign objects. In 
the event of an audibly or visually apparent malfunction, proceed directly to the affected area 
and perform the necessary repairs. Apparent circuit board failure may be caused by im- 
properly adjusted potentiometers. This should be kept in mind when troubleshooting the 
power supply. 

WARNING 

The input transformer produces voltage in excess of 
600 volts. Exercise extreme caution whenever the 
power supply cover is off. Remove any rings, watches 
or other metallic objects before installation or testing. 
Avoid contact with heat sinks or the input transformer, 
which operate at high temperatures. 

Perform the following preliminary checks before troubleshooting the unit: 

a. Remove any foreign objects from the power supply. 

b. Check all input and output connections. 

c. Check the remote temperature sensing device connection. 

d. Check for proper connections for 50 or 60 Hz operation. 



SYMPTOM 



Power Supply 
will not turn on. 



No +15. 5V out- 
put voltage. 



Low +15. 5V out- 
put voltage. 



Overvoltage occurs 
on +15. 5V output. 



Table 5-1. 
Troubleshooting Guide 



POSSIBLE CAUSE 



a. No input ac power. 

b. Blown fuse AlA, A2A, 
or ASA 

c. Low ac line voltage. 

d. Faulty or misadjusted 
line sense circuit 
under low ac line 
condition. 

a. Under voltage on +6V 
or — 6V output. 

b. Shorted output 

c. Faulty or misadjusted 
turn-on delay circuit. 

a. Improper adjustment. 

b. Blown fuse A4A, 

c. Overloaded output. 

d. Misadjusted over 
current limit. 

a. Misadjusted output, 

b. Shorted pass transistor 
02. 

c. Misadjusted overvoltage 
circuit. 



SUGGESTED ACTION 



a. Check for input power. 

b. Check fuses, 

c. Check for faulty signal. 

d. Check ac line level and 

line sense circuit adjustment. 



a. Check +6V levels. 

b. Check with external loads 
removed. 

c. Check turn-on delay circuit. 



a. Check output adjustment. 

b. Check fuse. 

c. Check with external load 
removed. 

d. Check adjustment. 



a. Check adjustment. 

b. Check 02. 

c. Check adjustment of overvoltage 
circuit: Overvoltage may not be 
actually occurring. 



5-14 



ADJUSTMENTS 

50 or 60 Hz Operation Adjustment 

Several tap changes are required on transformer Tl to convert from 60 Hz to 50 Hz 
operation. Figure 5-5 shows the correct wiring for 60 Hz operation. The dashed lines 
show the changes required for 50 Hz operation. Changing frequency operation also requires 
readjustment of the line sense c ir cuit. 

Output Voltage Adjustments 

The +15. 5V output is the only adjustable output. This voltage is controlled by 
potentiometer R6 (Figure 5-2) where clockwise rotation will increase the output voltage 
level. 

+ 15. 5V Overvoltage Adjustmen t 

The +15. 5V overvoltage adjustment is controlled by potentiometer R23. Proceed as 
follows ; 

a. Turn R23 (maximum overvoltage setting) fully clockwise. 

b. Apply input ac power. 

c. Adjust the +15. 5V output voltage to the desired overvoltage setting (18V) with 
the output voltage adjustment potentiometer R6. It may be necessary to replace the external 
thermistor with a decade box to reach this level. 

d. Slowly turn R23 counterclockwise until the +15. 5V output voltage drops to zero. 

e. Remove input ac power. 

f. Replace the external thermistor if it had been removed. 

g. Turn R6 fully counterclockwise, 
h. Apply input ac power. 

i. Set the +15. 5V output voltage to the desired operating level. 

+ 15. 5V Overcurrent Adjustment 

Adjust the overload bendback point with potentiometer R34 using the following 
procedure: 

a. Turn R4 fully clockwise. 

b. Apply a load to the +15. 5V output equal to the desired overcurrent setting. 

c. Apply input ac power, 

d. Slowly turn R4 counterclockwise until the +15. 5V output voltage starts to drop. 

e. Remove input ac power and remove the load. 

Line Sense Circuit Adjustmen t 

The line sense circuit is adjusted by potentiometer R7. This adjustment is required 
whenever a change is made between 50 Hz and 60 Hz operation. Proceed as follows: 



5-15 



a. Turn R7 fully clockwise. 

b. Apply 95 Vac (low line) to the input power terminals. 

c. Slowly turn R7 counterclockwise until the fault signal goes to ground. 

d. Remove input ac power. 

±6V Undervoltage Adjustment 

The +15. 5V turn-on delay circuit contains ±6V undervoltage sensors. These sensors 
have been adjusted at the factory and should normally require no adjustment. However, if 
adjustment should become necessary, proceed as follows: 

±6V Undervoltage Adjustment Procedure (for Model PS-1 -59307 only) 

a. Turn RIO fully counterclockwise. - 

b. Disconnect one lead of resistor R9 at junction / l\ (capacitor C9 and 
resistor R7) . 

c. Connect the disconnected lead to a positive voltage source of the desired 
undervoltage level. 

d. Apply input ac power. 

e. Slowly turn RIO clockwise until the +15. 6V output drops to zero. 

f. Remove input ac power. 

g. Remove the external voltage source and reconnect the lead. 

+ 6. 5V Output Adjustment Procedure (for Model PS-2-59307 only) 

a. Turn off power to system. 

b. Place a suitable meter on pin B2CS and adjust slide-wire resistor Rll 
(Figures 5-16 and 5-19). 

c. Turn on power to system and read meter. 

d. Turn off power to system and adjust slidewire resistor Rll. 

e. Repeat steps b, c, and d until meter reading is 6.5 Vdc. 

CONNECTOR INTERFACE DATA 

All inputs and outputs are made via the three connectors on the power supply. The 
pin connections are tabulated in Table 5-2. The connector number precedes the pin number; 
for example, B2A-A refers to pin A or connector B2A. 



5-16 



SPECIFICATIONS 

Input Power 

95-130 VRMS, 50 or 60 Hz ± 1 Hz, single phase. 



Output Power 



Output 
Voltage 


Current 
Range 

- 2A 


Regulation 
Band 


Set 
Current 

1.5A 


Ripple 

(P-P) 

5% 


Pi 


Overvoltage 
-otection Max. Voltage 


+24 Vdc 


±5%* 





+ 15.5 Vdc 


0.2 - 5A 


±6% 





2% 




+ 18 


+ 6 Vdc 


8 - 20A 


±6%* 


15A 


2% 







-6 Vdc 


- lA 


±6%* 


0.5A 


2% 







+ 6.5 Vdc 


8 - 20A 


±6%** 


15A 


2% 







24 Vac 


- lA 


_ - _ 


- - - 


- . «. 




-._ 



*Regulation of +24V, +6V and -6V includes static line voltage changes (at set current) 
and ripple only. 
*-For Model PS-2 -59307 only. 



5-17 



Table 5-2, 
Pin Connections* 

Terminal Identification 



B2A-A +24 Vdc Output 

B2A-D Common 

B2A-F +30V fault signal 

B2A-H -6V Output 

B2A-J +6V Output (+6.5V) 

B2A-L Junction /2\ 

B2A-M AC fused 

B2A-N To AC B4B 

B2A-P AC Outlet fused B3B 

B2A-S To AC B4B 

B2A-R To Fan 

B2A-U To Fan 

B2A-T To AC BIB 

B2A-V To AC BIB-W 

B2A-W To AC BIB 

B2A-X To AC BlB-W 

B2B-E 24 Vac Output 

B2B-C +6 Vdc Output {+ 6.5V) 

B2B-A -6 Vdc Output 

B2B-B Common 

B3B AC Outlet, fused 

B4B AC Outlet, fused 

B2C-A +24 Vdc Output 

B2C-B +15. 5 Vdc Output 

B2C-C Common 

B2C-D Common 

B2C-E Common 

B2C-F Line fault signal 

B2C-H +6 Vdc Output (+ 6.5V) 

B2C-K -6 Vdc Output 

B2C-M Tennperature sense element 

B2C-N Tennperature sense elennent 

B2C-P -6 Vdc Output 

B2C-R Power status terminal 
B2C-S \ +6 Vdc Output for Model PS-1-59307 
( +6.5Vdc Output for Model PS-2-59307 



For Model PS-1-59307 See Figure 5-1 
For Model PS-2-59307 See Figure 5-19 



5-11 



The +15. 5V supply regulation is ±5% for: 

1. Line Change (95 - 130 Vac). 

2. A 2. 6 Ampere load step in the range above 0. 3 Ampere, 

3. Temperature drift over a 90 day period. 

The voltage level of the +16, 5V supply is remotely controlled by a temperature sensing 
device. 

Line Voltage Sensing 

Circuitry is included to provide a "fault signal" to indicate whether the ac line voltage 
is above the low line limit, 

("fault signal" is 5 to 6 Vdc when the input is above low line) 
("fault signal" is when the line is below low line) 

Overvoltage Protection 

Turn-on and turn-off will not cause the +15, 5V output to exceed 18V nor the ± 6V out- 
puts to exceed nominal by more than 20%. 

An overvoltage crowbar circuit prevents the +15, 5V output from exceeding 18V in the 
event of a regulator component failure. 

Overcurrent Protection 

Fuses are provided for input ac power, the internal fan, bulk dc power for the +15. 5V 
regulator and two ac auxiliary outputs. Current limiting circuitry is incorporated in the 
+ 15. 5V regulator. 

Output Voltage Rever sal 

Diodes are across each output to prevent a reverse voltage of greater than 2. OV. 

Excess Temperature 

A temperature sensitive switch is located on the transistor heat sink which will send 
the "fault signal" to in the event of excess temperature. Normal operating temperature 
is - 60° C, 



5-lc 



SECTION 2 
ILLUSTRATED PARTS BREAKDOWN 



This section contains the illustrated parts breakdown (IPB) of the Acme Electric 
Corporation Power Supply. Model PS- 1-69307 used on both the rack-mounted and table top 
models of the H316 General Purpose Computer. 




Figure 5-12. Power Supply, Acme Model PS- 1 -59307, 
Parts Location Diagram (Sheet 1 of 2) 



5-21 



I 




Figure 5-12. Power Supply, Acme Model PS- 1-59307, 
Parts Location Diagram (Sheet 2 of 2) 



Fig. & 

Index 

No. 



5-12 



-1 
-2 
-3 

-4 

-5 

-6 

-7 

-8 

-9 

-10 

-11 

-12 

-13 

-14 

-15 
-16 
-17 

-18 

-19 

-20 

-21 
-22 

-23 



Designation 



DEFl through 
DEF3 

Al A 



A2A 
A3A 

A4A 

Kl 

CR6 

CR5 

CR2 

CRl 

C3 

R3 

C7 

R6 

C6 

Tl 

SCRl 

CRIO 

CR9 

CRll 

CR12 

LI 
C8 

R8 
(not shown) 



Acme 
Part No, 



Inden- 
ture 



70950061- 
001 

A-25-7431C 



A-32-7431C 
A-31-7431C 

A-10-23108 

A-5-89745 

A-2-81259 

A-2-81259 

A-2-81259 

A-2-81259 

A-60-74243 

A-67-41321 

A-57-74243 

A-59-41321 

A-57-74243 

T-65717 

A-2-61908 

A-2-41409 

A-2-92571 

A-4-92571 

A-2-93571 

T-15-56515 
A-55-74243 

A-59-41321 



C 
D 
D 
D 

D 
D 
D 
D 

D 
D 
D 
D 
D 
D 
D 

D 
D 
D 

D 

D 

D 

D 
D 

D 



Description 



Qty 

per 

Ass'y 



POWER SUPPLY-AcmeEIec. Corp. Part 
No.PS-1-59307 (Ref. to Figs. 3-1-4 and 
3-2-5 for NHA) 

FUSE, CARTRIDGE- lA; Bussman 
MDAIOA; slow-blowing type 

FUSE, CARTRIDGE- 2A; Bussman 
MDA2A; slow-blowing type 

FUSE, CARTRIDGE- 8A; Bussman 
MDA8A, slow-blowing type 

FUSE, CARTRIDGE- 8A; Bussman 
ABC8A; fast-blowing type 

RELAY, ARMATURE - spdt; coil, Hart- 
Advance 67DP-D-203, res. ohms 185 

SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N5401 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR6 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR6 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR6 

CAPACITOR, FIXED, ELECT - 
21 , 500 (J.F; 40V; Mallory type CGS 

RESISTOR, FIXED, COMPOSITION - 

2. 4Kohms, 2W; ±5% 

CAPACITOR, FIXED, ELECT - 
6000 ijlF, 40V 

RESISTOR, FIXED, COMPOSITION - 

IK ohm, 2W, ±5% 

CAPACITOR, FIXED, ELECT _ 
same as C 7 

TRANSFORMER, POWER 

THYRISTOR-type 2N682, GEC35Fx50 F964 

SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N1184A 

SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 368B VW 

SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 368B VW 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR9 

TRANSFORMER 

CAPACITOR, FIXED, ELECT - 
2000 [jlF, 40V; Mallory type CGS 

RESISTOR, FIXED, COMPOSITION - 

sanne as R6 



A/R 



4 
Ref 
Ref 
Ref 

1 

3 

2 

3 
i^ef 

1 
1 
3 

2 

3 

Ref 

1 
1 

Ref 



*Honeywell part no.- assignment 



5-23 



Fig. &c 

Index 

No. 



Designation 



Acme 
Part No. 



Inden- 
ture 



Description 



Qty 

per 

Ass'y 



-24 



CIO 



25 


C5 


26 


C9 


27 


R7 


28 


C4 


29 


R5 


30 


CI 


31 


R4 


32 


C2 



-33 

-34 

-35 

-36 

-37 
-38 
-39 

-40 

-'41 

-42 

-43 

-44 

-45 



TSl 

Rl 
(not shown) 

Ql 

R2 
(not shown) 

Q2 

Q3 

CR4 

CR3 
CR8 

Fl 

T2 
CR7 

PC 2 



A-5-81411 

A-5-81411 

A-25-74243 

A-67-41321 

A-25-74243 

A-59-41321 

A-25-74243 

A-67-41321 

A-25-74243 

A-5-78408 

A-8-62377 
A-1-67703 

A-8-62377 

A-1-67703 
A-1-67703 
A-2-41409 

A-2-4I409 

A-4-92571 

A-81342 

T-66620 
A-4-92571 

A-87243-B 



D 

D 
D 
D 



D 
D 
D 
D 

D 

D 

D 

D 
D 
D 

D 

D 

D 

D 

D 

D 



CAPACITOR, FIXED, ELECT- 2 

5 ^F, 660V 

CAPACITOR, FIXED, ELECT - Ref 

same as CI 

CAPACITOR, FIXED, ELECT - 4 

76, 000 (xF, 15V; Sangamo type 500 

RESISTOR, FIXED, COMPOSITION- Ref 

same as R3 

CAPACITOR, FIXED, ELECT - Ref 

same as C9 

RESISTOR, FIXED, COMPOSITION- Ref 

same as R6 

CAPACITOR, FIXED, ELECT - Ref 

same as C9 

RESISTOR, FIXED, COMPOSITION- Ref 

same as R3 

CAPACITOR, FIXED, ELECT - Ref 

same as C9 

THERMOSTAT- opens 160°F ±8°; 1 

closes 180°F ±8°; Elmwood Sensor 
Series (F180 88-58) 

RESISTOR, FIXED, FILM- 0.2 ohm, 2 

5W, ±3%; Tepro type TS5W 

TRANSISTOR - Westinghouse type 3 

2N3 055 

RESISTOR, FIXED, FILM- same as Rl Ref 

TRANSISTOR - same as Ql Ref 

TRANSISTOR - same as Ql Ref 

SEMICONDUCTOR DEVICE, DIODE- Ref 

same as CRl 

SEMICONDUCTOR DEVICE, DIODE- Ref 

same as CRIO 

SEMICONDUCTOR DEVICE, DIODE- Ref 

sanne as CRl 1 

FAN, AXIAL- 0. 003 HP, 16W, 115V, 1 

60 Hz; Howard Industries Model 

1075-3038 

TRANSFORMER 1 

SEMICONDUCTOR DEVICE, DIODE- Ref 

same as CRl 1 

PRINTED WIRING ASSY - (See Figure 1 

5-13 for additional parts breakdown) 



5-24 



Fig. k 

Index 

No. 



-46 

-47 

-48 
-49 

-50 

-51 

-52 

-53 
-54 



Designation 



PCI 

Cll 

RIO 
B4B 

B3B 

B2C 

B2B 

B2A 
BIB 
Rll 
R12 



Acme 
Part No. 



A-84702-A 

A- 5-80289 

A-1-82119 
A-55703 

A-55703 

A-3-45705 

A-11-58608 

A-3-45705 
A-89705 
A-2-67813 
A-1-57288 



Inden- 
ture 



D 

D 

D 
D 

D 

D 

D 

D 
D 
D 
D 



Description 



Qty 

per 

Ass'y 



PRINTED WIRING ASSY - (See Figure 
5-14 for additional parts breakdown) 

CAPACITOR, FIXED, ELECT - 
4000 ijlF, 15V; Sprague type 39D 

RESISTOR, VARIABLE- 50 ohms, 2W 

CONNECTOR, RECEPTACLE, ELECT - 
Hubbell P/N 5252 

CONNECTOR, RECEPTACLE, ELECT - 
same as B4B 

CONNECTOR, RECEPTACLE - 
Burndy type MS-20RM-58 

CONNECTOR, RECEPTACLE - c/o 
Heyco DC-202 and Acme Housing P/N 
A-6-58608-01 



CONNECTOR, RECEPTACLE 
B2C 



same as 



CONNECTOR, RECEPTACLE, ELECT- 
Hubbell Type P/N 5278 



RESISTOR, VARIABLE 
105W 

RESISTOR, VARIABLE. 



0. 15 ohm, 
1 ohm, 12W 



1 

1 

1 
2 

Ref 

2 

1 

Ref 
1 
1 
1 



5-25 




I 54 53 52 51 50 49 46 



Figure 5-13, Printed Circuit Board (PC2), 
Parts Location Diagram 



5-26 



Fig, & 

Index 

No, 


Designation 


Acme 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


5-13 

-1 


PC 2 
CRl 


A-87243-B 
^-4-82573 


D 
E 


PRINTED WIRING ASSY - (Refer to 
Figure 5-12-45 for the next higher 
assembly) 

SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N5395 


Ref 
7 


-2 


C6 


^-16-79114 


E 


CAPACITOR, FIXED- 100 (jiF 15V 


7 


-3 


CR2 


^-4-82573 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 


Ref 


-4 


Rl 


A-86-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
240 ohms, 2W, ±5% 


2 


-5 


CR3 


^-4-50538 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N747A 


1 


-6 


R5 


A-19-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
680 ohms, 1/2W, ±5% 


1 


-7 


Q2 


A-1-80269 


E 


TRANSISTOR - Motorola type 2N3903 


4 


-8 


Q3 


A-1-80269 


E 


TRANSISTOR - same as Q2 


Ref 


-9 


R8 


A_48-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
3K ohms, 1/2W, ±5% 


1 


-10 


R3 


A-17-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
6. 8K ohms, 1/2W, ±5% 


1 


-11 


CR4 


A-4-82573 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 


Ref 


-12 


R2 


A-33-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
8. 2K ohms, 1/2W, ±5% 


1 


-13 


R4 


A-50-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
1.3K ohms, 1/2W, ±5% 


1 


-14 


R6 


A-40-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
200 ohms, 1/2W, ±5% 


1 


-15 


Ql 


A-1-80270 


E 


TRANSISTOR - Motorola type 2N3905 


4 


-16 


Q4 


A-1-80269 


E 


TRANSISTOR - same as Q2 


Ref 


-17 


Q5 


A-1-80270 


E 


TRANSISTOR - same as Ql 


Ref 


-18 


R15 


A-86-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
same as Rl 


Ref 


-19 


R14 


A-21-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
3. 9K ohms, 1/2W, ±5% 


1 


-20 


CR5 


A-4-82573 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 


Ref 


-21 


CR6 


A-4-82573 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 


Ref 


-22 


Q9 


A-2-80115 


E 


TRANSISTOR - type 2N697 


1 


-23 


R7 


A-8-81756 


E 


RESISTOR, VARIABLE - 2K ohms 


1 


-24 


CR13 / 


=^-1-86133 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N4001 


1 



5-27 



Fig. k 

Index 

No. 



Designation 



Acme 
Part No. 



Inden- 
ture 



Description 



Qty 

per 

Ass'y 



-25 

-26 

-27 

-28 

-29 

-30 

-31 

-32 

-33 

-34 
-35 

-36 
-37 

-38 
-39 

-40 

-41 

-42 

-43 
-44 

-45 

-46 

-47 
-48 
-49 



Kl 

R23 

R22 

CRll 

C2 

CR12 

R17 

R16 

R18 

Q7 
R19 

Q8 
CRIO 

Q6 
C3 

CR7 

C5 

R20 

SUSl 
C4 

R9 
R21 

CR8 
CR9 
RIO 



A-89760 

A-18-44507 

A-58-44507 

A-89761 

A-6-88012 

A-89761 

A-6-44507 

A-43-44507 

A-22-44507 

A-1-80269 
A-1-44507 

A-1-80269 
A-89761 

A-1-80270 
A-3-79114 

A-7-78467 

A-1-51997 

A-9-44507 

A-3-82197 
A-2-88012 

A-53-44507 

A-44507 

A-4-82573 

A-4-82573 

A-44-44507 



E 
E 

E 
E 
E 
E 
E 
E 
E 

E 
E 

E 
E 

E 
E 

E 

E 

E 

E 
E 

E 

E 

E 

E 

E 



RELAY, MERCURY, WETTED - 
C. P. Clare P/N HGSMl 001 

RESISTOR, FIXED, COMPOSITION - 
330 ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
820 ohms, 1/2W, ±5% 

SEMICONDUCTOR DEVICE, DIODE - 
type 1N914 

CAPACITOR, FIXED, CERAMIC - 

0. 1 |j.F, lOOV 

SEMICONDUCTOR DEVICE, DIODE - 
same as CRll 

RESISTOR, FIXED, COMPOSITION - 

1. 5K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
lOK ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 

2. 2K ohms, 1/2W, ±5% 

TRANSISTOR - same as Q2 

RESISTOR, FIXED, COMPOSITION - 
100 ohms, 1/2W, ±5% 

TRANSISTOR - same as Q2 

SEMICONDUCTOR DEVICE, DIODE - 
same as CRll 

TRANSISTOR - same as Ql 

CAPACITOR, FIXED- 100 |iF, 35V 

SEMICONDUCTOR DEVICE, DIODE - 
type 1N4734A 

CAPACITOR, FIXED, ELECTRICAL - 
1 fxF, 25V, Sprague 30D, type TE1200 

RESISTOR, FIXED, COMPOSITION - 

2. 4K ohms, 1/2W, ±5% 

TRANSISTOR - type 2N4989 

CAPACITOR, FIXED, CERAMIC - 
0. 01 fiF, lOOV 

RESISTOR, FIXED, COMPOSITION - 
470 ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 

3. 9 ohms, 1/2W, ±5% 

SEMICONDUCTOR DEVICE, DIODE- 
same as CR 1 

SEMICONDUCTOR DEVICE, DIODE- 
same as CR 1 

RESISTOR, FIXED, COMPOSITION- 
910 ohms, 1/2W, ±5% 



1 

1 

1 

1 

1 
Ref 

1 

1 

Ref 

Ref 
1 

Ref 
Ref 

Ref 



Pef 

Ref 
1 



5-28 



Fig. &c 

Index 

No, 



Designation 



■ 50 
-51 
-52 
-53 

■ 54 



Rll 
R13 
R12 
R24 
QIO 



A-5-44507 

A-32-44507 

A-16-59094 

A-31-44507 

A-1-80270 



Acme 
Part No. 



Inden- 
ture 



E 
E 
E 
E 
E 



Description 



Qty 

per 

Ass'y 



RESISTOR, FIXED, COMPOSITION- 1 

IK ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION- 1 

6. 2K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION- 1 

200K ohms, ±5% 

RESISTOR. FIXED, COMPOSITION- 1 

5. IK ohms, 1/2W, ±5% 

TRANSISTOR - same as QI Ref 



5-29 



19 20 21 22 23 24 




Figure 5-14. Printed Circuit Board (PCI), Parts Liocation Diagram 



5-30 



Fig. fe 
Index 

No. 


Designation 


Acme 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass'y 


5-14 
-1 


PCI 
SUSl 


A-84702-A 
A-3-82197 


D 

E 


PRINTED WIRING ASSY - (Refer to 
Figure 5-12-46 for the next higher 
assembly) 

TRANSISTOR - type 2N4989 


Ref 

1 


-2 


C7 


A-2-88012 


E 


CAPACITOR, FDCED, CERAMIC - 
0. 01 jaF, lOOV 


3 


-3 


Q4 


A-1-73737 


E 


TRANSISTOR - type 2N3053 


4 


-4 


RIB 


A-95- 44507 


E 


RESISTOR. FIXED, COMPOSITION - 
18K ohms, 1/2W, ±5% 


1 


-5 


C4 


A-2-88012 


E 


CAPACITOR, FIXED. CERAMIC - 
same as C7 


Ref 


-6 


C5 


A-7-71984 


E 


CAPACITOR. FIXED, CERAMIC - 
0. 12 |jiF. 20V 


1 


-7 


CR5 


A-4-59072 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N936 


1 


-8 


R19 


A-22-44507 


E 


RESISTOR, FDCED, COMPOSITION - 
2. 2K ohms, 1/2W, ±5% 


1 


-9 


R14 


A-9-59094 


E 


RESISTOR, FIXED, COMPOSITION - 
lOOK ohms, 1/2W, ±5% 


1 


-10 


Q5 


A-1-73737 


E 


TRANSISTOR - same as Q4 


Ref 


-11 


R20 


A-48- 44507 


E 


RESISTOR, FIXED, COMPOSITION - 
3K ohms, 1/2W, ±5% 


1 


-IZ 


Q3 


A-1-83242 


E 


TRANSISTOR - type 2N4248 


1 


-13 


Q6 


A-1-51997 


E 


TRANSISTOR - same as Q4 


Ref 


-14 


R15 


NOT 


USED 






-15 


C6 


A-1-51997 


E 


CAPACITOR, FIXED- 1 ^F, 25V, 
Sprague 30D, Type TE1200 


1 


-16 


R24 


A-24-44507 


E 


RESISTOR, FDfED, COMPOSITION - 
1. 5K ohms, 1/2W, ±5% 


1 


-17 


R23 


A-6-81756 


E 


RESISTOR, VARIABLE- 500 ohms 


1 


-18 


R22 


A-50-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
1.3K ohms, 1/2W, ±5% 


1 


-19 


C3 


A-2-88012 


E 


CAPACITOR, FDCED, CERAMIC - 
same as C7 


Ref 


-20 


R16 


A-36-76348 


E 


RESISTOR, FIXED, FILM - 4. 99K ohms, 
±1%, type RN60D 


1 


-21 


R7 


A-34-76348 


E 


RESISTOR, FDCED, FILM - 4. 87 K ohms, 
±1%, type RN60D 


1 


-22 


R6 


A-8-81756 


E 


RESISTOR, VARIABLE- IK ohms 


1 


-23 


R5 


A-5-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
IK ohms, 1/2W, ±5% 


1 


-24 


R4 


A-7-81756 


E 


RESISTOR, VARIABLE- IK ohms 


1 


-25 


Ql 


A-1-73737 


E 


TRANSISTOR - same as Q4 


Ref 



5-31 



Fig. & 
Index 

No. 



-26 
-27 
-28 
-29 
-30 
-31 
-32 
-33 
-34 
-35 
-36 
-37 



Designation 



R3 

R2 

R13 

R12 

CI 

Rll 

C2 

Rl 

CR2 

CRl 

RIO 

R9 



Acme 
Part No. 



A-22-44507 

A-21-44507 

A-32-44507 

A-12-44507 

A-1-79114 

A-38-44507 

A-.1-71984 

A-40- 44507 

A-4-82573 

A-4-82573 

A-25-44507 

A-56-44507 



Inden- 
ture 



E 
E 
E 
E 
E 
E 
E 
E 
E 
E 
E 



Description 



Qty 

per 

Ass'y 



RESISTOR, FIXED, COMPOSITION - 

2. 2K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 

3. 9K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 

6. 2K ohms, 1 /2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
3.3K ohms, 1/2W, ±5% 

CAPACITOR, FIXED, ELECT- 
150 |xF, 35V 

RESISTOR, FIXED, COMPOSITION - 
270 ohms, 1/2W, ±5% 

CAPACITOR, FIXED, CERAMIC - 
0. 001 (xF, IKV 

RESISTOR, FIXED, COMPOSITION - 
200 ohms, 1/2W, ±5% 

SEMICONDUCTOR DEVICE, DIODE 
Westinghouse type 1N5395 

SEMICONDUCTOR DEVICE, DIODE 
same as CR2 

RESISTOR, FIXED, COMPOSITION - 
1.2K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 

7. 5K ohms, 1/2W, ±5% 



2 

Ref 

1 

1 



5-32 



PART II 
ACME POWER SUPPLY, MODEL PS-2-59307 



Part II contains one section presenting the illustrated parts breakdown and two 
schematics for Model PS-2-59307 manufactured by Acme Electric Corporation per Honeywell 
SCD 950 061 003. The operation of Model PS-2-59307 is similar to Acme Electric Model 
PS-1-59307. Therefore, refer to Part I, Section 1, for the physical layout, theory of 
operation, maintenance, troubleshooting procedure and adjustment for Model PS-2-59307 
Power Supply. 




Figure 5-15. Power Supply, Acme Model PS-2-59307, 
Parts Location Diagran^ (Sheet 1 of 2) 



5-33 



UI 

I 




Figure 5-15. Power Supply, Acme Model PS- 1 -59307, 
Parts Location Diagram (Sheet 2 of 2) 



Fig. h 

Index 

No. 


Desig- 
nation 


Acme 
Part No. 


Inden- 
ture 


Description 


Qty 

per 

Ass 'y 


5-15 




70950061003= 


C 


POWER SUPPLY, ACME ELEC CORP. 
Part No. PS-2-59307 




-1 


A5A 


A-7-27241 


C 


FUSE, CARTRIDGE - 1 . 5A Bussman 
AGC; f St -blowing type 


1 


-2 


AlA 


A-25-74310 


D 


FUSE, CARTRIDGE - 3A Bussman 
MDAA; slow-blowing type 


1 


-3 


A2A 


A-32-74310 


D 


FUSE, CARTRIDGE - lOA Bussman 
MDAIOA; slow-blowing type 


1 


-4 


A3A 


A-31-74310 


D 


FUSE, CARTRIDGE - 8A Bussman 
MDA8A, slow-blowing type 


1 


-5 


A4A 


A-10-23108 


D 


FUSE, CARTRIDGE - 8A Bussman 
ABC8A; fast-blowing type 


1 


-6 


PC3 


A-1-95726 


D 


PRINTED CIRCUIT BOARD - (See 
Figure 5 for additional Parts Break- 
down) 


1 


-7 


CR6 


A-2-82573 


D 


SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N5392 


4 


-8 


CR5 




D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR6 


Ref 


-9 


CR2 




D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR6 


Ref 


-10 


CRl 




D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR6 


Ref 


-11 


C3 


A-60-74243 


D 


CAPACITOR, FIXED, ELECT - 
21, 500 |j.F; 40 V; Mallory type CGS 


1 


-12 


R3 


A-47 -41321 


D 


RESISTOR, FIXED, COMPOSITION - 
2.4K ohms, 2W ±5% 


3 


-13 


C7 


A-27-74243 


D 


CAPACITOR, FIXED, ELECT - 
6000 fxF, 40V 


2 


-14 


R6 


A-41-62377 


D 


RESISTOR, FIXED, COMPOSITION - 
250 ohms, 5W, ±5% 


3 


-15 


C6 


A-57-74343 


D 


CAPACITOR, FIXED, ELECT - 
same as C7 


Ref 


-16 


Tl 


T-65717 


D 


TRANSFORMER, POWER 


1 


-17 


CRIO 


A-2-41409 


D 


SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N1184A 


3 


-18 


CR9 


A-2-92571 


D 


SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N3616 


2 


-19 


Rll 


A-2-67813 


D 


RESISTOR, VARIABLE - 0.2 ohm, 
105W 


1 


-20 


CR12 


A-2-93571 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR9 


Ref 


-21 


CRll 


A-4-92571 


D 


SEMICONDUCTOR DEVICE, DIODE - 
Westinghouse type 1N3618 


3 


-22 


SCRl 


A-2-61908 


D 


THYRISTOR - type 2N682, 
GEC35Fx50F964 


1 



^Honeywell Part Number 



5-35 



Fig. I. 

Index 

No. 


Desig- 
nation 


Acme 
Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


-23 


LI 


T-15-565I5 


D 


CHOKE 


1 


-24 


CIO 


A-5-81411 


D 


CAPACITOR, FIXED, ELECT - 
5 ixF, 660V 


2 


-25 


C5 


A-5-81411 


D 


CAPACITOR, FIXED, ELECT - 
same as CIO 


Ref 


-26 


R8 
(not showr^ 


A-59-41321 


D 


RESISTOR, FIXED, COMPOSITION - 
IK ohm, 2W, ±5% 


Ref 


-27 


C8 


A-55-74243 


D 


CAPACITOR, FIXED, ELECT - 
2000 |j.F, 40V; Mallory type CGS 


1 


-28 


R12 


A-157288 


D 


RESISTOR, VARIABLE - 
2 ohms, 25W 


1 


-29 


R7 


A-67-41321 


D 


RESISTOR, FIXED, COMPOSITION - 
same as R3 


Ref 


-30 


C9 


A-25-74243 


D 


CAPACITOR, FIXED, ELECT - 
76, 000 jiF, I5V; Sangamo type 500 


4 


-31 


C4 


A-25-74243 


D 


CAPACITOR, FIXED, ELECT - 
same as C9 


Ref 


-32 


R5 


A-28-41321 


D 


RESISTOR, FIXED, COMPOSITION - 
36 ohms, 2W 


Ref 


-33 


CI 


A-25-74243 


D 


CAPACITOR, FIXED, ELECT - 
same as C9 


Ref 


-34 


R4 


A-67-4i321 


D 


RESISTOR, FIXED, COMPOSITION - 
same as R3 


Ref 


-35 


C2 


A-25-74243 


D 


CAPACITOR, FIXED, ELECT - 
same as C9 


Ref 


-36 


CR7 


A-4-92571 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CR 1 1 


Ref 


-37 


TSl 


A-5-78408 


D 


THERMOSTAT - opens 160''F±8°; 
closes 180°F ±8°; Elmwood Sensor 
Series (F180 88-58) 


1 


-38 


Rl 
(not shown) 


A-8-62377 


D 


RESISTOR, FIXED, FILM - 0.2 ohm, 
5W, ±3%, Tepro type TS5W 


2 


-39 


Ql 


A-1-67703 


D 


TRANSISTOR - Westinghouse type 
1561-0604 


3 


-40 


R2 
(not shown] 


A-8-62377 


D 


RESISTOR, FIXED, FILM - same as R 1 


Ref 


-41 


Q2 


A-1-67703 


D 


TRANSISTOR - same as Ql 


Ref 


-42 


Q3 


A-1-67703 


D 


TRANSISTOR - same as Ql 


Ref 


-43 


CR4 


A-2-41409 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRIO 


Ref 


-44 


CR3 


A-2-41409 


D 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRIO 


Ref 


-45 


Fl 


A-81342 


D 


FAN, AXIAL - 0.003 HP, 16W, 115V, 
60 Hz; Howard Industries Model 
6-218-152 


1 



5-36 



Fig. k 
Index 

No. 



Desig- 
nation 



-46 
47 

-48 

-49 

-50 

-51 

-52 

-53 
-54 
•55 



T2 
CR8 

PC2 

PCI 

BIB 

B2A 

B2B 

B2C 
B3B 
B4B 



Part No. 



T-66620 
A-4-92571 

A-1-87243B 

A-1-74602A 

A-89705 

A-3-45705 

A-11-58608 

A-3-45705 

A-55703 

A-55703 



Inden- 
ture 



D 
D 

D 

D 

D 

D 

D 

D 

D 
D 



Description 



TRANSFORMER 

SEMICONDUCTOR DEVICE, DIODE - 
same as CR 1 1 

PRINTED WIRING ASSY - (See Figure 
5-13 for additional parts breakdown) 

PRINTED WIRING ASSY - (See Figure 
5-14 for additional parts breakdown) 

CONNECTOR, RECEPTACLE, ELECT- 
Hubbell Type P/n 5278 

CONNECTOR, RECEPTACLE - 
Burndy type MS-20RM-58 

CONNECTOR, RECEPTACLE - c/o 
Heyco DC-202 and Acme Housing P/N 
A-6-58608-01 



CONNECTOR, RECEPTACLE 
B2A 



same as 



CONNECTOR, RECEPTACLE, ELECT - 
Hubbell P/N 5252 

CONNECTOR, RECEPTACLE, ELECT- 
same as B3B 



Qty 

per 

Ass 'y 



1 
Ref 

1 

1 

1 
2 
1 

Ref 

2 
Ref 



5-37 



25 



24- 



2 3- 



StL 



26 



HisSM 1001 




I 64 53 52 51 50 49 46 



Figure 5-16. Printed Circuit Board (PCZ), Parts Location Diagram 



5-3i 



Fig. &i 

Index 

No. 



5-16 



-1 



-6 



Desig- 
nation 



■10 



•11 



■12 



•13 



■14 



•19 



■ 20 



PC 2 

CRl 

C6 
CR2 

Rl 

CR3 

R5 

Q2 
Q3 
R8 

R3 

CR4 

R2 

R4 

R6 



15 


Ql 


16 


Q4 


17 


Q5 


18 


R15 



R14 



CR5 



Acme 
Part No. 



A-87243 

A-4-82573 

A-16-79114 
A-4-82573 

A-86-44507 

A-4-50538 

A-19-44507 

A-1-80269 
A-1-80269 
A-48-44507 

A-17-44507 

A-4-825.73 

A-33-44507 

A-50-44507 

A-40-44507 

A-1-80270 
A-1-80269 
A-1-80270 

A-86-44507 

A-21-44507 
A-4-82573 



Inden- 
ture 



D 



E 
E 



E 
E 
E 

E 



E 



E 

E 
E 
E 

E 



Description 



PRINTED CIRCUIT BOARD - (Refer to 
Figure 5-12-48 for the next higher 
assembly) 

SEMICONDUCTOR DEVICE, DIODE- 
Westinghouse type 384H 

CAPACITOR, FIXED - 100 |^F 15V 

SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 

RESISTOR, FIXED, COMPOSITION - 
240 ohms, 2W, ±5% 

SEMICONDUCTOR DEVICE, DIODE - 
type 1N747A 

RESISTOR, FIXED, COMPOSITION - 
680 ohms, 1/2W, ±5% 

TRANSISTOR - Motorola type 2N3903 

TRANSISTOR - same as Q2 

RESISTOR, FIXED, COMPOSITION - 
3K ohms, 1/2W, ±5% 

RESISTOR. FIXED. COMPOSITION - 
6.8K ohms. 1/2W. ±5% 

SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 

RESISTOR. FIXED, COMPOSITION - 
8.2K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
1.3K ohms, 1/2W. ±5% 

RESISTOR, FIXED, COMPOSITION - 
200 ohms, 1/2W, ±5% 

TRANSISTOR - Motorola type 2N3905 

TRANSISTOR - same as Q2 

TRANSISTOR - same as Ql 

RESISTOR, FIXED. COMPOSITION 
same as Rl 

RESISTOR, FIXED, COMPOSITION 
3.9K ohms. 1/2W, ±5% 

SEMICONDUCTOR DEVICE. DIODE - 
same as CRl 



Qty 

per 

Ass'y 

Ref 



7 
Ref 



1 

4 

Ref 
1 

1 

Ref 



1 

4 

Ref 
Ref 
Ref 

1 

Ref 



5-39 



Fig. k 
Index 

No. 


Desig- 
nation 


Acme 
Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


-21 


CR6 


A-4-82573 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRl 


Ref 


-12. 


Q9 


A-2-80115 


E 


TRANSISTOR - type 2N697 


1 


-23 


R7 


A-8-81756 


E 


RESISTOR. VARIABLE - 2K ohms 


1 


-24 


CR13 


A-l-86133 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N4001 


1 


-25 


Kl 


A-89760 


E 


RELAY, MERCURY, WETTED ~ 
C.P. Clare P/N HGSMlOOl 


1 


-26 


R23 


A-18-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
330 ohms, 1/2W, ±5% 


1 


-27 


R22 


A-58-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
820 ohms, 1/2W, ±5% 


1 


-28 


CRII 


A-89761 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N914 


1 


-29 


C2 


A-6-88012 


E 


CAPACITOR. FIXED, CERAMIC - 
0. 1 |jlF, lOOV 


1 


-30 


CR12 


A-89761 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRll 


Ref 


-31 

• 


RI7 


A-6-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
1.5K ohms, 1/2W, ±5% 


1 


-32 


R16 


A-43-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
lOK ohms, 1/2W, ±5% 


1 


-33 


RI8 


A-22-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
2.2K ohms, 1/2W, ±5% 


Ref 


-34 


Q7 


A-1-80269 


E 


TRANSISTOR - same as Q2 


Ref 


-35 


RI9 


A-1-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
100 ohms, 1/2W, ±5% 


1 


-36 


Q8 


A-I-80269 


E 


TRANSISTOR - same as Q2 


Ref 


-37 


CRIO 


A-89761 


E 


SEMICONDUCTOR DEVICE, DIODE - 
same as CRll 


Ref 


-38 


Q6 


A-1-80270 


E 


TRANSISTOR - same as Ql 


Ref 


-39 


C3 


A-3-79114 


E 


CAPACITOR, FIXED - 100 (iF, 35V 


1 


-40 


CR7 


A-7-78467 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N4734A 


1 


-41 


C5 


A-1-51997 


E 


CAPACITOR, FIXED, ELECTRICAL - 
1 IJ.F, 25V, Sprague 30D, type TE1200 


1 



5-40 



Fig. & 

Index 

No. 



Desig- 
nation 



-42 

-43 

-44 

-45 



R20 

SUSl 
C4 

R9 



-46 R21 



-47 



-48 



-49 



• 50 



■51 



■52 



■53 



-54 



CR8 



CR9 



Rll 



R13 



R12 



R24 



QIO 



Acme 
Part No. 



A-9-44507 

A-3-82197 
A-2-88012 

A-53-44507 

A-44507 

A-4-82573 

A-4-82573 



RIO A-44-44507 



A-5-44507 

A-32-44507 

A-16-59094 

A-31-44507 

A-1-80270 



Inden- 
ture 



E 
E 



E 



E 



E 



Description 



Qty 

per 

Ass'y 



RESISTOR, FIXED, COMPOSITION - 
2.4K ohms, 1/2W, ±5% 

TRANSISTOR - type 2N4989 

CAPACITOR, FIXED, CERAMIC - 
0.01 |iF. lOOV 

RESISTOR, FIXED, COMPOSITION - 
470 ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
3.9 ohms, 1/2W, ±5% 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CRl 

SEMICONDUCTOR DEVICE, DIODE - Ref 

same as CRl 

RESISTOR, FIXED, COMPOSITION - 
910 ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
IK ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION - 
6.2K ohms, 1/2W, ±5% 

RESISTOR. FIXED, COMPOSITION - 
200K ohms, ±5% 

RESISTOR, FIXED, COMPOSITION - 
5. IK ohms, 1/2W, ±5% 

TRANSISTOR - same as Ql Ref 



5-41 



16 17 18 19 20 2! 22 23 




Figure 5-17. Printed Circuit Board (PCI), Parts Location Diagram 



5-42 



Fig. & 

Index 

No. 


Desig- 
nation 


Acme 
Part No. 


Inden- 
ture 


Description 


Qty 
per 

Ass'y 


5-17 


PCI 


A-84702-A 


D 


PRINTED CIRCUIT BOARD - (Refer to 
Figure 5-12-46 for the next higher 
assembly) 


Ref 


-1 


SUSl 


A-3-82197 


E 


TRANSISTOR - type 2N4989 


1 


-2 


C7 


A-2-75736 


E 


CAPACITOR, FIXED, CERAMIC - 
0.01 laF, 50V 


3 


-3 


Q4 


A-1-73737 


E 


TRANSISTOR - type 2N3053 


4 


-4 


R18 


A-95-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
18K ohms, 1/2W, ±5% 


1 


-5 


C4 


A-2-75736 


E 


CAPACITOR, FIXED, CERAMIC - 
same as C7 


Ref 


-6 


C5 


A-11-85474 


E 


CAPACITOR, FIXED, CERAMIC - 
0. 10 \xF, 20V 


1 


-7 


CR5 


A-4-59072 


E 


SEMICONDUCTOR DEVICE, DIODE - 
type 1N936 


1 


-8 


R19 


A-22-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
2.2K ohms, l/2W, ±5% 


1 


-9 


R14 


A-9-59095 


E 


RESISTOR, FIXED, COMPOSITION - 
lOOK ohms, 1/2W, ±5% 


1 


-10 


Q5 


A-1-73737 


E 


TRANSISTOR - same as Q4 


Ref 


-11 


R20 


A-48-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
3K ohms, 1/2W, ±5% 


1 


-12 


Q3 


A-1-83242 


E 


TRANSISTOR - type 2N4248 


1 


-13 


Q6 


A-1-73737 


E 


TRANSISTOR - same as Q4 


Ref 


-14 


C6 


A-1-51997 


E 


CAPACITOR, FIXED - 1 [xF , 25V, 
Sprague 30D, type TE1200 


1 


-15 


R24 


A-6-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
1.5K ohms, 1/2W, ±6% 


' 1 


-16 


R23 


A-6-81756 


E 


RESISTOR, VARIABLE - 500 ohms 


1 


-17 


R22 


A-50-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
1.3K ohms, 1/2W, ±5% 


1 


-18 


C3 


A-2-75736 


E 


CAPACITOR, FIXED, CERAMIC - 
same as C7 


Ref 


-19 


R16 


A-49-94562- 
91 


E 


RESISTOR, FIXED, FILM - 499K 
ohms, ±1%, type RN60D 


1 


-20 


R7 


A-42-94562- 
21 


E 


RESISTOR, FIXED, FILM - 4.22K 
ohms, ±1%, type RN60D 


1 


-21 


R6 


A-8-81756 


E 


RESISTOR, VARIABLE - 2K ohms 


1 


-22 


R5 


A-5-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
IK ohms, 1/2W, ±5% 


1 


-23 


R4 


A-7-81756 


E 


RESISTOR, VARIABLE - IK ohms 


1 


-24 


Ql 


A-1-73737 


E 


TRANSISTOR - same as Q4 


Ref 


-25 


R3 


A-22-44507 


E 


RESISTOR, FIXED, COMPOSITION - 
2.2K ohms, l/2W, ±5% 


1 



5-43 



Fig. &i 

Index 

No. 



Desig- 
nation 



-26 
-27 
-28 
-29 
-30 
-31 
-32 
-33 
-34 
-35 
-36 



R2 

R13 

R12 

CI 

Rll 

C2 

RIO 

Rl 

R9 

CR2 

CRl 



Acme 
Part No. 



A-21-44507 

A-32-44507 

A-12-44507 

A-1-79114 

A-38-44507 

A-1-71984 

A-25-44507 

A-40-44507 

A-56-44507 

A-4-82573 

A-4-82573 



Inden- 
ture 



E 
E 
E 
E 
E 
E 
E 
E 
E 
E 



Description 



Qty 

per 

Ass 'y 



RESISTOR, FIXED, COMPOSITION 
3.9K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION 
6.2K ohms, l/2W, ±5% 

RESISTOR, FIXED, COMPOSITION 
3.3K ohms, l/2W, ±5% 

CAPACITOR, FIXED, ELECT - 

150 fxF, 35V 

RESISTOR, FIXED, COMPOSITION 
270 ohms, l/2W, ±5% 

CAPACITOR, FIXED, CERAMIC - 
0.001 ixF, 1 kV 

RESISTOR, FIXED, COMPOSITION 
1.2K ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION 
200 ohms, 1/2W, ±5% 

RESISTOR, FIXED, COMPOSITION 
7.5K ohms, 1/2W, ±5% 

SEMICONDUCTOR DEVICE, DIODE 
Westinghouse type 384H 

SEMICONDUCTOR DEVICE, DIODE 
same as CR2 



1 
1 
1 
1 
1 
1 
1 
1 
1 
2 
Ref 



5-44 




Figure 5-18. Printed Circuit Board (PC3), Part Location Diagram 



5-45 



Fig. h 

Index 

No. 



5-18 



-1 
-2 
-3 

-4 

-5 
-6 



-9 
-10 

-11 

-12 
-13 

-14 
-15 
-16 
-17 

-18 
-19 

-20 
-21 

-22 

-23 

-24 

-25 
-26 



Desig- 
nation 



PC3 

R3 

R4 

R9 

R5 

C2 
R6 

Q3 

C7 

CRl 

RIO 

C3 

SCRl 
R15 

Q5 
Kl 
C5 
R17 

CR2 

R18 

Q6 
C4 
R16 

CR4 
R19 

R20 
R14 



Acme 
Part No. 



A-1-95726 

A-82-94562 
-50 

A-36-94562 
-50 

A-41-72691 
A-4-93416 

A-30-71984 

A-33-94562 
-20 

A-1-83243 

A-21-85850 

A-2-50538 

A-35-72691 

A-30-71984 

A-2-71320 
A-46-72691 

A-1-83243 
A-8-77170 
A-30-71984 
A-5944507 

A-2-50538 
A-7 1-4407 

A-1-83242 

A-30-71984 

A37-72691 

A-1-82573 
A-49-41321 

A-1-72692 
A-6-44507 



Inden- 
ture 



D 

E 

E 

E 

D 

E 
E 



E 
E 

E 



E 
E 

E 
E 
E 
E 

E 
E 

E 
E 
E 

E 
E 

E 
E 



Description 



PRINTED CIRCUIT BOARD (Refer to 
Figure 5-12-6 for the next higher 
assembly) 

RESISTOR, FIXED, FILM - 825 ohms, 
0.25W 

RESISTOR, FIXED, FILM - 365 ohms, 
0.25W 

RESISTOR, FIXED, FILM - 120 ohms, 
0.25W 

RESISTOR, POTENTIOMETER - 
500 ohms, IW 

CAPACITOR, FIXED - 100 pF, 1 kV 

RESISTOR, FIXED, FILM - 
332 ohms, 0.25W 



Qty 
per 

Ass 'y 



TRANSISTOR 
2N5135 



Replacement type 



CAPACITOR, FIXED - 50 h-H, 15 Vdc 

DIODE - Replacement type 1N746A 

RESISTOR, FIXED, FILM - 68 ohms, 
0,25W 

CAPACITOR, FIXED - 100 pF, 1 kV 
Same as C2 

DIODE - C6F 

RESISTOR, FIXED, FILM - 200 ohms, 
0.25W 

TRANSISTOR - same as Q3 

RELAY - 12 Vdc-T154-2C-12 Vdc 

CAPACITOR, same as C3 

RESISTOR, FIXED, FILM - 510 ohms. 
0.5W 

DIODE - same as CRl 

RESISTOR, FIXED, FILM - 30 ohms, 
0.5W 

TRANSISTOR - Replacement type 2N4248 

CAPACITOR - same as C2 

RESISTOR, FIXED, FILM - 82 ohms, 
0.25W 

DIODE - Replacement type 1N5392 

RESISTOR, FIXED, FILM - 300 ohms, 
2W 

RESISTOR, FIXED, FILM - lOK, 0.25W 

RESISTOR, FIXED. FILM - 1.5K, 
0.5W 



Ref 

1 

1 

1 

1 

6 
1 



1 
2 
1 

Ref 

1 
1 

Ref 

1 
Ref 

1 

Ref 
1 

3 
Ref 

2 

3 

1 



5-46 



Fig. &t 

Index 

No. 



Desig- 
nation 



-27 
-28 

-29 
-30 
-31 

-32 
-33 

-34 

-35 
-36 
-37 

-38 
-39 
-40 



Q4 
R21 

CR5 

Q2 

Rll 

CR3 
R13 

R12 

C5 
Ql 
R8 

Rl 
CI 
R2 



Part No. 



A-1-83243 
A-67-72691 

A-1-82673 
A-1-83243 
A-79-72691 

A-1-82573 
A-19-44507 

A-37-72691 

A-30-71984 
A-1-83242 
A-47 -44507 

A-3-48082 

A-30-71984 

A-3-93416 



Inden- 
ture 



E 
E 

E 
E 
E 

E 
E 



E 
E 
E 

E 
E 
E 



Description 



Oty 

per 

Ass'y 



TRANSISTOR - same as Q3 Ref 

RESISTOR, FIXED, FILM- 1.5K, 1 

0.25W 

DIODE - same as CR4 Ref 

TRANSISTOR - same as Q6 Ref 

RESISTOR, FIXED, FILM - 4.7K. 1 

0.25W 

DIODE - same as CR4 Ref 

RESISTOR, FIXED, FILM - 680 ohms, 1 

0.5W 

RESISTOR, FIXED, FILM - same as Ref 
R16 

CAPACITOR - same as C2 Ref 

TRANSISTOR - same as Q6 Ref 

RESISTOR, FIXED, FILM - 300 ohms 1 

0.5W 

JUMPER No. 22 PVC wire 1 

CAPACITOR - same as C2 Ref 

RESISTOR, POTENTIOMETER - 1 

200 ohms, IW 



5-47 



I 

00 




Figure 5-19. Basic Power Supply Schematic, Acme Model PS-2-59307 




NOTE: SEE CHAPTER 5, PART I, PAGE 5-9- TURN-ON, TURN-OFF SEQUENCING" FOR OPERATION 



REFER PC CARD A- 1 -95726 



vO 



Figure 5-20. Sequencing Circuit Schematic (Printed Circuit Board A- 1-95726) (PC3) 



ADDENDUM 
TYPE 316/716 POWER DISTRIBUTION UNIT 



SECTION 1 
INTRODUCTION 



GENERAL DESCRIPTION 

The Type 316/716 Power Distribution Box is designed to provide 120 Vac one-phase 60 
Hz power to Type 316/716 drawers, ji-PAC option drawers and various peripheral devices 
via standard parallel blade duplex outlets. 

The unit takes two phases of a three-phase system and splits it into tw^o single-phase 
branch circuits, on w^hich are contained five individual fused outlets, 

SPECIFICATIONS 

Electrical Specifications 

Input Voltage. -- The input voltage to the power distribution box is a 208 Vac three-phase 
60 Hz 5 wire service. 

Input Current. -- Loading on the input lines will be from phase to neutral on two-phase only. 
The maximum load current per phase will be 24A, and there is no provision or procedure 
for balancing the load on the phase. The unused phase is terminated at the input connector 
and for possible future expansion. 

Output Voltages and Currents. -- The voltage provided by each output connector is normally 
120 Vac one-phase 60 Hz, and the maximum current that can be obtained from each duplex 
connector is 15A. 

Power On /Off . -- The power distribution box is turned on and off by means of a 120 Vac con- 
trol line from a Type 316/716 power supply or similar source which controls a two-pole 
contact within the box. 



A-1 



Mechanical Specifications 

The dimensions of the power distribution are: 

Length: 16.475 inches 

Width: 19 inches 

Height: 5.22 inches 

The power distribution box consists of the following: 

Sheet metal chassis 

Input converter 

Contacts 

Five output converters 

Five output Edison base fuses 

Input circuit breaker 

Input and output RFI filters. 

The input and output connectors are mounted on the rear of the PD box: the circuit 
breaker and fuses are on the front. The contactor is attached to the inside of the front 
panel, and the RFI filters are located near the right side at the bottom of the box. 



A-2 



SECTION 2 
OPERATING PROCEDURES 



CONTROLS AND INDICATORS 

There are no controls or indicators on the power distribution box. 

OPERATING GUIDES 

For personnel safety, do not replace fuses with the input circuit breaker in the ON 
position. 



A-3 



SECTION 3 
FUNCTIONAL THEORY OF OPERATION 



BLOCK DIAGRAM ANALYSIS 

The block diagram of the power distribution box is shown in Figure A-1. 

The ac input power enters the power distribution box through J8 and passes through 
an RFI filter to the circuit breaker. From there it goes to the contactor and J7 via a fuse. 
When the contactor is energizing by J6, power is provided to Jl through J5 via ISA fuses. 
Jl has an additional RFI filter for load which could generate noise onto the ac line. 



INPUT ON 



J8 



RFI 
FILTER 






CB CONTACTOR 




RFI 



Figure A-1. Power Distribution Unit Block Diagram 



A-5 



SECTION 4 
DETAILED THEORY OF OPERATION 



DETAILED LOGIC DESCRIPTION 

Refer to Figure A-3 for schematics. The power distribution box is designed to take 
two phases of a three-phase input power line and divide into two single-phase branch circuits 
for the operation of any Type 316/716 equipment which requires 120 Vac via a standard 
parallel blade plug. 

J8 brings into the box two phases, neutral and earth ground. Earth ground (pin GR) 
is connected to the box by an integral stud which is also connected to the ground terminals 
of Jl through J7. The neutral line, Rn W, is wired directly to "cold" side of each connec- 
tor (silver colored terminal). The two phases (pins X and Y) are each wired to a pi section 
RFI filter and then to a two -pole community circuit breaker. Thus, if a fault occurs in one 
phase, the other will also be disconnected. The breaker will trip for currents in excess of 
24A. The output of the circuit breaker is wired to a two-pole contactor and one leg is also 
wired to J7 through a 15A fuse. The output of the contactor is wired to the "hot" side of the 
duplex outlet (brass color). When used in a Type 316/716 system, a Type 316/716 power 
supply is plugged into J7 and a cable from the duplex outlet on the Type 316/716 power sup- 
ply is plugged into J6. With the circuit breaker in the ON position, power is applied to J7 
and the switch on the Type 316/716 control panel which is plugged into J7 via the power sup- 
ply. When the switch is turned on, the duplex outlet on the supply energizes the contactor 
through J6 thus applying power to J7 through J5 on the PD box. Conversely, when the 
switch on the control panel is turned off, power is also removed from the outlet on the PD 
box. 

INTERFACE 

Primary Power Interface 

The ac input connector on the power distribution box, J8, mates with a Hubbell Model 
No. 25414 or equivalent. 

Output Power Interface 

Jl through J5 will mate with any parallel blade plug (i.e., Hubbell Cap. 5200 series 
or 5900 series). 

Control Interface 

J7 mates with any parallel blade plug (i.e., Hubbell Caps, 5200 series or 5900 series). 
J6 mates with a Hubbell Model No. 473 0-K twist lock connector or equivalent. 



A-7 



SECTION 5 
INSTALLATION 



PRELIMINARY INFORMATION 

Service personnel should be familiar with the complete installation procedure and 
safety precautions before attempting to install the Type 316/716 power distribution box. 

Tools and Test Equipment 

A medium size screwdriver is all that is required to install the Power Distribution 
Unit. 

Space and Environmental Requirements 

The space and environmental requirements are presented in the Mechanical Specifica- 
tion paragraph. 

INTERFACE CONSIDERATIONS 

Interface considerations are presented in the Electrical Specification. 

INSTALLATION PROCEDURE 

Mechanical Procedure 

Refer to Figure A-2. 

Electrical Interconnections 

Refer to the Site Planning Manual (order no. AD71) for the input ac connection. For 
additional cabling information, refer to Table A-1 (wire list). 

CHECKOUT PROCEDURE 

Initial Checkout 

Before plugging in power, check all fuses. Check that circuit breaker is in the OFF 
position, and check that all plugs to the Type 316/716 power supply are firmly seated in 
their pockets. 



A-9 



Cycle-up Checkout 

Plug in ac connector and operate power switch on control panel. Check for 120Vac 
with ac voltnneter at each duplex output. 

On- Line Checkout 

Connect cables to duplex outlet and apply power via control panel. Check each device 
plugged into box for presence of ac power. 



A-10 



SECTION 6 
MAINTENANCE 



EQUIPMENT CONFIGURATION 

Figure A-2 presents the installation and accessories drawing. 



A-11 



SECTION 7 
TROUB LESHOOTING 



TROUBLESHOOTING PROCEDURES 

The box should be given a good visible inspection for damage to internal parts and 
input and output connectors. 

Recommended Test Equipment 

Ac voltmeter, ac ammeter. 

Check Procedure 

If there is no output at any of the connectors, check the following: 

a. Voltage present at input connector. 

b. Blown 15A fuse of Type 316/716 power supply. 

c. Control panel to Type 316/716 power supply cable not connected. 

d. Loose cables at J6 and J3. 

e. Defective contactor. 

f. Defective circuit breaker. 

If there is no voltage at an individual output connector check 15A fuses on front of 
PD box. 

If individual fuse blows continuously, check for overload or shunt at output connector. 

WIRE LIST 

The wire list is presented in Table A-1. 

Refer to Interface paragraph for interface connections. 



A-I5 





Table A.l. 






PDU Wire List 


Wire Color 


From 


To 


and Gage 


XXAJ8--J0X 


XXA10---01 


BLK #10 


XXAJ8--J0Y 


XXA11---01 




XXAJ8--J0W 


XXAJl— J04 




XXA11---02 


XXB07-CB04 




XXA11---02 


XXB07-CB03 




XXB07-CB01 


XXB08---02 




XXB07-CB02 


XXB08---01 


#10 


XXBF6--F01 


XXB08---02 


BLK #14 


XXB08---08 


XXAJ6--P01 


BLK 


XXB08---07 


XXAJ6--P02 


BLK 


XXBF1--F02 


XXA09---01 


RED 


XXAJ2--J04 


XXAJ7--J01 


BLK 


XXBF2>--F02 


XXAJ2--J02 


RED 


XXBF3--F02 


XXAJ3--J02 


RED 


XXA09---02 


XXAJl --J02 


BLK 


XXBF2--F01 


XXB08- — 05 


BLK 


XXBF3--F01 


XXB08---06 


BLK 


XXBF4--F02 


XXAJ4--J02 


RED 


XXBF4--F01 


XXB08- — 06 


BLK 


XXBF5--F01 


XXB08---06 


BLK 


XXBF5--F02 


XXAJ5--J02 


RED 


XXBF6--F02 


XXAJ7--J02 


BLK #14 


XXAJl— J03 


XXAJ2--J03 


#10 


XXAJ8--J0W 


XXAJ3--J03 


#10 


XXAJ3--J04 


XXAJ4--J04 


#10 


XXAJ4--J03 


XXAJ5--J03 


#14 


XXBF1--F01 


XXB08 05 


BLK #14 


XXAJ8--JGR 


XXA12-GR01 


GRN #10 


XXA12-GR01 


XXAJ01-J05 


#14 


XXAJ01-J05 


XXAJ02-J05 




XXAJ02-J05 


XXAJ03-J05 




XXAJ03-J05 


XXAJ04-J05 




XXAJ04-J05 


XXAJ05-J05 




XXAJ05-J05 


XXAJ07-J03 




XXAJ07-J03 


XXAJ06-J03 


GRN # 1 4 



A-16 



SECTION 8 
REFERENCE DATA 



PD UNIT SCHEMATIC (Figure A-3. ) 



A-17 



I 



A 
A 
A 
A 




V,PHA5E Zj 



§3? 



i 



HONEYWELL 



DR. S. ROTHSCI 



.P A if. yy^ 



ps 



I(TL£ 
POWER DISTRIBUTION 

UNIT SCHEMATIC 



oWC NO. 



7QQ5Q26L6rc 



Figure A-3. Power Distribution Unit Schematic 
(Ref. Drawing C70050266, Rev. C) 



SECTION 9 
ILLUSTRATED PARTS BREAKDOWN 



This section contains illustrated parts lists for the following power distribution unit 
assemblies . 



Table No. Figure No. 

Chassis Assembly A-2 A-4 

Coding Drawing — A-5 



A-19 



Table A-2, 
Chassis Assembly Parts List 
(See Figure A-4) 



Item 


Part Number 


01 


7001954-702 


02 


7001953-701 


03 


70031806-701 


04 


70942407-002 


06 


70960060-013 


07 


70982112-001 


09 


70941163-001 


10 


70941323-001 


11 


04670063-029 


12 


04670062-013 


13 


70901400-009 


15 


70941334-001 


17 


70901005-002 


18 


70902050-012 


19 


70902006-043 


20 


70963027-002 


21 


70902006-042 


22 


70902050-010 


23 


70904113-046 


24 


70960060-102 


27 


70032069-702 


28 


70902003-032 


30 


70032183-000 


31 


70982128-003 


32 


70982131-001 


33 


70906164-001 


34 


70901003-006 


35 


70908052-131 


36 


04310020-015 


37 


70032761-702 


38 


03510051-003 


39 


70908035-004 


40 


70937506-005 


43 


70031997-702 


44 


70033072-000 


45 


70033073-000 


46 


70982006-005 



Qty 

Description 702 

CHASSIS, DET/ASSY 001 

PANEL, FRONT DET/ASSY 001 

COVER, PDU DET/ASSY 001 

LINE FILTER 003 

CIRCUIT BREAKER, CB 1 001 

PLATE, IDENT 001 

CONNECTOR, RECEPTACLE, ELECT, J7 001 

CONNECTOR, RECEPTACLE, ELEC, Jl -J5 005 

FUSE-FUSTAT F1-F6 006 

FUSE-HOLDER-FUSTAT 006 

NUT, SHEET SPRING 010 

CONNECTOR, RECEPTACLE, J6 001 

NUT, #10-32 007 

WASHER, FLAT, #10 007 

WASHER, LOCK, #10 007 

RELAY, SOLENOID, Kl 001 

WASHER, LK, #8-32 016 

WASHER, FLAT, #8-32 016 

SCREW, #8-32 006 

CIRCUIT BREAKER, MTG BRKT 001 

GROUND STRAP 001 

WASHER, EXT, TOOTH #10 007 

ONE -LINE DIAGRAM 001 

PLATE, IDENT 001 

PLATE, IDENT 001 

CLAMP, CAP 003 

HEX, NUT, 8-32 006 

SPACER 001 

CAP 003 

CABLE, POWER OOI 

CLAMP, CABLE 001 

CLIP, ELECT 001 

BOARD, TERM 001 

WIRE LIST 001 

SCHEMATIC PDV REF 

CODING, DWG REF 

PLATE, DESIG 001 



A-20 



USERS' REMARKS FORM 



''"'''"'-E: DOC. PART NO.. 

DATED. 



ERRORS NOTED: 



f-old 



SUGGESTIONS FOR IMPROVEMENT: 



Fold 



DATE- 
FROM: NAMF 



COMPANY__ M/S- 

TITLE__ 



ADDRESS 

_ZIP- 



HONEYWELL INFORMATION SYSTEMS INC. 

CEOB 

300 CONCORD ROAD 

BILLERICA, MA. 01821 

ATTN: CEOB PUBLICATIONS, MS 872 -A 



Honeywell